JPS63193277A - Inspecting method for outward appearance of ic lead frame - Google Patents
Inspecting method for outward appearance of ic lead frameInfo
- Publication number
- JPS63193277A JPS63193277A JP62024844A JP2484487A JPS63193277A JP S63193277 A JPS63193277 A JP S63193277A JP 62024844 A JP62024844 A JP 62024844A JP 2484487 A JP2484487 A JP 2484487A JP S63193277 A JPS63193277 A JP S63193277A
- Authority
- JP
- Japan
- Prior art keywords
- image
- lead frame
- inspection
- state
- images
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 8
- 238000007689 inspection Methods 0.000 claims abstract description 32
- 238000005259 measurement Methods 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims description 3
- 238000009825 accumulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈発明の利用分野〉
この発明は、搬送手段にて搬送され検査用カメラに対し
位置決めされたＩＣリードフレームより画像を取り入れ
、この取入画像と予め設定された基準画像とを比較する
ことによりＩＣリードフレームのメッキ処理状態を検査
するＩＣリードフレームの外観検査方法に関する。[Detailed Description of the Invention] <Field of Application of the Invention> This invention captures an image from an IC lead frame transported by a transport means and positioned with respect to an inspection camera, and combines this captured image with a preset reference image. This invention relates to an external appearance inspection method for an IC lead frame, in which the plating condition of the IC lead frame is inspected by comparing the results.
〈従来の技術〉
従来、この種のＩＣリードフレームの外観検査方法とし
ては、例えば、特開昭６１−０６１９８５号公報に示さ
れるようなものが知られている。<Prior Art> Conventionally, a method for inspecting the appearance of this type of IC lead frame is known, for example, as disclosed in Japanese Unexamined Patent Publication No. 61-061985.
その要点を第３図及び第４図に基づいて説明すると以下
の如くである。The main points will be explained below based on FIGS. 3 and 4.
即ち、ＩＣリードフレーム１は、搬送手段２により搬送
されて搬送手段２の一部であるピンチローラ３にて検査
用カメラ４の下の測定ステージ５に所定位置決めされる
。そして、この状態のＩＣリードフレームｌより画像を
取り入れ、この取入画像と予め設定されている基卓画像
とを比較することによりそのメッキ処理状態を検査する
ものである。この際に重要なのは、検査用カメラ４に対
するＩＣリードフレーム１の位置決め状態の正確性であ
る。つまり、画像比較による検査は、取入画像が常に一
定の状態で取り入れられるのでなければその正確性を期
し得ない。そこで、ＩＣリードフレーム１の最終的な位
置決めは、位置決め機構Ｍによってなされるもので、ピ
ンチローラ３にて測定ステージ５へ概略位置決めして送
り込んだ後、電磁手段（図示せず）にて昇降する位置決
めピン７を小孔（パイロットホール）８へ挿入すること
によって行っている。That is, the IC lead frame 1 is transported by the transport means 2 and positioned at a predetermined position on the measurement stage 5 under the inspection camera 4 by the pinch roller 3 which is a part of the transport means 2. Then, an image is taken from the IC lead frame l in this state, and the plating processing state is inspected by comparing this taken image with a preset base table image. What is important at this time is the accuracy of the positioning of the IC lead frame 1 with respect to the inspection camera 4. In other words, inspection by image comparison cannot be expected to be accurate unless the captured images are always captured in a constant state. Therefore, the final positioning of the IC lead frame 1 is performed by the positioning mechanism M. After roughly positioning the IC lead frame 1 with the pinch roller 3 and sending it to the measurement stage 5, the IC lead frame 1 is moved up and down using electromagnetic means (not shown). This is done by inserting a positioning pin 7 into a small hole (pilot hole) 8.
