JPH0239474B2 - - Google Patents
Info
- Publication number
- JPH0239474B2 JPH0239474B2 JP59118062A JP11806284A JPH0239474B2 JP H0239474 B2 JPH0239474 B2 JP H0239474B2 JP 59118062 A JP59118062 A JP 59118062A JP 11806284 A JP11806284 A JP 11806284A JP H0239474 B2 JPH0239474 B2 JP H0239474B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- solution
- halide
- mol
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50274883A | 1983-06-09 | 1983-06-09 | |
| US502748 | 1983-06-09 | ||
| US607874 | 1984-05-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6016885A JPS6016885A (ja) | 1985-01-28 |
| JPH0239474B2 true JPH0239474B2 (en, 2012) | 1990-09-05 |
Family
ID=23999238
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11806284A Granted JPS6016885A (ja) | 1983-06-09 | 1984-06-07 | セラミック基材表面を金属化する方法 |
| JP11806384A Expired - Lifetime JPH0239475B2 (ja) | 1983-06-09 | 1984-06-07 | Seramitsukukibanhyomennokinzokukahoho |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11806384A Expired - Lifetime JPH0239475B2 (ja) | 1983-06-09 | 1984-06-07 | Seramitsukukibanhyomennokinzokukahoho |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JPS6016885A (en, 2012) |
| ZA (2) | ZA844361B (en, 2012) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3523958A1 (de) * | 1985-07-04 | 1987-01-08 | Licentia Gmbh | Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung |
| JPH0654242U (ja) * | 1992-12-26 | 1994-07-22 | 株式会社茂治 | コネクタプラグ |
-
1984
- 1984-06-07 JP JP11806284A patent/JPS6016885A/ja active Granted
- 1984-06-07 JP JP11806384A patent/JPH0239475B2/ja not_active Expired - Lifetime
- 1984-06-08 ZA ZA844361A patent/ZA844361B/xx unknown
- 1984-06-08 ZA ZA844360A patent/ZA844360B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0239475B2 (ja) | 1990-09-05 |
| ZA844361B (en) | 1985-08-28 |
| JPS6016885A (ja) | 1985-01-28 |
| ZA844360B (en) | 1985-01-30 |
| JPS6016886A (ja) | 1985-01-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4604299A (en) | Metallization of ceramics | |
| EP0133201B1 (en) | Metallization of ceramics | |
| US4647477A (en) | Surface preparation of ceramic substrates for metallization | |
| JP4811756B2 (ja) | 金属−セラミックス接合回路基板の製造方法 | |
| KR100809891B1 (ko) | 금속표면상에의 무전해 은 도금욕 및 도금방법 | |
| JPS6133077B2 (en, 2012) | ||
| US4701352A (en) | Surface preparation of ceramic substrates for metallization | |
| US4964923A (en) | Method of forming a copper film on a ceramic body | |
| JP2003060111A (ja) | セラミックス回路基板の製造方法 | |
| CN100564594C (zh) | 银的浸镀 | |
| US4666744A (en) | Process for avoiding blister formation in electroless metallization of ceramic substrates | |
| JPH0239474B2 (en, 2012) | ||
| JPH03170680A (ja) | 非導電性支持体を直接金属被覆する方法 | |
| KR101049236B1 (ko) | 팔라듐을 이용한 무전해 도금방법 | |
| CA1247466A (en) | Process for avoiding blister formation in electroless metallization | |
| JPH0533556B2 (en, 2012) | ||
| JPS61151081A (ja) | セラミツク配線基板の製法 | |
| JP2000299540A (ja) | メタライズ基板 | |
| JP2001185836A (ja) | 配線基板及び配線基板の製造方法及び製造装置 | |
| JP2002100844A (ja) | 配線基板およびその製造方法 | |
| JPH11307915A (ja) | 配線基板の製造方法 | |
| JPH03156992A (ja) | セラミックプリント配線板の製造方法 | |
| JP2001358444A (ja) | 配線基板及び配線基板の製造方法及び製造装置 | |
| JPH073910B2 (ja) | セラミック配線用基板の製法 |