JPH0241656Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to an improvement in a dot matrix light-emitting display constructed using a semiconductor chip such as a light-emitting diode as a light-emitting element.

Prior Art This type of dot matrix light-emitting display is one in which arbitrary characters, symbols, and patterns can be displayed as a dot pattern by energizing any of the light-emitting elements arranged in a matrix and lighting them. It is.

In order to improve the visibility of the light emitting parts in such a matrix display, a mask plate with through holes formed in areas corresponding to the light emitting elements arranged on the substrate is bonded directly onto the substrate and integrated. It is conceivable that the

However, when considering the method for manufacturing a matrix display, the above method has the following problems.

That is, when a liquid thermosetting resin is injected into the through hole of the mask plate to seal the light emitting element, the shrinkage force generated during thermosetting of the sealed resin directly affects the mask plate, causing the mask plate to Warpage, distortion, cracks, etc. (hereinafter referred to as defects such as warpage) occur, making it easy to produce defective products.

Therefore, it is conceivable to fix the mask plate onto the substrate by a method other than adhesion, but such a method requires a separate means for fixing the mask plate, making manufacturing work difficult.

Problems to be Solved by the Invention The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a dot matrix light-emitting display that is less prone to defects such as warping during manufacturing and can simplify manufacturing operations. It is an object.

Specific Means for Solving the Problems The above object is achieved by the dot matrix light-emitting display of the present invention, which has the following structural features.

That is, in this invention, a mask plate in which through holes are formed corresponding to each of these light emitting elements is placed on a substrate on which light emitting elements are arranged, and each of the through holes is further filled with a curable sealant. In a dot matrix light-emitting display in which a sealing film is formed on each of the light-emitting elements by injecting a resin, the shrinkage force when the sealing resin is cured is relaxed at least between the mask plate and the sealing part. It is characterized by providing a separation layer made of a flexible resin material.

Effects and Effects of the Invention According to the invention, a separation layer is provided between the sealing resin that seals the light-emitting element and the mask plate to relieve the shrinkage force caused by the flexible resin material. The contraction force generated during curing of the resin can be relaxed and absorbed by this separation layer. Therefore, the shrinkage force generated when the sealing resin hardens does not affect the mask plate and cause defects such as warping, so the mask plate can be used without any selection of material.

Further, according to the present invention, since the separation layer that has the above-mentioned effect is provided, there is no need to provide a separate means for fixing the mask plate and the display substrate, and the mask plate, the substrate, and the separation layer can be fixed together. Since it can be integrally bonded and formed, manufacturing work can be simplified.

In addition, by integrally bonding the mask plate, substrate, and separation layer, the light-emitting element is completely hermetically sealed, and the light-emitting element is not affected by the external environment, which increases the lifespan of the light-emitting display. can be improved.

Embodiments of the invention Examples of the invention will be described below with reference to the accompanying drawings.

FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is an enlarged view of a light emitting section.

In the figure, 1 is a display substrate, and 2 is a mask plate.

The display substrate 1 has light-emitting parts A provided with light-emitting elements 3 (LED semiconductor chips) arranged in a matrix (8×8 in the example), and each light-emitting element 3 is arranged on the substrate 1. A conductive part 1c is connected to a lower electrode pattern 1b provided on the lower surface of the insulating plate 10 through a through hole 1d, and is attached with silver paste or the like, and the upper part of the light emitting element 3 is connected to the lower electrode pattern 1b through a bonding wire 7. and is connected to an upper electrode pattern 1a provided on the upper surface of the insulating plate 10. Such a light emitting element 3 is lit by passing a current between the upper electrode pattern 1a and the lower electrode pattern 1b.

On the other hand, reference numeral 4 denotes a separation layer constituting the main part of the present invention, which is made of a flexible resin material and has a shape corresponding to the inner circumference of the through hole 6 of the mask plate 2. The flexible resin material is appropriately selected from, for example, silicone rubber, neoprene rubber, urethane rubber, flexible epoxy resin, and the like.

The separation layer 4 is bonded 8 to the inner circumferential surface of the through hole 6 formed in the mask plate 2 with an adhesive or the like, and inside the separation layer 4 there is a transparent hardening material. A resin (for example, a thermosetting resin or an ultraviolet curable resin) 5 (liquid) is injected and cured by heating or ultraviolet irradiation to form a sealing film for the light emitting element 3. Here, the light-transmitting curable resin 5 injected into the light-transmitting layer 6 to seal the light-emitting element 3 is placed in the separation layer 4 so that the separation layer 4 absorbs the shrinkage force generated during curing. It is necessary that the separation layer 4 is injected below the upper end surface of the separation layer 4, and the thickness of the separation layer 4 is preferably 0.3 mm or more in order to effectively absorb and absorb the contraction force.

Note that the separation layer provided in the through hole 6 of the mask plate 2 may be formed in a circular frame 41 as shown in FIG.

5 and 6 show other examples of the separation layer, in which a recess 21 is provided inside the through hole 6 of the mask plate 2, and a recess 21 is formed in the recess 21 from a flexible resin material. Separation layers 42 and 43 are inserted and bonded 8. In such an embodiment, the separation layers 42 and 43 are not visible from the outer surface of the mask plate 2, and the mask plate 2
It has the advantage of simplifying and improving the appearance.

FIG. 7 is still another example included in the present invention,
A part of the flexible sheet 40 interposed between the mask plate 2 and the substrate 1 (a separation layer 44 is formed with a part 5 corresponding to the through hole of the mask plate). In this case, a separation layer 4 is provided on the substrate 1.
4, and the mask plate 2 is formed on top of the flexible sheet material 40, which simplifies the work during manufacturing.
The flexible sheet 40 interposed between the mask plate 2 and the substrate 1 has the advantage of absorbing and relaxing the expansion and contraction force based on the difference in thermal expansion characteristics between the two, thereby effectively preventing the occurrence of warping and distortion.

Further, FIG. 8 shows a through-hole section 40 of a flexible sheet 40' in which through-holes corresponding to the through-holes 6 of the mask plate 2 are formed.
This figure shows a separation layer formed with the inner peripheral surface of a'.

In such a product, it is important that the sealing resin 5 does not exceed the thickness of the through hole 40a' of the flexible sheet 40', and the complete laminate structure is different from that shown in FIG. Therefore, manufacturing can be further simplified,
Moreover, it has almost the same effect as the one in FIG.

In any of the embodiments described above, it is desirable to form a white or silver reflective surface on the inner surface of the separation layer, that is, on the side facing the light emitting element, to improve light reflection efficiency. A specific example of such is
This can be easily done by applying white or silver paint.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention;
FIG. 2 is an enlarged view of the light emitting section, and FIGS. 3 to 8 are enlarged vertical cross-sectional views of the light emitting section in various embodiments of the present invention. Explanation of symbols: In the figures, 1...matrix substrate, 2...mask plate, 3...light emitter element, 4,4
1, 42, 43, 44, 40'... Separation layer formed of a flexible resin material, 5... Curable sealing resin, 6... Through hole of mask plate.

Claims (1)

[Claims for Utility Model Registration] A mask plate in which through holes are formed corresponding to each of the light emitting elements is arranged on a substrate on which light emitting elements are arranged, and each of the through holes is further provided with a curable material. In a dot matrix light-emitting display in which a sealing layer is formed on each of the light-emitting elements by injecting a sealing resin, there is a gap between at least the mask plate and the sealing layer portion when the sealing resin hardens. A dot matrix light-emitting display characterized by having a separation layer made of a flexible resin material that relieves force.