JPH0238456Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Technical Field> This invention relates to a bent-lead IC removal device for detecting an IC with a bent lead in an IC test handler and automatically removing it from the handler's transport line.

<Prior art> Previously, the lead was bent beyond the allowable range.
For example, image processing method,
Alternatively, an optical sensor can be used to perform a visual inspection to determine if the product is good or not.
There are items to be sorted into defective items. However, in either case, the disadvantage is that the apparatus is large-scale and expensive.

<Purpose of the invention> This invention uses a simple mechanism to detect bending of IC leads, and detects bent IC leads beyond the allowable range.
Lead bends can be automatically eliminated from the conveyor line
The purpose is to provide an IC exclusion device.

<Summary of the invention> The device for removing bent ICs based on this invention is
For example, it is installed at the entrance of an IC test handler, and there is a rail part that allows even ICs with bent leads to slide smoothly, while ICs with leads bent beyond the allowable range cannot pass through, or due to friction. and a gate part that cannot slide from an initial speed of zero, and is rotatably arranged around a point between the IC transport rail on the entrance side of the IC test handler and the IC transport rail on the main body side.・The checker and the gate ・At the gate of the checker, the IC that has slid from the IC transport rail on the entrance side is stopped once, and then again slid from this gate part to the IC transport rail on the main body side with an initial speed of zero. A stopper, a sensor to detect whether the IC has passed through the gate and slid onto the IC transport rail on the main body side, and an IC whose leads are bent beyond the allowable range are removed from the IC transport rail. and a control device that controls the operations of the gate checker, the stopper, and the exclusion cylinder. First, place the rail part of the gate checker on the entrance side.
Move the stopper closer to the gate checker toward the IC transport rail. Then, the IC is slid onto the gate checker from the IC transport rail on the entrance side, and the IC is stopped at the entrance of the gate section or inside the gate section by the stopper, and then the stopper is moved away from the gate checker side so that the head section is IC that is stopped inside the gate by contacting the stopper
from an initial speed of zero to the IC transport rail on the main body side. If it is not possible to detect that the IC has slid onto the IC transport rail on the main body side when the stopper is moved away, rotate the gate checker to a specified angle and operate the removal cylinder to remove the IC.
are sent to the defective product receiving box.

<Example of the invention> An example of the invention is shown in FIGS. 1 and 2. Figure 1 is a front view of the gate checker, Figure 2
The figure is a side view thereof. This gate checker is placed, for example, between the IC transport rail 11 on the entrance side of the IC test handler and the IC transport rail 12 on the main body side, and removes ICs with bent leads to the defective product receiving box 13. That is. This gate checker has a rail part 14 and a gate part 1.
5, and is rotatable around a rotation center point A. In addition, near the gate part 15
A stopper 16 movable in a direction perpendicular to the direction of movement of the IC and a sensor 17 for detecting passage of the IC are provided.

In Figure 3, IC1
8 is a cross-sectional view when it is sliding. This shape is such that even if the reed is bent to some extent as shown by the dotted line, it can be passed through smoothly.

Also, in Fig. 4, the two-dot chain line YY' of the gate section 15 is
A cross-sectional view when IC18 is sliding is shown. For example, as shown by the dotted line, if the reed is bent beyond the permissible range, it will be impossible to pass, or it will not be able to slide from an initial speed of zero due to friction.

Next, the operation of this device will be explained. This example shows the case where two ICs are slid at the same time. First, the stopper 16 is brought close to the gate checker. Then, the IC is supplied to the gate checker from the IC transport rail 11 on the entrance side. This IC is accelerated by the rail section 14 and supplied to the gate section 15. Those whose leads are extremely bent will stop at the entrance of the gate section 15, while other leads will come into contact with the stopper 16 and stop inside the gate section 15. Next stopper 16
, and the IC stopped in the gate part 15 is made to slide from its initial speed of zero. If the IC lead is bent beyond the allowable range, the IC remains stopped at the gate portion 15 and does not slide.

When the stopper 16 is moved away, it stops at the entrance of the gate part 15 or inside the gate part 15 and the sensor 17
If there is an IC that is not detected, the gate checker is rotated, for example, 100 degrees to the left about the rotation center point A, as shown in FIG. For example, an exclusion cylinder installed near the gate checker may prevent the sensor 17 from detecting the
Push the head of the IC and drop it into the defective product receiving box 13.
This exclusion cylinder includes, for example, a cylinder 21 and a piston 2.
2, air supply holes 23 and 24. Compressed air is sent from the air supply hole 23 of the exclusion cylinder on the rail side on which the IC not detected by the sensor 17 is placed, and the piston 22 is extended toward the gate checker side to drop the IC into the defective product receiving box 13. Next, compressed air is introduced through the air supply hole 24 and the piston 22
At the same time, the gate checker is also rotated 100 degrees to the right to return to its original state, and the stopper 16 is brought close to the gate checker and the next
Inspect the IC leads.

