JPH0239531A - Rotary processing equipment - Google Patents

Rotary processing equipment

Info

Publication number
JPH0239531A
JPH0239531A JP19038988A JP19038988A JPH0239531A JP H0239531 A JPH0239531 A JP H0239531A JP 19038988 A JP19038988 A JP 19038988A JP 19038988 A JP19038988 A JP 19038988A JP H0239531 A JPH0239531 A JP H0239531A
Authority
JP
Japan
Prior art keywords
chamber
gap
rotary shaft
fluid
supplied
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19038988A
Other languages
Japanese (ja)
Other versions
JP2606726B2 (en
Inventor
Kazuo Fushiki
布志木 和雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP63190389A priority Critical patent/JP2606726B2/en
Publication of JPH0239531A publication Critical patent/JPH0239531A/en
Application granted granted Critical
Publication of JP2606726B2 publication Critical patent/JP2606726B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Sealing Using Fluids, Sealing Without Contact, And Removal Of Oil (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

PURPOSE:To completely prevent air invasion into a chamber and dust generation by providing a mechanism which puts cleaning fluid in the flowing condition at least for a period requiring airtight in a gap to a rotary shaft passing through a chamber. CONSTITUTION:A bush 21 is fixed along the inner peripheral surface of the through hole 1b of a shaft part seal mechanism 20, and a gap 22 is provided between the inner peripheral surface and the outside surface of a rotary shaft 3. Also, an annular outside periphery groove 23 is formed inside a bush 21, and on the inside periphery side of the outside periphery groove 23 a group 24 of narrow nozzles composed of a number of narrow nozzles 24a, 24a... are bored radially toward the rotary shaft 3. This way, clean fluid is always put in the flowing condition to the gap 22 and this is sealed airtightly. The setting of the flowing condition is in a period at least to maintain the air tight condition. The fluid supplied from a clean fluid supply mechanism 12 is supplied once to the outside periphery groove 23, and then it is supplied to the gap 22 through each small orifice nozzle 24a, 24a.... And the through part of the rotary shaft 3 checks the outflow of the clean fluid toward a rotation source mechanism 4 by means of a mechanical seal 17.

Description

【発明の詳細な説明】 [発明の目的コ (産業上の利用分野) 本発明は、回転式処理装置に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a rotary processing device.

(従来の技術) 半導体の製造工程において、ウエノ1洗浄、ウェットエ
ツチング、レジスト剥離が行われる。
(Prior Art) In a semiconductor manufacturing process, Ueno 1 cleaning, wet etching, and resist stripping are performed.

このような洗浄・乾燥処理をバッチ式に行う場合には、
以下に示すような回転式処理装置が多用されている。
When performing such washing and drying processing in a batch manner,
Rotary processing devices such as those shown below are often used.

すなわち、チャンバ外に配置された回転源機構と回転軸
を介して連結され密閉式のチャンバ内に設けられた半導
体ウェハ等の被処理物の支持部が配置され、この被処理
物支持部に複数の半導体ウェハが収容されたカセットホ
ルダがセットされるように構成されたものである。そし
て、被処理物支持部を回転させながら、チャンバ内に配
置されたノズルからカセット内の半導体ウェハに対して
均一にリンス液等の液状処理剤をスプレ一方式や噴霧方
式により供給し、半導体ウェハの洗浄を行う。この後、
リンス液の供給を停止した後も回転を続けて乾燥を行う
That is, a support part for a workpiece such as a semiconductor wafer is provided in a closed chamber and is connected via a rotation shaft to a rotation source mechanism placed outside the chamber. The cassette holder is configured such that a cassette holder containing semiconductor wafers is set therein. Then, while rotating the processing object support part, a liquid processing agent such as a rinsing liquid is uniformly supplied to the semiconductor wafers in the cassette from a nozzle arranged in the chamber by a spray method or a spray method. Clean the area. After this,
Even after the supply of rinsing liquid is stopped, the rotation continues to perform drying.

