JPH0239405A - Aggregate of chip-type capacitor - Google Patents
Aggregate of chip-type capacitorInfo
- Publication number
- JPH0239405A JPH0239405A JP63189181A JP18918188A JPH0239405A JP H0239405 A JPH0239405 A JP H0239405A JP 63189181 A JP63189181 A JP 63189181A JP 18918188 A JP18918188 A JP 18918188A JP H0239405 A JPH0239405 A JP H0239405A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- capacitors
- chip
- exterior frame
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 77
- 239000011888 foil Substances 0.000 abstract description 4
- 238000004804 winding Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 4
- 238000005452 bending Methods 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 9
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
この発明は、コンデンサの改良にかかり、特にプリント
基板への表面実装に適したチップ形のコンデンサに関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in capacitors, and particularly to chip-type capacitors suitable for surface mounting on printed circuit boards.
従来、コンデンサのチップ化を実現するには、コンデン
サ素子に樹脂モールド加工を施し、樹脂端面から導出し
た外部接続用のリード線を樹脂端面に沿って折り曲げ、
プリント基板の配線パターンに臨ませていた。Conventionally, in order to make a capacitor into a chip, the capacitor element was molded with resin, and the lead wire for external connection led out from the resin end was bent along the resin end.
It was facing the wiring pattern of the printed circuit board.
あるいは、例えば、実公昭５９−３５５７号公報に記載
された考案のように、従来のコンデンサを外装枠に収納
し、リード線を外装枠の端面と同一平面に配置したもの
が提案されていた。また、特開昭６０−２４５１１６号
公報および特開昭６０−２４５１１５号公報に記載され
た発明のように、有底筒状の外装枠にコンデンサを設置
して外装枠底面の貫通孔からリード線を導出し、このリ
ード線を外装枠の外表面に設けた凹部に納めるよう折り
曲げたものが提案されていた。このような従来のチップ
形コンデンサは通常のコンデンサの構造を変更すること
なく、表面実装を可能にしている。Alternatively, for example, as in the idea described in Japanese Utility Model Publication No. 59-3557, it has been proposed that a conventional capacitor is housed in an outer frame and the lead wires are disposed on the same plane as the end surface of the outer frame. In addition, as in the inventions described in JP-A-60-245116 and JP-A-60-245115, a capacitor is installed in a cylindrical exterior frame with a bottom, and a lead wire is inserted from a through hole in the bottom of the exterior frame. It has been proposed that the lead wire is bent to fit into a recess provided on the outer surface of the outer frame. Such conventional chip capacitors can be surface mounted without changing the structure of the normal capacitor.
〔発明が解決しようとする課題］
しかしながら、モールド加工を施すチップ形コンデンサ
では、モールド加工時の熱的ストレスによりコンデンサ
素子が熱劣化するおそれがあり、その製造方法も煩雑で
あった。[Problems to be Solved by the Invention] However, in chip-type capacitors that are molded, there is a risk that the capacitor element will be thermally degraded due to thermal stress during molding, and the manufacturing method thereof is also complicated.
また、通常の電子部品をプリン＋−ｉ板に実装する場合
、隣接する他の電子部品との半田層、配線パターンによ
る短絡事故を防止する必要性から、一定の空隙を設けて
配置している。In addition, when mounting regular electronic components on printed +-I boards, it is necessary to prevent short circuits caused by solder layers and wiring patterns with other adjacent electronic components, so they are placed with a certain amount of space between them. .
ところで、コンデンサを外装枠に収納したチップ形コン
デンサでは、外装枠の底面に臨むリード線は外装枠の両
側辺部に配置される。また、このチップ形コンデンサを
実装するプリント基板の配線パターンは、リード線の配
置にしたがい外装枠の両側辺部付近に、外装枠の両側辺
部から僅かにはみ出るように配線される。By the way, in a chip type capacitor in which the capacitor is housed in an exterior frame, the lead wires facing the bottom of the exterior frame are arranged on both sides of the exterior frame. Further, the wiring pattern of the printed circuit board on which this chip-type capacitor is mounted is wired near both sides of the exterior frame in accordance with the arrangement of the lead wires so as to slightly protrude from both sides of the exterior frame.
