JPH0241448U - - Google Patents

Info

Publication number
JPH0241448U
JPH0241448U JP11942588U JP11942588U JPH0241448U JP H0241448 U JPH0241448 U JP H0241448U JP 11942588 U JP11942588 U JP 11942588U JP 11942588 U JP11942588 U JP 11942588U JP H0241448 U JPH0241448 U JP H0241448U
Authority
JP
Japan
Prior art keywords
sealing material
circuit board
drive circuit
sealed
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11942588U
Other languages
English (en)
Other versions
JPH0621249Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11942588U priority Critical patent/JPH0621249Y2/ja
Publication of JPH0241448U publication Critical patent/JPH0241448U/ja
Application granted granted Critical
Publication of JPH0621249Y2 publication Critical patent/JPH0621249Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例の封止構造を示す断面説
明図、第２図は他の実施例を示す封止構造の断面
説明図、第３図は従来のイメージセンサを示す平
面説明図、第４図は従来のイメージセンサを示す
断面説明図である。 １１…ガラス基板、１２…センサ部、１３…駆
動回路基板、１４…ＩＣ、３１…支持板、１００
，３００…第１の封止材、２００…第２の封止材
。

Claims (1)

  1. 【実用新案登録請求の範囲】 デバイス部を有する基板と、該デバイス部を駆
    動するＩＣを実装した駆動回路基板とを支持板上
    に設置し、前記ＩＣ及びＩＣのボンデイングエリ
    アを封止する電子部品の封止構造において、 高温で硬化する第１の封止材で前記ＩＣの表面
    部を含む駆動回路基板側を封止するとともに、前
    記基板と駆動回路基板との間のボンデイングエリ
    アを含むように第２の封止材で封止し、この第２
    の封止材は前記第１の封止材よりも低温で硬化す
    ることを特徴とする電子部品の封止構造。
JP11942588U 1988-09-12 1988-09-12 電子部品の封止構造 Expired - Lifetime JPH0621249Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11942588U JPH0621249Y2 (ja) 1988-09-12 1988-09-12 電子部品の封止構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11942588U JPH0621249Y2 (ja) 1988-09-12 1988-09-12 電子部品の封止構造

Publications (2)

Publication Number Publication Date
JPH0241448U true JPH0241448U (ja) 1990-03-22
JPH0621249Y2 JPH0621249Y2 (ja) 1994-06-01

Family

ID=31364644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11942588U Expired - Lifetime JPH0621249Y2 (ja) 1988-09-12 1988-09-12 電子部品の封止構造

Country Status (1)

Country Link
JP (1) JPH0621249Y2 (ja)

Also Published As

Publication number Publication date
JPH0621249Y2 (ja) 1994-06-01

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