また、このような回転式処理装置は、液状処理剤を供給
することなく、被処理物の乾燥処理のみに使用されるこ
ともある。さらに、酸液やアルカリ液による処理にも使
用されている。
Moreover, such a rotary processing apparatus may be used only for drying processing of the object to be processed without supplying a liquid processing agent. Furthermore, it is also used for treatment with acid and alkaline solutions.

ところで、上述したような半導体ウェハの洗浄・乾燥等
の処理は、半導体ウェハ上へのパーティクルや不純物等
の付着を防止するために、清浄な雰囲気中で行う必要が
ある。このため、チャンバに設けられた被処理物の搬出
入口はパツキン等によって気密封止されるように構成さ
れており、外気の侵入が阻止されている。
Incidentally, the above-described processing such as cleaning and drying of semiconductor wafers needs to be performed in a clean atmosphere in order to prevent particles, impurities, etc. from adhering to the semiconductor wafers. For this reason, the loading/unloading port of the processed material provided in the chamber is configured to be hermetically sealed with a gasket or the like to prevent outside air from entering.

(発明が解決しようとする課題) しかしながら、上述した洗浄・乾燥装置のような回転式
処理装置においては、チャンバに回転軸の貫通部分が存
在しており、この貫通部分からのtgれた外気の浸入が
問題となっている。
(Problem to be Solved by the Invention) However, in rotary processing equipment such as the above-mentioned cleaning/drying equipment, there is a part through which the rotating shaft passes through the chamber, and the outside air is Infiltration is a problem.

このため、メカニカルシールや磁性流体シールを用いた
り、貫通部分を局所的に排気する等して外気の侵入を防
ぐ等の方策がなされている(特開昭58−213413
号公報、同55−104057号公報、同54−825
2号公報、特公昭82−14223号公報など)が、メ
カニカルシールではそれ自体からの発塵があり、また他
のシール方法においても完全に気密シールすることはで
きなかった。
For this reason, measures have been taken to prevent the intrusion of outside air by using mechanical seals, magnetic fluid seals, or by locally exhausting the penetrating portion (Japanese Patent Laid-Open No. 58-213413
No. 55-104057, No. 54-825
No. 2, Japanese Patent Publication No. 82-14223, etc.) However, mechanical seals generate dust from themselves, and other sealing methods cannot provide a completely airtight seal.

このようにチャンバ内を清浄な雰囲気に維持する上でチ
ャンバと回転軸との気密シールが問題となっており、こ
の軸部のシールを完全に行うことが可能なシール機構が
強く望まれていた。
In order to maintain a clean atmosphere inside the chamber, airtight sealing between the chamber and the rotating shaft has become a problem, and there has been a strong desire for a sealing mechanism that can completely seal this shaft. .

本発明は、このような従来技術の課題に対処するために
なされたもので、回転式処理装置における回転軸のシー
ルを比較的簡易な構造で完全に気密シールすることを可
能にした回転式処理装置を提f共することを目的として
いる。
The present invention was made in order to address the problems of the prior art, and is a rotary processing device that makes it possible to completely airtightly seal the rotating shaft of a rotary processing device with a relatively simple structure. The purpose is to share the equipment.

[発明の構成コ (課題を解決するための手段) すなわち本発明の回転式処理装置は、密閉されたチャン
バ内に配置された被処理物収容部をチャンバ外に配置さ
れた回転源に回転軸を介して連結し、前記チャンバ内に
設けられた支持体を回転させつつ処理を行う回転式処理
装置において、前記チャンバを貫通する回転軸の間隙に
、少なくとも気密を必要とする期間、清浄流体を流動状
態にする機構を設けたことを特徴としている。
[Configuration of the Invention (Means for Solving the Problems) In other words, the rotary processing apparatus of the present invention has a processing object accommodating portion disposed in a sealed chamber that is connected to a rotation source disposed outside the chamber with a rotating shaft. In a rotary processing apparatus that performs processing while rotating a support provided in the chamber, a cleaning fluid is supplied to the gap between the rotating shafts passing through the chamber for at least a period that requires airtightness. It is characterized by the provision of a mechanism to bring it into a fluid state.