そして、チップ形コンデンサと他の電子部品、特に同じ
形のチップ形コンデンサとをプリント基板上に並列して
実装する場合、配線パターンが外装枠の側辺部からはみ
出ているため、また外装枠自体の幅寸法があるため、通
常の空隙以上の空隙を設けなくてはならず、チップ形コ
ンデンサ１個あたりの設置面積が拡大してしまう。その
ため、複数のチップ形コンデンサを高密度に実装するこ
とが困難がなり、昨今の電子機器の小型、軽量化の弊害
となる場合があった。When mounting chip capacitors and other electronic components, especially chip capacitors of the same shape, in parallel on a printed circuit board, the wiring pattern protrudes from the sides of the outer frame, and the outer frame itself Because of the width dimension, it is necessary to provide a gap larger than a normal gap, and the installation area for each chip capacitor increases. This has made it difficult to package multiple chip capacitors with high density, which has sometimes been a hindrance to the efforts to reduce the size and weight of recent electronic devices.
この発明の目的は、通常のコンデンサの構造を変更する
ことなく、高密度な実装が可能なチップ形コンデンサの
集合体を実現することにある。An object of the present invention is to realize an assembly of chip capacitors that can be mounted at high density without changing the structure of ordinary capacitors.
［課題を解決するための手段］
この発明は、チップ形のコンデンサにおいて、コンデン
サの外観形状に適合した収納空間を少なくとも２以上有
する外装枠にコンデンサを収納するとともに、各コンデ
ンサのリード線を外装枠の開口端面から底面に沿って折
り曲げたことを特徴としている。[Means for Solving the Problems] The present invention provides a chip-type capacitor in which the capacitor is housed in an exterior frame having at least two storage spaces that match the external shape of the capacitor, and the lead wires of each capacitor are connected to the exterior frame. It is characterized by being bent from the opening end surface along the bottom surface.
また、別の手段として、外装枠の収納空間に収納された
コンデンサのリード線を、隣接するコンデンサのリード
線と異なる方向に導出し、開口端面から底面に沿って折
り曲げたことを特徴としている。Another feature is that the lead wires of the capacitors housed in the storage space of the exterior frame are led out in a direction different from the lead wires of adjacent capacitors, and bent along the bottom surface from the open end surface.
〔作 用］
図面に示したように、外装枠２にはコンデンサ１の外観
形状に適合した収納空間４を、少なくとも２以上具備し
ている。そして、コンデンサ１は各収納空間４に収納さ
れるとともに、それぞれの収納空間４の一方の開口端面
から突出したリード線３を開口端面および底面に沿って
折り曲げている。そのため、隣接する各コンデンサ１間
の距離が短くなり、全体として複数のチップ形コンデン
サの設置面積を縮小させることができる。[Function] As shown in the drawings, the exterior frame 2 is provided with at least two storage spaces 4 that match the external shape of the capacitor 1. The capacitor 1 is housed in each storage space 4, and the lead wire 3 protruding from one open end surface of each storage space 4 is bent along the open end surface and the bottom surface. Therefore, the distance between adjacent capacitors 1 is shortened, and the installation area of the plurality of chip capacitors can be reduced as a whole.
次いで、この発明の実施例を図面にしたがい説明する。 Next, embodiments of the invention will be described with reference to the drawings.
第１図は、この発明の第１の実施例を示した斜視図、第
２図は第２の実施例で使用するチップ形コンデンサの外
装枠を示した斜視図である。FIG. 1 is a perspective view showing a first embodiment of the present invention, and FIG. 2 is a perspective view showing an exterior frame of a chip-type capacitor used in the second embodiment.
図示しないコンデンサ素子は、電極箔と電解紙とを巻回
して形成する。そして、このコンデンサ素子を有底筒状
の外装ケースに収納するとともに、その開口部を弾性ゴ
ム等からなる封口体で密封している。電極箔と電気的に
接続されたリード線３は、コンデンサ素子から封口体を
貫通して外部に導かれている。A capacitor element (not shown) is formed by winding electrode foil and electrolytic paper. This capacitor element is housed in a cylindrical outer case with a bottom, and its opening is sealed with a sealing body made of elastic rubber or the like. A lead wire 3 electrically connected to the electrode foil is led from the capacitor element to the outside through the sealing body.
