JPH0239351Y2 - - Google Patents

Info

Publication number
JPH0239351Y2
JPH0239351Y2 JP1985200523U JP20052385U JPH0239351Y2 JP H0239351 Y2 JPH0239351 Y2 JP H0239351Y2 JP 1985200523 U JP1985200523 U JP 1985200523U JP 20052385 U JP20052385 U JP 20052385U JP H0239351 Y2 JPH0239351 Y2 JP H0239351Y2
Authority
JP
Japan
Prior art keywords
electric wire
wire
solder
fixed
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985200523U
Other languages
English (en)
Japanese (ja)
Other versions
JPS62107389U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985200523U priority Critical patent/JPH0239351Y2/ja
Publication of JPS62107389U publication Critical patent/JPS62107389U/ja
Application granted granted Critical
Publication of JPH0239351Y2 publication Critical patent/JPH0239351Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
JP1985200523U 1985-12-26 1985-12-26 Expired JPH0239351Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985200523U JPH0239351Y2 (https=) 1985-12-26 1985-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985200523U JPH0239351Y2 (https=) 1985-12-26 1985-12-26

Publications (2)

Publication Number Publication Date
JPS62107389U JPS62107389U (https=) 1987-07-09
JPH0239351Y2 true JPH0239351Y2 (https=) 1990-10-22

Family

ID=31163108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985200523U Expired JPH0239351Y2 (https=) 1985-12-26 1985-12-26

Country Status (1)

Country Link
JP (1) JPH0239351Y2 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5626674A (en) * 1979-08-10 1981-03-14 Matsushita Electric Ind Co Ltd Method and device for soldering
JPS577921A (en) * 1980-06-18 1982-01-16 Nippon Electric Co Device for soldering sealed electronic part
JPS5745189U (https=) * 1980-08-27 1982-03-12

Also Published As

Publication number Publication date
JPS62107389U (https=) 1987-07-09

Similar Documents

Publication Publication Date Title
CN104201534B (zh) 一种多媒体线材的装配焊接工艺及自动装配焊接机
JPH0239351Y2 (https=)
CN119457304A (zh) 用于电子元器件的浸锡生产系统及方法
CN219248220U (zh) 电路板浸锡设备
ATE82233T1 (de) Verfahren und vorrichtung zum loesbaren befestigen von blanken glasfasern in einer spleissvorrichtung.
US20060204652A1 (en) Method for contacting circuit board conductors of a printed circuit board
JP2525502Y2 (ja) ワニス塗布ダイス
KR100229590B1 (ko) 피복와이어의 와이어 본딩방법
JPH0237683B2 (https=)
DE3275053D1 (en) Process for realising a cooling device
JPH0752694B2 (ja) リ−ド線の処理装置
CN220710830U (zh) 一种防短路沾锡用的分线装置
JPH0329008Y2 (https=)
JP2627366B2 (ja) コイル端末処理装置
JP2530816B2 (ja) 光コネクタのハンダ付方法
JPS58102511A (ja) 電気部品リ−ド線への予備半田付方法及びその装置
CN219535453U (zh) 多芯电源线去皮装置
JP2538703B2 (ja) プリント配線板布線機
CN212063287U (zh) 一种线缆截皮装置
JPS6056472A (ja) メタルコンセントのハンダ付け方法
JPS5545548A (en) Excess solder removing method by using tape
JPH0281497A (ja) 半導体装置のはんだ付け装置
JPH05327193A (ja) ワイヤボンデイング方法およびその装置
JPH0521679A (ja) Lccへのフラツクス塗布装置およびフラツクス塗布方法
JPS60177587A (ja) 自動被覆電線取付装置