(作 用) チャンバに設けられた回転軸が遊挿される開孔部におけ
る間隙に、チャンバ側から回転軸方向に清浄流体、例え
ば純水や不活性気体等を常に流動させて、チャンバと回
転軸との間に形成される間隙にたえず流体を均一にかり
隙間なく流動状態で満すことにより、チャンバ内部と外
部とを完全に遮断することが可能となり、また機械的に
摺接する箇所もないため発塵の心配もない。従って、チ
ャンバ内部はたえず清浄な雰囲気に保たれる。
(Function) A clean fluid, such as pure water or an inert gas, is constantly flowed from the chamber side in the direction of the rotating shaft into the gap in the opening into which the rotating shaft is loosely inserted. By constantly filling the gap formed between the chamber with fluid evenly and without any gaps, it is possible to completely isolate the inside of the chamber from the outside, and there is no mechanical sliding contact. There is no need to worry about dust generation. Therefore, the inside of the chamber is constantly maintained in a clean atmosphere.

磁性流体は、変形が生じるとその隙間を無くする方向に
移動を生ずるが、この発明は常時隙間において流動して
いることが特徴である。
When deformed, the magnetic fluid moves in a direction that closes the gap, but the present invention is characterized in that it constantly flows in the gap.

(実施例) 以下、本発明の回転式処理装置の軸部シール機構をリン
サードライヤの回転軸部に適用した実施例について図面
を参照して説明する。
(Example) Hereinafter, an example in which the shaft sealing mechanism of the rotary processing apparatus of the present invention is applied to the rotating shaft of a rinser dryer will be described with reference to the drawings.

例えばテフロンコーテイング材等によって形成された円
筒状のチャンバ1内に、ターンテーブル2が配置されて
おり、このターンテーブル2は下部中心付近に固定され
チャンバ1底面1aのほぼ中心付近に設けられた貫通孔
1bに遊挿された回転軸3によって、チャンバ2の外部
に配置された回転源機構4に連結されている。また、タ
ーンテーブル2の上面には被処理物、例えば半導体ウェ
ハ5が多数収容されたカセットホルダ6を固定支持する
ホルダ支持部7が外周方向に均等間隔で複数、例えば4
箇所設置されている。
A turntable 2 is disposed in a cylindrical chamber 1 made of, for example, a Teflon coating material. It is connected to a rotation source mechanism 4 disposed outside the chamber 2 by a rotation shaft 3 loosely inserted into the hole 1b. Further, on the upper surface of the turntable 2, a plurality of holder support parts 7, for example, 4 holder support parts 7, which fixedly support a cassette holder 6 containing a large number of objects to be processed, such as semiconductor wafers 5, are arranged at equal intervals in the outer circumferential direction.
It has been installed in some places.

ターンテーブル2のほぼ中央部上方で、カセットホルダ
6によって囲まれた位置には、例えば純水のようなリン
ス液の供給部となる洗浄用ノズル8が多数設置された供
給配管9が上方より吊設されている。この洗浄用ノズル
8は、カセットホルダ6内に収容された多数の半導体ウ
ェハ5に対してリンス液が均一に供給されるように設置
されている。
Above the center of the turntable 2, surrounded by the cassette holder 6, there is a supply pipe 9 suspended from above, in which a number of cleaning nozzles 8, which supply a rinsing liquid such as pure water, are installed. It is set up. This cleaning nozzle 8 is installed so that the rinsing liquid is uniformly supplied to a large number of semiconductor wafers 5 housed in the cassette holder 6.

また、チャンバ1の上部には、カセットホルダ6の搬出
入口となる蓋部1cが中心付近を支点として上方に開閉
するように設けられている。この蓋部1cは閉状態にお
いてパツキン10によってチャンバ1本体と気密に接触
するよう構成されている。
Further, at the upper part of the chamber 1, a lid part 1c, which serves as a loading/unloading entrance for the cassette holder 6, is provided so as to open and close upward with the vicinity of the center as a fulcrum. This lid portion 1c is configured to be in airtight contact with the main body of the chamber 1 through a gasket 10 in the closed state.

