JPH01113348U - - Google Patents
Info
- Publication number
- JPH01113348U JPH01113348U JP1988007094U JP709488U JPH01113348U JP H01113348 U JPH01113348 U JP H01113348U JP 1988007094 U JP1988007094 U JP 1988007094U JP 709488 U JP709488 U JP 709488U JP H01113348 U JPH01113348 U JP H01113348U
- Authority
- JP
- Japan
- Prior art keywords
- silicon chip
- resin layer
- sealing resin
- substrate
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W70/60—
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- H10W70/093—
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- H10W70/099—
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- H10W72/01515—
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- H10W72/073—
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- H10W72/075—
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- H10W72/07504—
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- H10W72/07551—
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- H10W72/50—
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- H10W72/5363—
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- H10W74/00—
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- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988007094U JPH01113348U (enExample) | 1988-01-25 | 1988-01-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988007094U JPH01113348U (enExample) | 1988-01-25 | 1988-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113348U true JPH01113348U (enExample) | 1989-07-31 |
Family
ID=31211819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988007094U Pending JPH01113348U (enExample) | 1988-01-25 | 1988-01-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113348U (enExample) |
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1988
- 1988-01-25 JP JP1988007094U patent/JPH01113348U/ja active Pending