〈発明が解決しようとする問題点〉
しかしながら、上記の如き従来のＩＣリードフレームの
外観検査方法では、その搬送・位置決めを、ピンチロー
ラ３、電磁手段にて昇降する位置決めピン７等から成る
位置決め機構Ｍの「機械的」手段にのみ頼っているため
、位置決めピン７の昇降速度によて検査速度を規制され
ることになるという点、搬送速度（８送状態）の誤差が
大きい場合、例えば何らかの原因によりピンチローラ３
の径が変化した結果搬送速度に誤差を生じた場合、ある
いは繰り返される搬送・位置決め個々の微小な誤差が累
積されることにより大きい誤差を生じた場合には位置決
めピン７が小孔８へ挿入せず、結局位置決め状態に許容
範囲をこえる誤差を生じ、正確な検査を行えなくなると
いう点、において改善の余地があった。<Problems to be Solved by the Invention> However, in the conventional IC lead frame appearance inspection method as described above, the transportation and positioning of the IC lead frame is carried out using a positioning mechanism consisting of a pinch roller 3, a positioning pin 7 that is raised and lowered by electromagnetic means, etc. Since it relies only on the "mechanical" means of M, the inspection speed is regulated by the lifting speed of the positioning pin 7. If there is a large error in the transport speed (8 feeding states), for example, some kind of Pinch roller 3 due to the cause
If an error occurs in the conveyance speed as a result of a change in the diameter of First, there is room for improvement in that an error exceeding an allowable range will eventually occur in the positioning state, making it impossible to perform accurate inspection.
く問題点を解決するための手段〉
上記問題点を解決するための手段として、この発明に係
るＩＣリードフレームの外観検査方法では、先ず、検査
用カメラに対し正常状態で位置決めされたＩＣリードフ
レームの画像を複数の測定点に基づいて記憶画像化せし
め、以後、この記憶画像と順次搬送・位置決めされるＩ
Ｃリードフレームからの取入画像とを測定点に基づいて
比較し、搬送・位置決め状態の誤差により両画像間にズ
レが生じた場合には、電気的手段にて両画像を一敗せし
めた後この取入画像について検査を行うと共に、このズ
レを搬送手段へフィードバックせしめ、以後の搬送状態
を正常な位置決め状態に戻してやることを要旨としてい
る。Means for Solving the Problems> As a means for solving the above problems, in the external appearance inspection method of an IC lead frame according to the present invention, first, an IC lead frame positioned in a normal state with respect to an inspection camera is inspected. The image of I is made into a memorized image based on a plurality of measurement points, and thereafter, I
Compare the image taken from the C lead frame based on the measurement point, and if there is a misalignment between the two images due to errors in the conveyance/positioning state, after making both images lose one by one using electrical means. The main idea is to inspect this taken-in image, feed back the deviation to the conveyance means, and return the subsequent conveyance state to a normal positioning state.
〈作 用〉
即ち、正常位置決め状態の記憶画像と個々の位置決め状
態における取入画像とを比較し、個々の搬送・位置決め
状態に誤差が生じた場合にはこの誤差を両画像間のズレ
として検知し、このズレ、即ち位置決め状態の誤差を搬
送手段へフィードバックせしめ、以後の搬送状態を正常
に戻してやることとしているので、搬送誤差の累積によ
る許容範囲を越えた位置決め誤差の発生をより有効に防
止でき、また板金誤差を生じても、電気的手段にて両画
像を一致せしめた後検査を行うことと相俟って、常に正
確な検査を行なえることになる。しかも、このようにし
て検査を行うことにより、搬送・位置決め機構の「機械
的」誤差をある程度許容し得るものとしているので、従
来の如き位置決めピンを用いる必要性がなくなり、検査
速度をより高速ものとできることになる。<Operation> In other words, the memorized image of the normal positioning state and the captured image of each positioning state are compared, and if an error occurs in each transport/positioning state, this error is detected as a shift between the two images. However, this deviation, that is, the error in the positioning state, is fed back to the conveying means to return the subsequent conveying condition to normal, which more effectively prevents the occurrence of positioning errors that exceed the allowable range due to accumulation of conveyance errors. Even if a sheet metal error occurs, in combination with the fact that inspection is performed after matching both images using electrical means, accurate inspection can always be carried out. Moreover, by performing inspection in this way, it is possible to tolerate some degree of "mechanical" error in the transport and positioning mechanism, eliminating the need to use conventional positioning pins and increasing the inspection speed. This means that you can do this.