When the stopper 16 is moved away, if the sensor 17 detects that both ICs have slid onto the IC transport rail 12 on the main body side, the stopper 16 is moved closer to the gate checker again and the next IC is moved.
Inspect the IC leads.

Although the gate checker having two rails has been described above, the number of rails may be one or three or more. In either case, stopper 1
6 close to the gate checker, slide the IC from the IC transport rail 11 on the entrance side, stop the IC at the entrance of the gate section 15 or inside the gate section 15 by the stopper 16, and then
Keep 6 away. At that time, the sensor 17 remains stationary at the entrance of the gate section 15 or within the gate section 15.
If there are any ICs that are not detected, the gate checker is rotated by a predetermined angle and the stopped ICs are removed to the defective product receiving box 13. Then, return the gate checker to its original state and set the stopper 16 to the gate checker.
Bring it close to the checker and inspect the next IC lead. When the stopper 16 is moved away, all ICs
If the sensor 17 detects that the IC has slid onto the IC transport rail 12 on the main body side, the gate checker is left as it is and the stopper 16 is brought closer to inspect the next IC lead.

Further, the portion consisting of the IC transport rail 11 on the entrance side, the gate checker, and the IC transport rail 12 on the main body side may be formed into a gentle slope. In this way, as shown in Fig. 6, when an IC with a self-weight mg slides on the gate/checker rail forming an angle θ with the horizontal direction and is stopped at the stopper 16, the force applied to the stopper 16 becomes mgsinθ. It can be made smaller.

<Effects of the invention> As explained above, the lead bent IC removing device according to this invention is placed on the IC transport rail,
The IC sent from the IC transport rail in the previous stage is stopped within the gate section of the gate/checker by a stopper, and then the stopper is moved away and the IC is slid through the gate section from an initial speed of zero to the IC in the subsequent stage.
The IC is tested to see if it can be moved to the transport rail, and if it is not, it is removed from the IC transport line, so it can be easily configured without using large-scale equipment such as an image processing device. ICs with large lead bends can be reliably eliminated.

[Brief explanation of the drawing]

Figure 1 is a front view of the gate checker used in the device for removing bent ICs based on this invention.
Figure 2 is a side view of the gate checker, Figure 3 is a sectional view when the IC is passing over the chain double-dot line XX' in Figure 1, and Figure 4 is the chain double-dot line YY in Figure 1. IC above
5 is a front view for explaining the operation of the gate checker shown in FIG. 1, and FIG. 6 is a schematic diagram showing another embodiment of this invention. . 11, 12: IC transport rail, 13: Defective product receiving box, 14: Rail section, 15: Gate section, 16: Stopper, 17: Sensor, 18: IC, 21: Cylinder,
22: Piston, 23, 24...Air supply hole.

Claims (1)

[Scope of utility model registration request] ICs are tested and classified into good and defective products.
The IC test handler consists of a rail section that can slide even ICs whose leads are bent to some extent, and a gate section that has a shape that prevents ICs whose leads are bent beyond the allowable range from sliding. B. A gate checker which is arranged rotatably around a point between the IC transport rails of the IC test handler, and B. A stopper that once stops the IC that has slid from the preceding IC transport rail at the gate section. , C. A sensor that detects whether an IC has passed through the gate section of the gate checker; D. Exclusion means for eliminating ICs whose leads are bent beyond the permissible range; E. The stopper is brought close to the gate part of the gate checker facing the IC transport rail to stop the IC sliding from the previous IC transport rail at the gate part, and then the stopper is moved away and the IC is moved to the gate part. When a stopped IC is slid and the sensor detects that the IC has slid onto the IC transport rail at the next stage, the stopper is moved closer to the gate checker to accept the next IC. At the same time, if the sensor does not detect that the IC has slid onto the IC transport rail in the latter stage when the stopper is moved away,
a control device for controlling the gate checker, the stopper, and the removing means so that the gate checker is rotated by a predetermined angle and the removing means removes the IC from the conveyance line; Characteristic lead bend
IC exclusion device.