JPH023999A - Method of providing terminal in device package - Google Patents
Method of providing terminal in device packageInfo
- Publication number
- JPH023999A JPH023999A JP15310588A JP15310588A JPH023999A JP H023999 A JPH023999 A JP H023999A JP 15310588 A JP15310588 A JP 15310588A JP 15310588 A JP15310588 A JP 15310588A JP H023999 A JPH023999 A JP H023999A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- plated
- package
- circle
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 abstract description 9
- 238000005553 drilling Methods 0.000 abstract description 9
- 238000007747 plating Methods 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はリードレス フラットパッケージ等のデバイス
パッケージに端子を作製する方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for fabricating terminals on device packages such as leadless flat packages.
従来の技術とその問題点
デバイスパッケージに端子を施す通常の従来法は、パッ
ケージの端面に、はんだ濡れ性のよい導体を設置し、該
導体を端子に充当するという仕様である。この従来法は
、パッケージ端面に対する配線が至極困難な問題がある
。Prior Art and Its Problems The usual conventional method for attaching terminals to device packages is to place a conductor with good solder wettability on the end face of the package, and use the conductor as a terminal. This conventional method has a problem in that wiring to the end face of the package is extremely difficult.
改良された従来法としては、パッケージの端部にめっき
スルーホールを設け、このめっきスルーホール部の一部
をジャリングにより欠円状に除去し、そこに残るめっき
スルーホールを端子とするものや、パッケージの端面に
導体層を形成し、該パッケージ端面に相互に絶縁独立す
る端子が残るよう、該導体層を切断により部分的に除去
する様式がある。これ等の従来法は、前記めっきスルー
ホールや導体層の切断時、めっき金属や導体層の一部が
割れたり、折れ曲ったり、脱落したりする問題がある。An improved conventional method is to provide a plated through hole at the end of the package, remove a portion of the plated through hole into an elliptical shape by jarring, and use the remaining plated through hole as a terminal. There is a method in which a conductor layer is formed on the end surface of the package, and the conductor layer is partially removed by cutting so that mutually insulated and independent terminals remain on the end surface of the package. These conventional methods have a problem in that when the plated through-hole or conductor layer is cut, a part of the plated metal or conductor layer may crack, bend, or fall off.
本発明の目的は、切断加工により所要部位に導体を無傷
で端子として残存させ得る、デバイスパッケージに端子
を作製する方法を提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for producing a terminal in a device package, which allows a conductor to remain intact as a terminal at a desired location by cutting.
問題点を解決するための手段 本発明の上記目的は、次の方法によって達成される。Means to solve problems The above objects of the present invention are achieved by the following method.
端子相当部位にめっきスルーホールを有するデバイスパ
ッケージに、前記スルーホール部の内層壁と一部が重な
るようにして二次貫通穴をドリリングで穿ち、めっきス
ルーホール部の内層壁の円と二次貫通穴の円との交点を
通る線の個所で該デバイスパッケージを切断することを
特徴とするデバイスパッケージに端子を作製する方法。A secondary through hole is drilled in a device package that has a plated through hole in a portion corresponding to a terminal so that it partially overlaps with the inner wall of the through hole, and the secondary through hole is aligned with the circle of the inner layer wall of the plated through hole. A method for making a terminal in a device package, comprising cutting the device package at a point along a line passing through the intersection of the hole with the circle.
上記所定個所でのパッケージの切断の結果として、パッ
ケージに残っためっきスルーホールが端子となる。As a result of cutting the package at the predetermined locations, the plated through holes remaining in the package become terminals.
本発明において、めっきスルーホールの一部を端子とし
て残すのに、二次貫通穴のドリリングでの穿設によりこ
れを行う仕様を適用したことは、次のことをもたらす。In the present invention, applying a specification in which a part of the plated through hole is left as a terminal by drilling a secondary through hole brings about the following.
ドリリングは一種の切削加工であり、二次貫通穴のドリ
リング穿設で、めっきスルーホールに施される一部除去
も切削加工である。従って、切断加工と異なり、端子と
なって残るめっきスルーホールは無傷である。かくて、
めっきスルーホール部の内層壁の円と二次貫通穴の円と
の交点を通る線の個所でパッケージを切断して得られる
、残存めっきスルーホールによる端子は、割れ、折れ曲
り、脱落等のないものである。Drilling is a type of cutting process, and the drilling of secondary through holes and the partial removal of plated through holes are also cutting processes. Therefore, unlike the cutting process, the plated through holes that remain as terminals are intact. Thus,
Terminals with remaining plated through holes obtained by cutting the package at the point of intersection between the circle of the inner layer wall of the plated through hole and the circle of the secondary through hole will not crack, bend, or fall off. It is something.
発明の効果
このように本発明によれば、切断加工によりパッケージ
の所要部位に導体を無傷で端子として残存させ得るので
ある。Effects of the Invention As described above, according to the present invention, the conductor can be left intact as a terminal at a desired portion of the package by cutting.
次に本発明の実施例を添付図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the accompanying drawings.
端子作製前のデバイスパッケージが第１図（平面図）に
示され、符号（１）が付されている。該パッケージ（１
）は端子相当部位にめっきスルーホール（２）を有する
。パッケージ（１）のめっきスルーホール（２）は、従
来と同じ方法により加工すればよい。第１図に示すパッ
ケージ（１）は多数個取りのタイプであり、多数個に分
断される前の状態のものである。A device package before terminal fabrication is shown in FIG. 1 (plan view) and is designated by the reference numeral (1). The package (1
) has a plated through hole (2) in the portion corresponding to the terminal. The plated through holes (2) of the package (1) may be processed using the same conventional method. The package (1) shown in FIG. 1 is a multi-piece type, and is in a state before being divided into many pieces.
上記パッケージ（１）に、それのめっきスルーホール（
２）部の内層壁（２ａ）と一部が重なるようにして二次
貫通穴（３）をドリリングにより穿つ（第２図）。この
二次貫通穴（３）の直径は限定的ではないが、穿穴加工
を容易に行う上では、めっきスルーホール（２）の直径
より大きい径であることが好ましい。パッケージ（１）
の銅箔（図示せず）の上にＮｉ＊Ａｕめっきを施す場合
には、そのＡｕめっきは電気めっきの方がよく、そのた
めにはめっき用リード（４）をパターン形成で施すのが
有利である。このようなリード（４）付きのパッケージ
（１）では、リード（４）を損傷しないような口径に二
次貫通穴（３）をすべきである。−船釣には、二次貫通
穴（３）の直径はめっきスルーホール（２）の直径より
若干、大きい程度、例えばめっきスルーホール（２）が
０゜８ｍｍφのとき、二次貫通穴（３）が１．４ｍｍφ
程度でよい。The above package (1) has a plated through hole (
2) Drill a secondary through hole (3) so that it partially overlaps the inner wall (2a) of the section (Fig. 2). Although the diameter of this secondary through hole (3) is not limited, it is preferably larger than the diameter of the plated through hole (2) in order to facilitate drilling. Package (1)
When applying Ni*Au plating on copper foil (not shown), it is better to electroplat the Au plating, and for that purpose it is advantageous to apply the plating lead (4) by patterning. be. In such a package (1) with leads (4), the secondary through hole (3) should have a diameter that does not damage the leads (4). - For boat fishing, the diameter of the secondary through hole (3) is slightly larger than the diameter of the plated through hole (2). For example, when the plated through hole (2) has a diameter of 0°8 mm, the diameter of the secondary through hole (3) ) is 1.4mmφ
A certain amount is enough.
二次貫通穴（３）を穿設したパッケージ（１）は、めっ
きスルーホール（２）部の内層壁（２ａ）の円と二次貫
通穴（３）の円との交点を通る線（５）〔第２図〕の個
所で切断する。すると、第３図に示すような、所要部位
に端子（２０）を有するパッケージ（１０）を得る。即
ち、前記所定個所でのパッケージ（１）の切断の結果と
して、パッケージ（１０）に残っためっきスルーホール
による端子（２０）がパッケージ（１０）に作製された
ことになる。A package (1) with a secondary through hole (3) has a line (5) passing through the intersection of the circle of the inner layer wall (2a) of the plated through hole (2) and the circle of the secondary through hole (3). ) Cut at the location shown in Figure 2. Then, a package (10) having terminals (20) at required locations as shown in FIG. 3 is obtained. That is, as a result of cutting the package (1) at the predetermined location, a terminal (20) is formed in the package (10) using the plated through hole remaining in the package (10).
端子（２０）となって残るめっきスルーホールは、端子
（２０）構成周部以外の部分を切断加工ではなくドリリ
ングにより除去されるので、無傷である。The plated through hole that remains as the terminal (20) remains intact because the portion other than the peripheral portion of the terminal (20) is removed by drilling rather than cutting.
