JPS6237938U - - Google Patents
Info
- Publication number
- JPS6237938U JPS6237938U JP1985130300U JP13030085U JPS6237938U JP S6237938 U JPS6237938 U JP S6237938U JP 1985130300 U JP1985130300 U JP 1985130300U JP 13030085 U JP13030085 U JP 13030085U JP S6237938 U JPS6237938 U JP S6237938U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- bonding
- mold layer
- resin mold
- bed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/536—
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- H10W72/5363—
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- H10W72/884—
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- H10W74/00—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130300U JPS6237938U (enExample) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130300U JPS6237938U (enExample) | 1985-08-27 | 1985-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6237938U true JPS6237938U (enExample) | 1987-03-06 |
Family
ID=31027664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985130300U Pending JPS6237938U (enExample) | 1985-08-27 | 1985-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237938U (enExample) |
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1985
- 1985-08-27 JP JP1985130300U patent/JPS6237938U/ja active Pending