外装枠２には、内部にコンデンサ１を収納するのに通し
た形状もしくは寸法に形成された収納空間が少なくとも
２以上形成されている。また、各収納空間の開口端面の
一方には、この開口端面の一部を覆う壁部５が設けられ
ている。この壁部５は、コンデンサ１の端面と当接し、
コンデンサ１を収納空間内の一定の位置に係留する。そ
して、リード線３は、この開口端面から外部に突出する
。The exterior frame 2 is provided with at least two storage spaces each having a shape or size suitable for storing the capacitor 1 therein. Furthermore, a wall portion 5 is provided on one of the opening end surfaces of each storage space to cover a part of this opening end surface. This wall portion 5 is in contact with the end surface of the capacitor 1,
The capacitor 1 is moored at a fixed position within the storage space. The lead wire 3 then protrudes to the outside from this opening end surface.
外装枠２のそれぞれの収納空間から突出したリード線３
は、開口端面に沿って折り曲げられ、更に底面に臨んで
いる。底面に臨んだリード線３は実装されるプリント基
板の配線パターンと当接することになる。Lead wires 3 protruding from each storage space of the exterior frame 2
is bent along the opening end surface and further faces the bottom surface. The lead wires 3 facing the bottom come into contact with the wiring pattern of the printed circuit board to be mounted.
次いで、この発明の第２の実施例について説明する。コ
ンデンサ１は第１の実施例で使用したものと同様に、コ
ンデンサ素子を収納した外装枠を封口体で密封している
。Next, a second embodiment of the invention will be described. The capacitor 1, similar to that used in the first embodiment, has an exterior frame housing a capacitor element sealed with a sealing body.
外装枠６は、第１の実施例と同様に内部にコンデンサの
外観形状に適合した収納空間４が、複数個形成されてい
る。そして、収納空間４の一方の開口端面には、この開
口端面の一部を覆う壁部５が設けられている。As in the first embodiment, the exterior frame 6 has a plurality of storage spaces 4 formed therein that match the external shape of the capacitor. A wall portion 5 is provided on one opening end surface of the storage space 4 to cover a part of this opening end surface.
壁部５は、隣接する収納空間４の壁部５と互いに異なる
方向、この実施例においては反対方向の開口端面に設け
られている。その結果、外装枠６に収納されるコンデン
サのリード線は、隣接するコンデンサ毎に反対方向に突
出することになり、それぞれの開口端面に沿って折り曲
げられ、外装枠６の底面に臨む。The wall portion 5 is provided on an opening end face in a direction different from that of the wall portion 5 of the adjacent storage space 4, in this embodiment, in an opposite direction. As a result, the lead wires of the capacitors housed in the exterior frame 6 protrude in opposite directions for each adjacent capacitor, are bent along the respective opening end faces, and face the bottom surface of the exterior frame 6.
この実施例の場合、コンデンサのリード線は、互いに反
対方向に導出されて底面にＥ）？ｅむため、各コンデン
サのリード線間の距離が、第１の実施例と比較して、長
くすることができる。そのため、半田の溶融等による短
絡を防止することが容易になる。In this embodiment, the capacitor leads are led out in opposite directions to the bottom surface. Therefore, the distance between the lead wires of each capacitor can be made longer than in the first embodiment. Therefore, short circuits due to solder melting can be easily prevented.
以上のようにこの発明は、チップ形のコンデンサにおい
て、コンデンサの外観形状に適合した収納空間を少なく
とも２以上有する外装枠にコンデンサを収納するととも
に、各コンデンサのリード線を外装枠の開口端面から底
面に沿って折り曲げたことを特徴としているので、複数
のチップ形コンデンサが、従来よりも狭い面積で実装さ
れ、プリント基板への高密度実装が容易となる。As described above, in a chip-type capacitor, the present invention stores the capacitor in an exterior frame having at least two storage spaces that match the external shape of the capacitor, and connects the lead wires of each capacitor from the open end surface of the exterior frame to the bottom surface. Since it is characterized by being bent along the curve, multiple chip capacitors can be mounted in a narrower area than before, making it easier to high-density mounting on a printed circuit board.
また、この発明によるチップ形コンデンサの集合体を、
プリント基板に実装する場合、複数のコンデンサ本体か
ら導出されたリード線をそれぞれに半田付けするので、
この集合体全体としての機械的強度が強化され、耐振動
性に優れた信頼性の高いチップ形コンデンサを実現する
ことができる。Furthermore, an assembly of chip capacitors according to the present invention,
When mounting on a printed circuit board, the lead wires derived from multiple capacitor bodies are soldered to each.
