JPH0241446U - - Google Patents
Info
- Publication number
- JPH0241446U JPH0241446U JP1988120506U JP12050688U JPH0241446U JP H0241446 U JPH0241446 U JP H0241446U JP 1988120506 U JP1988120506 U JP 1988120506U JP 12050688 U JP12050688 U JP 12050688U JP H0241446 U JPH0241446 U JP H0241446U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- sealed
- lead frame
- frame assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988120506U JPH0241446U (enExample) | 1988-09-14 | 1988-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988120506U JPH0241446U (enExample) | 1988-09-14 | 1988-09-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0241446U true JPH0241446U (enExample) | 1990-03-22 |
Family
ID=31366677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988120506U Pending JPH0241446U (enExample) | 1988-09-14 | 1988-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241446U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6132434A (ja) * | 1984-07-24 | 1986-02-15 | Sanken Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |
-
1988
- 1988-09-14 JP JP1988120506U patent/JPH0241446U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6132434A (ja) * | 1984-07-24 | 1986-02-15 | Sanken Electric Co Ltd | 樹脂封止型半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |