JPH0241455U - - Google Patents
Info
- Publication number
- JPH0241455U JPH0241455U JP12075688U JP12075688U JPH0241455U JP H0241455 U JPH0241455 U JP H0241455U JP 12075688 U JP12075688 U JP 12075688U JP 12075688 U JP12075688 U JP 12075688U JP H0241455 U JPH0241455 U JP H0241455U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- footprint
- adhesion
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例である。
図において、１は表面実装型部品、２は部品パ
ツケージ、３はタブ、４は端子リード、５は接着
材、９は印刷配線板、２１は底面、９１はフツト
プリント、である。
FIG. 1 shows an embodiment of the present invention. In the figure, 1 is a surface-mounted component, 2 is a component package, 3 is a tab, 4 is a terminal lead, 5 is an adhesive, 9 is a printed wiring board, 21 is a bottom surface, and 91 is a foot print.
Claims (1)
、各端子リード４をフツトプリント９１に載置、
仮固定させるのに、部品パツケージ２の該印刷配
線板９に対する底面２１に、該印刷配線板９に接
着させるための、該底面２１と平行に折曲形状の
タブ３を設けたことを特徴とする表面実装型部品
。 When mounting the surface mount type component 1 on the printed wiring board 9, each terminal lead 4 is placed on the footprint 91,
For temporary fixing, a bent tab 3 is provided on the bottom surface 21 of the component package 2 relative to the printed wiring board 9 in parallel with the bottom surface 21 for adhesion to the printed wiring board 9. surface-mounted components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12075688U JPH0241455U (en) | 1988-09-14 | 1988-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12075688U JPH0241455U (en) | 1988-09-14 | 1988-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241455U true JPH0241455U (en) | 1990-03-22 |
Family
ID=31367149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12075688U Pending JPH0241455U (en) | 1988-09-14 | 1988-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241455U (en) |
-
1988
- 1988-09-14 JP JP12075688U patent/JPH0241455U/ja active Pending
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