JPH0238737U - - Google Patents
Info
- Publication number
- JPH0238737U JPH0238737U JP1988116286U JP11628688U JPH0238737U JP H0238737 U JPH0238737 U JP H0238737U JP 1988116286 U JP1988116286 U JP 1988116286U JP 11628688 U JP11628688 U JP 11628688U JP H0238737 U JPH0238737 U JP H0238737U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- substrate
- package
- power
- sealing glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/50—
-
- H10W70/682—
-
- H10W70/685—
-
- H10W72/07554—
-
- H10W72/5445—
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- H10W72/547—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116286U JPH0622984Y2 (ja) | 1988-09-02 | 1988-09-02 | 多電源素子用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116286U JPH0622984Y2 (ja) | 1988-09-02 | 1988-09-02 | 多電源素子用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0238737U true JPH0238737U (enExample) | 1990-03-15 |
| JPH0622984Y2 JPH0622984Y2 (ja) | 1994-06-15 |
Family
ID=31358685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988116286U Expired - Lifetime JPH0622984Y2 (ja) | 1988-09-02 | 1988-09-02 | 多電源素子用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622984Y2 (enExample) |
-
1988
- 1988-09-02 JP JP1988116286U patent/JPH0622984Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0622984Y2 (ja) | 1994-06-15 |