JPH0241877B2 - - Google Patents
Info
- Publication number
- JPH0241877B2 JPH0241877B2 JP11247681A JP11247681A JPH0241877B2 JP H0241877 B2 JPH0241877 B2 JP H0241877B2 JP 11247681 A JP11247681 A JP 11247681A JP 11247681 A JP11247681 A JP 11247681A JP H0241877 B2 JPH0241877 B2 JP H0241877B2
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- adhesive
- constant temperature
- powder particles
- temperature heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Surface Heating Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11247681A JPS5814483A (ja) | 1981-07-17 | 1981-07-17 | 定温発熱体の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11247681A JPS5814483A (ja) | 1981-07-17 | 1981-07-17 | 定温発熱体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5814483A JPS5814483A (ja) | 1983-01-27 |
JPH0241877B2 true JPH0241877B2 (en:Method) | 1990-09-19 |
Family
ID=14587584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11247681A Granted JPS5814483A (ja) | 1981-07-17 | 1981-07-17 | 定温発熱体の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5814483A (en:Method) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101714359B (zh) * | 2008-10-03 | 2012-05-02 | 日本发条株式会社 | 头悬架及制造头悬架的方法 |
-
1981
- 1981-07-17 JP JP11247681A patent/JPS5814483A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5814483A (ja) | 1983-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW434758B (en) | Resin film and method for connecting electronic parts by using resin film | |
JP5424984B2 (ja) | 半導体モジュールの製造方法 | |
FR2480488A1 (fr) | Liant thermiquement conducteur et isolant electriquement pour composants electriques et electroniques, et son procede de fabrication | |
JP2003174127A (ja) | 異方性伝熱シートおよびその製造方法 | |
JP4085330B2 (ja) | 低温コンポーネントと一体化した厚膜ヒータおよびその製造方法 | |
JPH07147183A (ja) | 面状発熱体およびその製造方法 | |
JPH0241877B2 (en:Method) | ||
JP3850956B2 (ja) | 放熱性炭素複合板 | |
CN111566761B (zh) | 热敏电阻元件及其制造方法 | |
US2896135A (en) | Insulating material | |
JPH1145616A (ja) | 導電性フィラー、導電性ペーストおよび回路体の形成方法 | |
CN115698379A (zh) | 金属包覆树脂粒子及其制造方法、包含金属包覆树脂粒子的导电性膏以及导电性膜 | |
JP3246229B2 (ja) | チップ状電子部品およびその製造方法 | |
JPS62285391A (ja) | 面状発熱体 | |
JPH05198403A (ja) | 有機質正特性サーミスタ | |
JPS605598A (ja) | 高熱伝導性金属ベ−スプリント基板の製造方法 | |
TW200411889A (en) | High-frequency substrate | |
JPS6182609A (ja) | 弾性通電素子 | |
JPS61251003A (ja) | Ptc素子 | |
JPH05326113A (ja) | Ptcヒータ | |
EP0030641A2 (en) | Insulating coating for ceramic substrate and method to form such a coating | |
JPH04115483A (ja) | 面状発熱体の製造方法 | |
JPH057803B2 (en:Method) | ||
WO1998026433A1 (fr) | Element de circuit de protection contre les surintensites | |
JPS60202613A (ja) | 静電粉体塗装法による絶縁電線の製造方法 |