チャンバ1の底面1aに設けられ回転軸3が遊挿された
貫通孔1bの内周側には、回転軸3に対する清浄流体に
よる軸部シール機構20が設けられている。
A shaft sealing mechanism 20 using clean fluid for the rotating shaft 3 is provided on the inner peripheral side of a through hole 1b provided on the bottom surface 1a of the chamber 1 and into which the rotating shaft 3 is loosely inserted.

この軸部シール機構20は、第2図および第3図に示す
ように、貫通孔1bの内周面に沿ってブツシュ21が固
定されており、このブツシュ21の内周面と回転軸3の
外面との間には所定の間隙、例えば0 、5mi程度の
間隙22が設けられている。
As shown in FIGS. 2 and 3, this shaft sealing mechanism 20 has a bushing 21 fixed along the inner circumferential surface of the through hole 1b, and the inner circumferential surface of the bushing 21 and the rotating shaft 3 are connected to each other. A predetermined gap, for example, a gap 22 of about 0.5 mm is provided between the outer surface and the outer surface.

ジンシュ21内には環状の外周溝23が形成されており
、外周溝23の内周側には多数の細孔ノズル24a、2
4a・・・によって構成された細孔ノズル群24が回転
軸3に向けて放射状に穿設されて構成されている。この
細孔ノズル24aは、回転軸3とブツシュ21との間隙
22に対して常に清浄流体が流動状態、例えば純水のよ
うな液体、あるいは窒素ガスのような気体が均一にかつ
隙間なく常に流動状態にし、この間隙22を気密シール
するように多数形成されている。この流動状態の設定は
少なくとも気密状態を維持する期間である。
An annular outer circumferential groove 23 is formed in the jacket 21, and a large number of small hole nozzles 24a, 2 are formed on the inner circumferential side of the outer circumferential groove 23.
A small hole nozzle group 24 formed by 4a... is formed by being bored radially toward the rotating shaft 3. This fine-hole nozzle 24a has a state in which a clean fluid is constantly flowing in the gap 22 between the rotating shaft 3 and the bushing 21, for example, a liquid such as pure water or a gas such as nitrogen gas is constantly flowing uniformly and without gaps. A large number of them are formed so as to airtightly seal this gap 22. The setting of this fluid state is at least a period in which an airtight state is maintained.

また、外周溝23は流体供給用配管11を介して清浄流
体供給機構12に接続されており、清浄流体供給機構1
2から供給された流体は、図中実線矢印で示したように
外周溝23に一旦供給され、この外周溝23から各細孔
ノズル24 a、 24 a・・・を通過して間隙22
に供給される。
Further, the outer circumferential groove 23 is connected to the clean fluid supply mechanism 12 via the fluid supply piping 11.
The fluid supplied from 2 is once supplied to the outer circumferential groove 23 as shown by the solid line arrow in the figure, and from this outer circumferential groove 23 it passes through each of the small hole nozzles 24 a, 24 a .
is supplied to

軸部シール機構20上方には、清浄気体供給機構12か
ら供給された流体が被処理物方向に飛散することを防止
する如く、外周側下方に傾斜された遮蔽板13が回転軸
3に固定されている。
Above the shaft sealing mechanism 20, a shielding plate 13 is fixed to the rotating shaft 3 and is inclined downward on the outer peripheral side so as to prevent the fluid supplied from the clean gas supplying mechanism 12 from scattering toward the object to be treated. ing.

また、チャンバ1の底面1b外周側には軸部シールに使
用された清浄流体と洗浄に使用されたリンス液の排出を
行う排出口14が設けられており、この底面1aは排出
口14に向けて若干傾斜されている。
Further, a discharge port 14 is provided on the outer peripheral side of the bottom surface 1b of the chamber 1 for discharging the cleaning fluid used for the shaft seal and the rinsing liquid used for cleaning. It is slightly sloped.

