JPH0241903B2 - - Google Patents

Info

Publication number
JPH0241903B2
JPH0241903B2 JP58141194A JP14119483A JPH0241903B2 JP H0241903 B2 JPH0241903 B2 JP H0241903B2 JP 58141194 A JP58141194 A JP 58141194A JP 14119483 A JP14119483 A JP 14119483A JP H0241903 B2 JPH0241903 B2 JP H0241903B2
Authority
JP
Japan
Prior art keywords
pressure
semiconductor element
oil
sealed
external
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58141194A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6032332A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP58141194A priority Critical patent/JPS6032332A/ja
Publication of JPS6032332A publication Critical patent/JPS6032332A/ja
Publication of JPH0241903B2 publication Critical patent/JPH0241903B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W72/073—
    • H10W72/07337—

Landscapes

  • Die Bonding (AREA)
JP58141194A 1983-08-03 1983-08-03 油封均圧形半導体装置 Granted JPS6032332A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58141194A JPS6032332A (ja) 1983-08-03 1983-08-03 油封均圧形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58141194A JPS6032332A (ja) 1983-08-03 1983-08-03 油封均圧形半導体装置

Publications (2)

Publication Number Publication Date
JPS6032332A JPS6032332A (ja) 1985-02-19
JPH0241903B2 true JPH0241903B2 (enExample) 1990-09-19

Family

ID=15286341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58141194A Granted JPS6032332A (ja) 1983-08-03 1983-08-03 油封均圧形半導体装置

Country Status (1)

Country Link
JP (1) JPS6032332A (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3831067A (en) * 1972-05-15 1974-08-20 Int Rectifier Corp Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring
JPS5621352A (en) * 1979-07-28 1981-02-27 Mitsubishi Electric Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS6032332A (ja) 1985-02-19

Similar Documents

Publication Publication Date Title
US9070516B2 (en) Electric double-layer capacitor
US3663306A (en) High pressure resistant compact housing structure
US2744217A (en) Electrical apparatus
JPWO2005038837A1 (ja) 電気二重層キャパシタ
JPH0241903B2 (enExample)
CN107611248B (zh) 用于封装热电模块的方法
JPS6032330A (ja) 油封均圧形半導体装置
JPS62136757A (ja) 電池カバ−組立体
CN115406577B (zh) 一种mems压力传感器封装结构及其制备方法
JPS6032331A (ja) 油封均圧形半導体装置
IL38039A (en) A cell with a solid electrolyte and a packaging container for it
JP2778144B2 (ja) 車両用減衰力検出器
JP3336718B2 (ja) 高圧コンデンサの製造方法と高圧コンデンサ
US3382107A (en) Sealing device for an electrochemical cell
JPH0218920Y2 (enExample)
JPH0145119Y2 (enExample)
KR101804365B1 (ko) 전동기
JPH0132678Y2 (enExample)
US3705411A (en) Shock and thermal isolation package for thermionic battery
JPS6131619B2 (enExample)
JPH08330145A (ja) 電気機器用ブッシング及びその製造方法
JP3126150B2 (ja) アルミ電解コンデンサ
JP2533396Y2 (ja) 電解コンデンサ
JPH0365107B2 (enExample)
JP2962063B2 (ja) 電歪効果素子