JPH0241353A - 半導体封止用樹脂組成物 - Google Patents

半導体封止用樹脂組成物

Info

Publication number
JPH0241353A
JPH0241353A JP19071088A JP19071088A JPH0241353A JP H0241353 A JPH0241353 A JP H0241353A JP 19071088 A JP19071088 A JP 19071088A JP 19071088 A JP19071088 A JP 19071088A JP H0241353 A JPH0241353 A JP H0241353A
Authority
JP
Japan
Prior art keywords
resin
polymer
epoxy resin
vinyl
silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19071088A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0588887B2 (enrdf_load_stackoverflow
Inventor
Koichi Machida
町田　貢一
Mikio Kitahara
北原　幹夫
Takayuki Kubo
久保　隆幸
Motoyuki Torikai
基之 鳥飼
Kotaro Asahina
浩太郎 朝比奈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP19071088A priority Critical patent/JPH0241353A/ja
Publication of JPH0241353A publication Critical patent/JPH0241353A/ja
Publication of JPH0588887B2 publication Critical patent/JPH0588887B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
JP19071088A 1988-08-01 1988-08-01 半導体封止用樹脂組成物 Granted JPH0241353A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19071088A JPH0241353A (ja) 1988-08-01 1988-08-01 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19071088A JPH0241353A (ja) 1988-08-01 1988-08-01 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPH0241353A true JPH0241353A (ja) 1990-02-09
JPH0588887B2 JPH0588887B2 (enrdf_load_stackoverflow) 1993-12-24

Family

ID=16262547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19071088A Granted JPH0241353A (ja) 1988-08-01 1988-08-01 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPH0241353A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872194A (en) * 1996-07-08 1999-02-16 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part
JP2008201932A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
WO2014103162A1 (ja) 2012-12-25 2014-07-03 パナソニック 株式会社 バリカンの刃、及びバリカンの刃を備えたバリカン

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8504807B2 (en) 2009-12-26 2013-08-06 Intel Corporation Rotate instructions that complete execution without reading carry flag

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872194A (en) * 1996-07-08 1999-02-16 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part
JP2008201932A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
WO2014103162A1 (ja) 2012-12-25 2014-07-03 パナソニック 株式会社 バリカンの刃、及びバリカンの刃を備えたバリカン

Also Published As

Publication number Publication date
JPH0588887B2 (enrdf_load_stackoverflow) 1993-12-24

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