さらに、軸部シール機構20の下方には、下側に流出し
た軸部シールに使用された清浄流体の受は部15がチャ
ンバ1の底面1a下部に設置されており、さらにこの受
は部15にも排出口16が設けられ、この排出口16に
向けて底面が若干傾斜されている。
Furthermore, below the shaft seal mechanism 20, a receiving part 15 is installed at the lower part of the bottom surface 1a of the chamber 1 for receiving the clean fluid used for the shaft seal that has flowed downward. Also, a discharge port 16 is provided, and the bottom surface is slightly inclined toward the discharge port 16.

この受は部15における回転軸3の貫通部は、メカニカ
ルシール17によって回転源m ti 4 方向に軸部
シールに使用された清浄流体の流出が阻止されている。
A mechanical seal 17 prevents the clean fluid used for the shaft seal from flowing out in the direction of the rotation source m ti 4 through the penetrating portion of the rotating shaft 3 in the receiving portion 15 .

また、回転軸3はメカニカルシール17の下部に設けら
れたハウジング17内の軸受19によって回転自在に支
持されている。
Further, the rotating shaft 3 is rotatably supported by a bearing 19 in a housing 17 provided under the mechanical seal 17.

上記構成のリンサードライヤでは、清浄流体供給機構1
2から清浄流体をブツシュ21と回転軸3との間隙22
に供給して、チャンバ1における回転軸3の貫通部分を
気密にシールし、ターンテーブル2を回転させつつリン
ス液を洗浄用ノズル8から噴射させて、半導体ウェハ5
の洗浄、およびリンス液の供給を停止して乾燥が行われ
る。
In the rinser dryer having the above configuration, the clean fluid supply mechanism 1
2 to the gap 22 between the bushing 21 and the rotating shaft 3.
The rinsing liquid is supplied to the chamber 1 to airtightly seal the penetrating portion of the rotating shaft 3 in the chamber 1, and while rotating the turntable 2, the rinsing liquid is injected from the cleaning nozzle 8 to clean the semiconductor wafer 5.
cleaning and drying is performed by stopping the supply of rinsing liquid.

このように、純水や不活性気体等の清浄流体をチャンバ
における回転軸の貫通部分に、チャンバ側から回転軸に
向けて均一にかつ隙間なく流出させることによって、回
転軸とチャンバとの間隙を確実に気密シールすることが
可能となる。従って、この軸部シール機構からの外気の
侵入を完全に阻止することができ、また軸部シール機構
からの発塵もなく、よってチャンバ内をたえず清浄な雰
囲気に保つことが可能となり、半導体ウェハ等の被処理
物へのパーティクルや不純物の付着が防止でき、処理歩
留の向上に繋がる。
In this way, the gap between the rotating shaft and the chamber can be reduced by flowing clean fluid such as pure water or inert gas uniformly and without gaps from the chamber side toward the rotating shaft through the part of the chamber through which the rotating shaft passes. It is possible to ensure an airtight seal. Therefore, it is possible to completely prevent outside air from entering through this shaft sealing mechanism, and there is no dust generated from the shaft sealing mechanism, making it possible to constantly maintain a clean atmosphere inside the chamber. It is possible to prevent particles and impurities from adhering to objects to be processed, such as the like, leading to improved processing yields.

なお、上記実施例ではリンサードライヤに本発明の軸部
シール機構を適用した例について説明したが、本発明は
これに限られるものではな(、例えばスピン洗浄機等の
各種液状処理剤を使用し、回転によって被処理物の均一
な処理を行う装置や、さらには遠心式脱水機等、チャン
バ内の雰囲気制御を必要とする各種回転式処理装置の軸
部シール機構として適用可能である。
Although the above embodiment describes an example in which the shaft sealing mechanism of the present invention is applied to a rinser dryer, the present invention is not limited to this (for example, it can be applied to a rinser dryer using various liquid processing agents, etc.). The present invention can be applied as a shaft sealing mechanism for various types of rotary processing devices that require atmospheric control within a chamber, such as devices that uniformly process objects to be processed through rotation, and centrifugal dehydrators.

