JPH0416466Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an improvement of a dot matrix light-emitting display.

[Background technology and its problems]

For example, to explain the conventional dot matrix light emitting display previously proposed by the present applicant, this device has a plurality of parallel electrode pattern stripes on the top and bottom surfaces of a glass epoxy board, paper phenol board, etc. as a display substrate. On these boards,
A plurality of electrode pattern stripes are formed on the bottom surface so as to cross each other, and the electrode pattern strips are equipped with LEDs.
Chips are arranged and wired using bonding wires and the like.

For example, the electrodes formed on the top surface of the substrate are X electrode pattern stripes, the electrodes formed on the bottom surface of the substrate are Y electrode pattern stripes, and the Y electrode pattern strips are formed into through holes that penetrate the substrate upward and downward. Therefore, it is connected to the conductive portion of each Y electrode pattern strip formed on the upper surface of the substrate. For this reason, it is necessary to drill a large number of through holes in the substrate and apply conductive plating to the through holes, and it goes without saying that this work is troublesome.

For example, in a 16 x 16 dot type, about 200 through holes are formed.
Moreover, in a board with such through holes, a light-transmitting sealing resin (liquid thermosetting resin) is filled through the hole in the mask plate that overlaps the top surface of the board to form a sealing layer for the light emitting part. There is a problem with resin leaking from the through hole when forming (hermetically sealing the wiring part of the LED chip), so it is necessary to take a leak-proof treatment to prevent the liquid sealing resin from leaking. There is. For example, when filling a liquid sealing resin (epoxy resin, etc.), adhesive paper is attached to the bottom side of the substrate to close the bottom opening of the through hole, and this is removed after the filling hardens.

However, this method is time-consuming and
This not only increases manufacturing costs, but also causes leakage from the through-holes due to misalignment of the through-holes in the mask plate, and in the case of substrates with small dot pitches, leakage may occur through the gaps between the mask plate and the top surface of the substrate and into the through-holes. This makes production even more difficult.

[Purpose of invention]

The present invention has been made in view of the above-mentioned problems, and aims to provide a dot matrix light-emitting display that does not require the formation of through holes in the substrate and can be manufactured simply and at low cost.

[Means for solving problems]

This invention is based on a substrate with an electrode pattern formed on it.
A large number of light emitting parts each having LED chips arranged and wired thereon are arranged in a dot shape, and a mask plate is superimposed on the substrate while through holes are bored at the positions corresponding to the light emitting parts, and the through holes of this mask plate are used for sealing. In a dot matrix light-emitting display formed by filling a sealing resin to form a sealing layer of a light emitting part, the substrate is combined with an upper substrate on which a plurality of electrode pattern strips are arranged in parallel, and a plurality of electrode pattern strips are arranged in parallel with each other. It is characterized in that it is formed separately on the lower layer substrate which is arranged in parallel so as to intersect with the electrode pattern strip on the upper layer substrate side, and the electrode pattern strip on the upper layer substrate is formed with a through hole corresponding to the light emitting part. .

In the present invention, an LED chip is attached to an upper substrate or a lower substrate to form a light emitting part.

〔Example〕

One embodiment will be described below with reference to the attached drawings. Fig. 1 is a vertical cross-sectional structural diagram of the light emitting part in the light emitting display of the present invention, and Fig. 2 is a plan view thereof, in which the light emitting part is seen from above. 3 and 3 are exploded perspective views of the present invention (the mask plate is omitted in FIGS. 2 and 3 for the sake of explanation).

In the figure, 1 is the upper layer substrate, 2 is the lower layer substrate,
These substrates 1 and 2 are made of a paper phenol base material, a glass epoxy base material, a ceramic base material, etc., but the upper layer substrate 1 has a thickness that is smaller than that of the lower layer substrate (usually 1.6 to 1.8 mm). It is formed thinly. For example, it can be formed to about 0.4 to 1.2 mm.

Electrode pattern strips 11 formed on substrates 1 and 2...
..., 21... are formed by an etching method, a thick film printing and firing method, etc., and the simplest and cheapest method is to use a single-sided copper-clad laminate with a paper phenol base material, which is patterned by an etching process, etc. .
On the surface of the upper layer substrate 1, for example, a plurality of X electrode pattern stripes 11... are arranged in parallel, and on the surface of the lower layer substrate 2, a plurality of Y electrode pattern stripes 21... are formed. Then, the electrode pattern strip 11 of the upper layer substrate 1...
The light emitting part B should have a through hole 12... in the appropriate place.
(Light-emitting dots) are provided according to the number of dots.

In the example shown, it is 8×8 dots, so
Eight through holes 12 are formed in each of the electrode pattern lines X1 to X8, but as with the number of electrode pattern lines, any number can be adopted. The number will be accordingly.

FIG. 1a is a vertical cross-sectional structural view of a light emitting part corresponding to FIG. 1 of another example of the present invention, in which an LED chip 3 is provided on the upper layer substrate 1 side and bonded to an electrode pattern strip 21 on the upper surface of the lower layer substrate 2. Wiring with wire 4 is shown. Note that the through hole 12 formed in the upper layer substrate 1 is not limited to that shown in the above embodiment, and may have any size and shape as long as it allows the arrangement and wiring of the LED chip 3. Of course, this is true.

In addition, in the example shown in FIG. 2, each electrode pattern strip 11... is formed with a single insulating section 13 in the center, so that one electrode pattern strip 1...
1... is separated into two electrode pattern parts 11a and 11b, so the light emitting part B has two parts that emit light of different colors.
Arrange and wire two LEDs 3, 3, and each LED
Bonding wires 4, 4 drawn out from the chips 3, 3 are connected to each separated electrode pattern portion 11a, 11b as shown in the figure. When a driving method as shown in FIG. 6 is adopted, a two-color lighting display is possible. However, the present invention is not limited to such an example, and as shown in FIG.
It may be configured by omitting . In this case, the number of LED chips 3 is not limited to one as shown in the example, but can be any number as appropriate;
A driving method as shown in the figure can be adopted. The light-emitting display body A is formed by polymerizing the upper layer substrate 1 and the lower layer substrate 2 having the above-mentioned configuration, and then polymerizing the mask plate 5 on the upper surface thereof. The mask plate 5 has through holes 5 corresponding to the light emitting parts.
1... are provided, and are aligned with through holes 12... formed in the upper layer substrate 1, as shown in FIG. 4, during polymerization. This mask plate 5 is provided for the purpose of preventing light leakage to adjacent light emitting parts, enlarging the apparent dimensions of the light emitting dots, clarifying the outline of the light emitting parts, and improving visibility by improving the viewing angle. .

Further, when the upper layer substrate 1 and the lower layer substrate 2 are superposed, the electrode pattern strips 11 . . . , 21 .

The LED chips 3 are arranged on the upper surface of the electrode pattern strips 21 of the lower substrate 2 exposed through the through holes 12 of the electrode pattern strips 11 of the upper substrate 1. Attach them with silver paste or the like, pull out the bonding wires 4, 4 from the upper surface of each of the LED chips 3, 3, and connect the other ends of the drawn bonding wires 4, 4 to the upper layer board 1.
Electrode pattern strip 11 of... Electrode pattern section 11 of...
a and 11b, respectively (see Figure 2).

In this case, the arrangement of the LED chip 3 and the electrode pattern portion to which the bonding wire 4 is bonded are as follows:
In order to improve the bonding strength and bonding reliability between the LED chip and the wire, it is preferable to apply noble metal plating (gold, silver, etc.) as necessary.

Further, the display substrate 1 formed in this way
The mask plate 5 attached to the top surface of 0 is made of a flexible resin molded material such as silicone rubber or neoprene rubber, which absorbs and relieves the curing shrinkage force generated when the liquid sealing resin epoxy resin 6 is heated and cured. It is particularly effective as the substrate size becomes larger (50 mm or more on a side). On the other hand, if the upper layer substrate 1 is made thinner, it becomes easier to work with the bonding wires 4 when arranging and wiring the LED chips 3, and there is an advantage that the bonding wires 4 can be made shorter.

For the upper layer substrate 1, a film made of polyester, polyimide, etc. with a thickness of 10μ to 100μ can be used instead of the paper phenol base material, glass epoxy base material, or ceramic base material. It can be made even thinner.

In general, the upper layer substrate 1 is preferably made of a flexible material in order to alleviate the shrinkage force when the sealing resin 6 that is filled to protect the light emitting section B hardens and shrinks. Almost the same effect can be expected even if the material is not made of a synthetic material. With such a display, a light-emitting display member can be made thin and less likely to cause warping, distortion, or cracks.

5 and 6 illustrate an example of lighting and driving the light-emitting display body A using the dynamically driven lighting control device 7. In the case shown in FIG. 5, each light-emitting unit B lights up in a single color. (See Fig. 2a), and Fig. 6 shows one in which each light emitting section B can emit two colors (see Fig. 2). In particular, in the latter case, each light emitting section B has two series of different luminescent colors.
Since the LED chips 3, 3 are provided, by selecting the energization mode, it is possible to display lighting in three colors including an additive color mixing method.

A specific embodiment of the present invention includes a dot size of 2 mm to 3 mm and a dot pitch of 3 mm to 4 mm.

[Effect of idea]

According to the present invention, since no through holes are provided in the substrate, there is no need to form through holes. Further, since there is no through hole, there is no problem of sealing resin leaking during the sealing operation, and no extra effort is required, so that a light-emitting display with low manufacturing cost can be obtained. Furthermore, since there are no through holes, the dot pitch (the interval between the light emitting parts) can be reduced, and there are advantages such as the ability to form more light emitting dots within the same area.

[Brief explanation of the drawing]

Fig. 1 is a vertical cross-sectional structural diagram of a light emitting part in one embodiment of the present invention, Fig. 1a is a longitudinal cross-sectional structural diagram of a light emitting part in another example, Fig. 2 is a plan view of the light emitting part, and Fig. 2a is another example. 3 is an exploded perspective view of the light emitting display of the present invention, FIG. 4 is an assembled view of the light emitting display of the present invention, and FIGS. 5 and 6 are driving methods of the light emitting display. FIG. Explanation of symbols, A... Light emitting display body, B... Light emitting section, 5... Upper layer substrate, 2... Lower layer substrate, 10...
Display substrate, 11... Electrode pattern strip (upper layer substrate), 12... Through hole formed in the electrode pattern strip,
21... Electrode pattern strip (lower substrate), 3...
LED chip, 4... Bonding wire, 5...
...Mask plate, 51...its through hole.

Claims (1)

[Scope of Claim for Utility Model Registration] A large number of light emitting parts arranged in a dot shape with LED chips arranged and wired on a substrate on which an electrode pattern is formed,
A dot matrix formed by superposing a mask plate with a through hole in a position corresponding to the light emitting part on the substrate, and filling a sealing resin through the hole in the mask plate to form a sealing layer for the light emitting part. In the light emitting display, the substrate includes an upper layer substrate on which a plurality of electrode pattern stripes are arranged in parallel, and a lower layer substrate on which a plurality of electrode pattern stripes are arranged in parallel so as to intersect with the electrode pattern strips on the upper layer substrate side. What is claimed is: 1. A dot matrix light-emitting display, characterized in that the electrode pattern strips of the upper substrate are formed with through holes corresponding to the light-emitting parts.