く実 施 例〉
以下、この発明の実施例を、この発明の実施に用いる装
置例を示す第１図及び第２図を参照して説明する。尚、
装置例については従来と共通する部分は同一符号を以て
示し、重複する説明は省略するものとする。Embodiments Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2, which show examples of apparatus used for carrying out the invention. still,
Regarding the device example, parts common to the conventional device are indicated by the same reference numerals, and duplicate explanations will be omitted.
この発明では、先ず、検査用カメラ４に対し正常状態で
位置決めされたＩＣリードフレーム１の画像を複数の測
定点Ａ−Ｈに基づいて記憶画像化せしめることとしてい
る。そして、以後、この記憶画像と順次搬送・位置決め
される個々のＩ ＣＩＪ−ドフレーム１から取り入れら
れる取入画像とを測定点Ａ−Ｈに基づいて比較し、もし
搬送・位置決め状態に誤差があり、その結果両画像間に
ズレが生じた場合には、このズレを電気的手段にて取り
除き両画像を一致せしめた後、この取入画像について検
査を行うこととしている。さらに、このズレを搬送手段
２ヘフイードハツクせしめ、以後の搬送状態を正常に戻
してやることとしている。In this invention, first, an image of the IC lead frame 1 positioned in a normal state with respect to the inspection camera 4 is stored as an image based on a plurality of measurement points A-H. From then on, this stored image is compared with the captured images taken from the individual ICIJ-deframes 1 that are sequentially transported and positioned, based on measurement points A-H, and if there is an error in the transport and positioning state, If, as a result, a shift occurs between the two images, this shift is removed by electrical means and the two images are made to match, and then the captured image is inspected. Furthermore, this deviation is caused to feed into the conveyance means 2, and the subsequent conveyance condition is returned to normal.
尚、測定点を複数設けたことにより、各測定点Ａ〜１１
の平均値を以て比較し、もし何れかの測定点に欠陥があ
っても比較ミスを防止できることになる。もっとも、位
置決めの誤差は、搬送方向（矢示Ｘ方向）に主に生じる
ものなので、矢示Ｙ方向についての測定点Ｅ−Ｈは省略
してもよい。In addition, by providing multiple measurement points, each measurement point A to 11
Comparison is made using the average value of , and even if there is a defect at any measurement point, comparison errors can be prevented. However, since positioning errors mainly occur in the transport direction (arrow X direction), measurement points E-H in the arrow Y direction may be omitted.
このように、正常位置決め状態の記憶画像と個々の位置
決め状態における取入画像とを比較し、個々の搬送・位
置決め状態に誤差が生じた場合にはこの誤差を両画像間
のズレとして検知し、このズレ、即ち位置決め状態の誤
差を搬送手段へフィートバンクせしめ、以後の搬送状態
を正常に戻してやることとしているので、繰り返えされ
る搬送・位置決めにおける搬送誤差の累積を防止でき、
許容範囲を越えるような位置決め誤差を生じる余地は極
めて少なくなる。また仮令誤差を生じても、電気的手段
にて両画像を一敗せしめた後検査を行うこととしており
、両者が相俟って常に正確な検査を行なえることになる
。しかも、このようにして検査を行うことにより、搬送
・位置決め機構の「機械的」誤差をある程度許容し得る
ものとしているので、従来の如き位置決めピン７を含む
位置決め機構Ｍを用いる必要性がなくなり、検査速度を
より高速ものとできることになる。In this way, the stored image in the normal positioning state and the captured image in each positioning state are compared, and if an error occurs in each transport/positioning state, this error is detected as a shift between the two images, This deviation, that is, the error in the positioning state, is foot banked to the conveyance means, and the subsequent conveyance condition is returned to normal, so that it is possible to prevent the accumulation of conveyance errors during repeated conveyance and positioning.