[発明の効果コ 以上説明したように本発明によれば、回転式処理装置の
軸部シール機構を、確実に気密シールを行うことが可能
となり、チャンバ内への外気の侵入および発塵を完全に
防止することが可能となる。
[Effects of the Invention] As explained above, according to the present invention, it is possible to reliably seal the shaft sealing mechanism of a rotary processing device airtight, completely preventing outside air from entering the chamber and dust generation. This makes it possible to prevent

従って、各種処理の歩留向上に大きく貢献することがで
きる。
Therefore, it can greatly contribute to improving the yield of various processes.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明装置の一実施例の軸部シール機構を適用
したリンサードライヤの構成を示す図、第2図は第1図
の軸部シール機構を拡大して示す断面図、第3図は第2
図のX−X線に沿った断面図である。 1・・・・・・チャンバ、2・・・・・・ターンテーブ
ル、3・・・・・・回転軸、4・・・・・・回転源機構
、5・・・・・・半導体ウェハ 6・・・・・・カセッ
トホルダ、7・・・・・・ホルダ支持部、]2・・・・
・・清浄流体供給機構、20・・・・・・軸部シール機
構、21・・・・・・ブツシュ、24・・・・・・細孔
ノズル群。
FIG. 1 is a diagram showing the configuration of a rinser dryer to which a shaft sealing mechanism of an embodiment of the present invention is applied, FIG. 2 is an enlarged cross-sectional view of the shaft sealing mechanism of FIG. 1, and FIG. 3 is the second
FIG. 3 is a sectional view taken along line XX in the figure. 1... Chamber, 2... Turntable, 3... Rotation shaft, 4... Rotation source mechanism, 5... Semiconductor wafer 6 ...Cassette holder, 7...Holder support part, ]2...
... Clean fluid supply mechanism, 20 ... Shaft seal mechanism, 21 ... Bush, 24 ... Pore nozzle group.

Claims (1)

【特許請求の範囲】 密閉されたチャンバ内に配置された被処理物収容部をチ
ャンバ外に配置された回転源に回転軸を介して連結し、
前記チャンバ内に設けられた支持体を回転させつつ処理
を行う回転式処理装置において、 前記チャンバを貫通する回転軸の間隙に、少なくとも気
密を必要とする期間、清浄流体を流動状態にする機構を
設けたことを特徴とする回転式処理装置。
[Claims] A processing object accommodating portion disposed in a sealed chamber is connected to a rotation source disposed outside the chamber via a rotation shaft,
In a rotary processing apparatus that performs processing while rotating a support provided in the chamber, a mechanism is provided in which a cleaning fluid is made to flow in a gap between the rotating shafts passing through the chamber for at least a period that requires airtightness. A rotary processing device characterized by being provided with.
JP63190389A 1988-07-29 1988-07-29 Rotation processing device and rotation processing method Expired - Lifetime JP2606726B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63190389A JP2606726B2 (en) 1988-07-29 1988-07-29 Rotation processing device and rotation processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63190389A JP2606726B2 (en) 1988-07-29 1988-07-29 Rotation processing device and rotation processing method

Publications (2)

Publication Number Publication Date
JPH0239531A true JPH0239531A (en) 1990-02-08
JP2606726B2 JP2606726B2 (en) 1997-05-07

Family

ID=16257352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63190389A Expired - Lifetime JP2606726B2 (en) 1988-07-29 1988-07-29 Rotation processing device and rotation processing method

Country Status (1)