パッケージ（２０）の全体的な製造工程は、上記二次貫
通穴（３）のドリリング工程及び所定個所での切断工程
を除き、従来と変りがない。二次貫通穴（３）のドリリ
ングは、これを除くパッケージ（２０）の製造工程が、
穴あけ→厚付は無電解Ｃｕメツキ−ドライフィルム（Ｕ
Ｖ硬化型マスクフィルム）貼付は一露光一現像（非露光
部の溶解）−パターンはんだめっき−フィルム剥離−エ
ッチング（パターン以外のＣｕめっき除去）→はんだ剥
離であれば、前記Ｃｕメツキとドライフィルム貼付けの
工程の間に行えばよい。パッケージ（１）の所定個所で
の切断は、二次貫通穴（３）のドリリング後であればよ
い。The overall manufacturing process of the package (20) is the same as the conventional one, except for the drilling process of the secondary through hole (3) and the cutting process at predetermined locations. The manufacturing process of the package (20) except for the drilling of the secondary through hole (3) is
For drilling → thickening, use electroless Cu metal dry film (U
V-curable mask film) Pasting is one exposure, one development (dissolution of non-exposed areas) - pattern solder plating - film peeling - etching (removal of Cu plating other than the pattern) → If solder peeling, apply the above Cu plating and dry film. This can be done during the process. The package (1) may be cut at a predetermined location after the secondary through hole (3) is drilled.
第１図は本発明で使用される端子作製前のデバイスパッ
ケージの一例を示す一部省略平面図、第２図は第１図の
パッケージに二次貫通穴をドリリングした状態を示す平
面図、第３図は端子作製後のデバイスパッケージの斜視
図である。
（１）・・・端子作製前のデバイスパッケージ（２）・
・・めっきスルーホール
（２ａ）・・・めっきスルーホール部の内層壁（３）・
・・二次貫通穴
（４）・・・Ａｕメツキ用のリード
（５）・・・切断個所を示す線
（以 上）
第１図
第５図FIG. 1 is a partially omitted plan view showing an example of a device package used in the present invention before making a terminal; FIG. 2 is a plan view showing the package of FIG. 1 with a secondary through hole drilled; FIG. 3 is a perspective view of the device package after the terminals have been fabricated. (1)...Device package before terminal fabrication (2)
...Plated through hole (2a)...Inner layer wall of the plated through hole (3).
...Secondary through hole (4)...Lead for Au plating (5)...Line indicating the cut point (above) Figure 1 Figure 5
Claims (2)
イスパッケージに、前記スルーホール部の内層壁と一部
が重なるようにして二次貫通穴をドリリングで穿ち、め
っきスルーホール部の内層壁の円と二次貫通穴の円との
交点を通る線の個所で該デバイスパッケージを切断する
ことを特徴とするデバイスパッケージに端子を作製する
方法。(1) A secondary through hole is drilled in a device package that has a plated through hole in a portion corresponding to a terminal so that the inner layer wall of the through hole portion partially overlaps with the circle of the inner layer wall of the plated through hole portion. A method for producing a terminal in a device package, comprising cutting the device package at a point along a line passing through the intersection of the secondary through hole with the circle.
直径より若干、大きい請求項（１）記載のデバイスパッ
ケージに端子を作製する方法。(2) The method for producing a terminal in a device package according to (1), wherein the diameter of the secondary through hole is slightly larger than the diameter of the inner layer wall of the plated through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15310588A JPH023999A (en) | 1988-06-20 | 1988-06-20 | Method of providing terminal in device package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15310588A JPH023999A (en) | 1988-06-20 | 1988-06-20 | Method of providing terminal in device package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH023999A true JPH023999A (en) | 1990-01-09 |
Family
ID=15555081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15310588A Pending JPH023999A (en) | 1988-06-20 | 1988-06-20 | Method of providing terminal in device package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH023999A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0888038A1 (en) * | 1997-06-24 | 1998-12-30 | TDK Corporation | Surface mounted electronic parts and manufacturing method therefor |
-
1988
- 1988-06-20 JP JP15310588A patent/JPH023999A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0888038A1 (en) * | 1997-06-24 | 1998-12-30 | TDK Corporation | Surface mounted electronic parts and manufacturing method therefor |
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