There is very little room for a positioning error that exceeds the allowable range. Furthermore, even if a temporary error occurs, the inspection is performed after both images have been completely destroyed by electrical means, and both of these factors work together to ensure accurate inspection at all times. Moreover, by performing the inspection in this way, it is possible to tolerate "mechanical" errors in the conveyance/positioning mechanism to some extent, so there is no need to use the conventional positioning mechanism M including the positioning pin 7. This means that the inspection speed can be made faster.
〈発明の効果〉
この発明に係るＩＣリードフレームの外観検査方法は、
以上説明してきた如く、正常位置決め状態の記憶画像と
個々の位置決め状態における取入画像とを比較し、個々
の搬送・位置決め状態の誤差を搬送手段へフィードバッ
クせしめ、以後の搬送状態を正常に戻してやることとし
ているので、搬送誤差の累積による許容範囲を越えた位
置決め誤差の発生をより有効に防止でき、また仮令誤差
を生じても、電気的手段にて両画像を一致せしめた後検
査を行うことと相俟って、常に正確な検査を行なえると
いう秀れた効果があり、またこのようにして検査を行う
ことにより、搬送・位置決め機構の「機械的」誤差をあ
る程度許容し得るものとしているので、従来の如き位置
決めピンを用いる必要性がなくなり、検査速度をより高
速ものと第１図は、この発明の実施に用いる外観検査装
置の概略側面図、
第２図は、ＩＣリードフレームの概略平面図、第３図は
、従来の外観検査装置の概略側面図、そして
第４図は、第３図中矢示■方向からみた平面図、である
。<Effects of the Invention> The method for inspecting the appearance of an IC lead frame according to the present invention is as follows:
As explained above, the stored image of the normal positioning state is compared with the captured image of each positioning state, and the error in each transport/positioning state is fed back to the transport means, so that the subsequent transport state is returned to normal. This makes it possible to more effectively prevent the occurrence of positioning errors that exceed the allowable range due to accumulation of transport errors, and even if a temporary error occurs, inspection can be performed after matching both images using electrical means. Combined with this, it has the excellent effect of always being able to perform accurate inspections, and by performing inspections in this way, it is possible to tolerate "mechanical" errors in the transport and positioning mechanism to some extent. Therefore, there is no need to use positioning pins as in the past, and the inspection speed can be increased. Fig. 1 is a schematic side view of an appearance inspection device used to implement the present invention, and Fig. 2 is a schematic diagram of an IC lead frame. A plan view, FIG. 3 is a schematic side view of a conventional visual inspection device, and FIG. 4 is a plan view viewed from the direction indicated by the arrow 3 in FIG.
１−−−一・−ＩＣリードフレーム ２−−−−−一搬送手段 ４−−一検査用カメラ Ａ −Ｈ−・−測定点1---1・-IC lead frame 2------1 conveyance means 4--1 Inspection camera A -H-・-Measurement point
Claims (1)
たＩＣリードフレームより画像を取り入れ、この取入画
像と予め設定された基準画像とを比較することによりＩ
Ｃリードフレームのメッキ処理状態を検査するＩＣリー
ドフレームの外観検査方法に於いて、 先ず、検査用カメラに対し正常状態で位置決めされたＩ
Ｃリードフレームの画像を複数の測定点に基づいて記憶
画像化せしめ、 以後、この記憶画像と順次搬送・位置決めされるＩＣリ
ードフレームからの取入画像とを測定点に基づいて比較
し、搬送・位置決め状態の誤差により両画像間にズレが
生じた場合には、電気的手段にて両画像を一致せしめた
後この取入画像について検査を行うと共に、このズレを
搬送手段へフィードバックせしめ、以後の搬送状態を正
常な位置決め状態に戻してやることを特徴とするＩＣリ
ードフレームの外観検査方法。[Claims] By taking an image from an IC lead frame transported by a transport means and positioned with respect to an inspection camera, and comparing this taken image with a preset reference image,
In the external inspection method for IC lead frames that inspects the plating status of C lead frames, first, an IC lead frame is positioned in a normal state with respect to an inspection camera.