Country Link
JP (1) JP2606726B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5042916A (en) * 1989-10-04 1991-08-27 Hosiden Corporation Active matrix display device having divided additional capacitors
JPH0448622U (en) * 1990-06-26 1992-04-24
US6143637A (en) * 1998-03-13 2000-11-07 Nec Corporation Process for production of semiconductor device and cleaning device used therein
US6907892B2 (en) 2001-02-07 2005-06-21 Matsushita Electric Industrial Co., Ltd. Exhaust apparatus, semiconductor device manufacturing system and method for manufacturing semiconductor device
CN106000982A (en) * 2016-07-13 2016-10-12 深圳长城开发苏州电子有限公司 Sealed cleaning cylinder structure and cleaning machine applying structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627133A (en) * 1985-07-03 1987-01-14 Hitachi Ltd Washing and drying device
JPS62242131A (en) * 1986-04-11 1987-10-22 Hitachi Electronics Eng Co Ltd Rotary bearing mechanism with mist discharge port
JPS6326466A (en) * 1986-07-16 1988-02-04 Kyushu Denshi Kinzoku Kk Seal device for rotary machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627133A (en) * 1985-07-03 1987-01-14 Hitachi Ltd Washing and drying device
JPS62242131A (en) * 1986-04-11 1987-10-22 Hitachi Electronics Eng Co Ltd Rotary bearing mechanism with mist discharge port
JPS6326466A (en) * 1986-07-16 1988-02-04 Kyushu Denshi Kinzoku Kk Seal device for rotary machine

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5042916A (en) * 1989-10-04 1991-08-27 Hosiden Corporation Active matrix display device having divided additional capacitors
JPH0448622U (en) * 1990-06-26 1992-04-24
US6143637A (en) * 1998-03-13 2000-11-07 Nec Corporation Process for production of semiconductor device and cleaning device used therein
US6907892B2 (en) 2001-02-07 2005-06-21 Matsushita Electric Industrial Co., Ltd. Exhaust apparatus, semiconductor device manufacturing system and method for manufacturing semiconductor device
US7329322B2 (en) 2001-02-07 2008-02-12 Matsushita Electric Industrial Co., Ltd. Exhaust apparatus, semiconductor device manufacturing system and method for manufacturing semiconductor device
CN106000982A (en) * 2016-07-13 2016-10-12 深圳长城开发苏州电子有限公司 Sealed cleaning cylinder structure and cleaning machine applying structure

Also Published As

Publication number Publication date
JP2606726B2 (en) 1997-05-07

Similar Documents

Publication Publication Date Title
KR100855129B1 (en) Single peace type substrate cleaning method
KR100230502B1 (en) Apparatus for handling of fluid to the rotation-type
JP2547529B2 (en) Wafer carrier centrifugal cleaning equipment
KR100513438B1 (en) Apparatus for Cleaning Both Sides of Substrate
KR100800204B1 (en) Single peace type substrate cleaning method and cleaning apparatus of the same
JP4504884B2 (en) Substrate processing equipment
JP2007088398A (en) Cleaning device, cleaning system using the cleaning device, and method of cleaning substrate to be cleaned
JPH0239531A (en) Rotary processing equipment
US6969682B2 (en) Single workpiece processing system
KR100715984B1 (en) A method and apparatus for treating substrates
JPH11145099A (en) Substrate treatment equipment
JP3253384B2 (en) Vertical reactor
JP3401428B2 (en) Processing equipment
JP3617712B2 (en) Substrate rotation processing equipment
JP6280789B2 (en) Substrate processing apparatus and substrate processing method
KR0151159B1 (en) Driving apparatus having seal elements for cleaning
JP2004071855A (en) Method and device for substrate processing
KR100757849B1 (en) A method for treating substrates
JPH08255789A (en) Treating apparatus and method
JP4275427B2 (en) Rotating shaft sealing mechanism and liquid processing apparatus
JP2005277210A (en) Board support rotary mechanism and board treatment apparatus employing the same
JP3318731B2 (en) Liquid supply device for wafer chuck
JPH11111664A (en) Treatment equipment of substrate
KR100997016B1 (en) Apparatus of treating a substrate in a single wafer type
JPH09314023A (en) Sealing structure and spin treating device for which this sealing structure is used

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090213

Year of fee payment: 12