The mechanical strength of this assembly as a whole is strengthened, and a highly reliable chip-type capacitor with excellent vibration resistance can be realized.
また、別の手段として、外装枠の収納空間に収納された
コンデンサのリード線を、隣接するコンデンサのリード
線と異なる方向に導出し、開口端面から底面に沿って折
り曲げたことを特徴としているので、互いに隣接するコ
ンデンサ本体のリード線はそれぞれ反対方向に導出され
ることになる。In addition, as another means, the lead wire of the capacitor stored in the storage space of the exterior frame is led out in a direction different from the lead wire of the adjacent capacitor, and is bent from the open end surface along the bottom surface. , the lead wires of adjacent capacitor bodies are led out in opposite directions.
そのため、リード線間距離が長くなり、チップ形コンデ
ンサ同士による短絡事故を防ぐことができる。Therefore, the distance between the lead wires becomes longer, and it is possible to prevent short-circuit accidents caused by chip-type capacitors.
また、リード線はコンデンサ毎に反対方向に導出されて
いるので、このチップ形コンデンサの集合体をプリント
基板に実装して半田付けした場合、チップ形コンデンサ
の両端で半田付けすることとなり、プリント基板上での
機械的強度が良好となり、信頼性を向上させることがで
きる。In addition, since the lead wires are led out in opposite directions for each capacitor, when this assembly of chip capacitors is mounted on a printed circuit board and soldered, both ends of the chip capacitor must be soldered, and the printed circuit board The mechanical strength at the top is improved, and reliability can be improved.
第１図は、この発明の第１の実施例によるチップ形コン
デンサを示した斜視図、第２図は、この発明の第２の実
施例で使用するチップ形コンデンサの外装枠を示した斜
視図である。
第１図
１・・・コンデンサ、２．６・・・外装枠、３・・・リ
ード線、４・・・収納空間、５・・・壁部。FIG. 1 is a perspective view showing a chip-type capacitor according to a first embodiment of the present invention, and FIG. 2 is a perspective view showing an exterior frame of a chip-type capacitor used in a second embodiment of the present invention. It is. Fig. 1 1... Capacitor, 2.6... Exterior frame, 3... Lead wire, 4... Storage space, 5... Wall part.
Claims (2)
くとも２以上有する外装枠にコンデンサを収納するとと
もに、各コンデンサのリード線を外装枠の開口端面から
底面に沿って折り曲げたことを特徴とするチップ形コン
デンサの集合体。(1) A chip characterized in that a capacitor is housed in an exterior frame that has at least two storage spaces that match the external shape of the capacitor, and the lead wires of each capacitor are bent from the open end surface of the exterior frame along the bottom surface. A collection of shaped capacitors.
ド線を、隣接するコンデンサのリード線と異なる方向に
導出し、開口端面から底面に沿って折り曲げたことを特
徴とするチップ形コンデンサの集合体。(2) A collection of chip-type capacitors characterized in that the lead wires of the capacitors housed in the storage space of the exterior frame are led out in a different direction from the lead wires of adjacent capacitors and bent from the open end surface along the bottom surface. body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63189181A JPH0239405A (en) | 1988-07-28 | 1988-07-28 | Aggregate of chip-type capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63189181A JPH0239405A (en) | 1988-07-28 | 1988-07-28 | Aggregate of chip-type capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0239405A true JPH0239405A (en) | 1990-02-08 |
Family
ID=16236854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63189181A Pending JPH0239405A (en) | 1988-07-28 | 1988-07-28 | Aggregate of chip-type capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0239405A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030530B2 (en) * | 1978-09-28 | 1985-07-17 | ザ グツドイア− タイヤ アンド ラバ− コンパニ− | Mandrel assembly for filler net hose |
| JPS61125120A (en) * | 1984-11-22 | 1986-06-12 | 日本ケミコン株式会社 | Continuous leadless type electrolytic capacitor |
-
1988
- 1988-07-28 JP JP63189181A patent/JPH0239405A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6030530B2 (en) * | 1978-09-28 | 1985-07-17 | ザ グツドイア− タイヤ アンド ラバ− コンパニ− | Mandrel assembly for filler net hose |
| JPS61125120A (en) * | 1984-11-22 | 1986-06-12 | 日本ケミコン株式会社 | Continuous leadless type electrolytic capacitor |
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