The image of the C lead frame is stored as a memorized image based on multiple measurement points, and thereafter, this stored image is compared with the captured image from the IC lead frame that is sequentially transported and positioned based on the measurement points, and the transported and positioned images are compared. If a shift occurs between the two images due to an error in the positioning state, the captured image is inspected after matching the two images using electrical means, and this shift is fed back to the conveying means for subsequent processing. A method for visually inspecting an IC lead frame, characterized by returning the conveyance state to a normal positioning state.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62024844A JPS63193277A (en) | 1987-02-06 | 1987-02-06 | Inspecting method for outward appearance of ic lead frame |
| US07/082,097 US4851902A (en) | 1986-10-29 | 1987-08-05 | Auatomatic inspection system for IC lead frames and visual inspection method thereof |
| GB8722303A GB2197948B (en) | 1986-10-29 | 1987-09-22 | Automatic inspection system for and electro-optic methods of inspection of ic lead frames |
| SG313/93A SG31393G (en) | 1986-10-29 | 1993-03-22 | Automatic inspection system for an electro-optic methods of inspection of ic lead frames |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62024844A JPS63193277A (en) | 1987-02-06 | 1987-02-06 | Inspecting method for outward appearance of ic lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63193277A true JPS63193277A (en) | 1988-08-10 |
| JPH058473B2 JPH058473B2 (en) | 1993-02-02 |
Family
ID=12149526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62024844A Granted JPS63193277A (en) | 1986-10-29 | 1987-02-06 | Inspecting method for outward appearance of ic lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193277A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990027831A (en) * | 1997-09-30 | 1999-04-15 | 이해규 | Lead frame inspection device |
-
1987
- 1987-02-06 JP JP62024844A patent/JPS63193277A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990027831A (en) * | 1997-09-30 | 1999-04-15 | 이해규 | Lead frame inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058473B2 (en) | 1993-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI665443B (en) | Automatic optical inspection system and operating method thereof | |
| DE112005003666T5 (en) | Testing device for electronic components | |
| DE112005002693T5 (en) | Electronic component tester and method for detecting defective terminals | |
| KR102192750B1 (en) | Inspection apparatus and inspection method | |
| KR101995888B1 (en) | Lead frame automatic inspection system | |
| JPS63193277A (en) | Inspecting method for outward appearance of ic lead frame | |
| US8358339B2 (en) | Testing method, testing and processing system, processing device, testing device, manufacturing/testing device, and manufacturing/testing method | |
| TW200842346A (en) | Detection method of printed circuit boards and the system thereof | |
| JPH02208949A (en) | Semiconductor manufacturing device | |
| JPS6044409A (en) | Transport device for semiconductor device | |
| KR102410920B1 (en) | Methode for collecting Printed circuit board and scanning device of printed circuit board therefor | |
| JPH05114640A (en) | Method and device for measuring lead, and lead tester using same | |
| JPS5923423Y2 (en) | Detection and exclusion device for IC with bent leads | |
| US20220307988A1 (en) | Inspection system | |
| JPH01287449A (en) | Pattern defect inspecting device | |
| JPH01302147A (en) | Appearance inspecting device | |
| Brunelle et al. | Line scan vision system | |
| JPH01100677A (en) | Appearance inspection device | |
| JP2006329679A (en) | Method and device for inspecting product pattern | |
| JPH0327514A (en) | Photomask pattern and its transcription | |
| JP3786552B2 (en) | Inspection device for film carrier tape for electronic component mounting | |
| JPH04177107A (en) | Inspecting apparatus of appearance of molded article | |
| JPH01233349A (en) | Lead bend detecting apparatus for semiconductor device | |
| JPS61237444A (en) | Handler device for inspecting ic product | |
| DE112020004574T5 (en) | Mounting board manufacturing system, component mounting system, mounting board manufacturing method and component mounting method |