JPH0288241U - - Google Patents
Info
- Publication number
- JPH0288241U JPH0288241U JP16787188U JP16787188U JPH0288241U JP H0288241 U JPH0288241 U JP H0288241U JP 16787188 U JP16787188 U JP 16787188U JP 16787188 U JP16787188 U JP 16787188U JP H0288241 U JPH0288241 U JP H0288241U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- package
- ceramic package
- memory
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16787188U JPH0288241U (enExample) | 1988-12-26 | 1988-12-26 | |
| DE68921452T DE68921452T2 (de) | 1988-12-26 | 1989-12-22 | Keramisches Modul für Halbleiterspeicher. |
| EP19890313510 EP0376645B1 (en) | 1988-12-26 | 1989-12-22 | Ceramic package for memory semiconductor |
| US07/915,404 US5256901A (en) | 1988-12-26 | 1992-07-20 | Ceramic package for memory semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16787188U JPH0288241U (enExample) | 1988-12-26 | 1988-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288241U true JPH0288241U (enExample) | 1990-07-12 |
Family
ID=15857628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16787188U Pending JPH0288241U (enExample) | 1988-12-26 | 1988-12-26 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0376645B1 (enExample) |
| JP (1) | JPH0288241U (enExample) |
| DE (1) | DE68921452T2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004060367A1 (de) * | 2004-12-15 | 2006-06-29 | Infineon Technologies Ag | Chipbaustein und Verfahren zur Herstellung eines Chipbausteins |
| KR20200007545A (ko) * | 2018-07-13 | 2020-01-22 | 삼성전기주식회사 | 음향 공진기 패키지 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4979468A (enExample) * | 1972-12-04 | 1974-07-31 | ||
| JPS57132343A (en) * | 1981-12-25 | 1982-08-16 | Hitachi Ltd | Manufacture of semiconductor device for memory |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4629824A (en) * | 1984-12-24 | 1986-12-16 | Gte Products Corporation | IC package sealing technique |
-
1988
- 1988-12-26 JP JP16787188U patent/JPH0288241U/ja active Pending
-
1989
- 1989-12-22 DE DE68921452T patent/DE68921452T2/de not_active Expired - Fee Related
- 1989-12-22 EP EP19890313510 patent/EP0376645B1/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4979468A (enExample) * | 1972-12-04 | 1974-07-31 | ||
| JPS57132343A (en) * | 1981-12-25 | 1982-08-16 | Hitachi Ltd | Manufacture of semiconductor device for memory |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0376645B1 (en) | 1995-03-01 |
| DE68921452T2 (de) | 1995-09-14 |
| EP0376645A3 (en) | 1990-10-17 |
| DE68921452D1 (de) | 1995-04-06 |
| EP0376645A2 (en) | 1990-07-04 |