JPH0235748A - Bonding device - Google Patents
Bonding deviceInfo
- Publication number
- JPH0235748A JPH0235748A JP63186193A JP18619388A JPH0235748A JP H0235748 A JPH0235748 A JP H0235748A JP 63186193 A JP63186193 A JP 63186193A JP 18619388 A JP18619388 A JP 18619388A JP H0235748 A JPH0235748 A JP H0235748A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- thin metal
- wedge
- metal wire
- fine wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 238000002788 crimping Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 102100025342 Voltage-dependent N-type calcium channel subunit alpha-1B Human genes 0.000 description 1
- 101710088658 Voltage-dependent N-type calcium channel subunit alpha-1B Proteins 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は金属細線のボンディング装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a bonding device for thin metal wires.
従来、この種のボンディング装置は、第３図に示すよう
に金属細線２をキャピラリー１がらチップ３のパッド４
の上部へ送り出し、該金属細線２をウェッジ６の下部先
端で押し下げるように誘導し、そのままパッド４へ押し
つけて圧着していた。Conventionally, this type of bonding apparatus has been used to connect a thin metal wire 2 through a capillary 1 to a pad 4 of a chip 3, as shown in FIG.
The thin metal wire 2 was guided so as to be pushed down by the lower tip of the wedge 6, and then pressed against the pad 4 and crimped.
上述した従来のボンディング装置はキャピラリー１から
送り出された金属細線２の誘導にウェッジ６を用い、該
ウェッジ６の下部先端で細線を押し下げるようにして誘
導し、そのままパッド４へ押しつけて圧着するため、誘
導時及び金属細線２がパッド４に接触してから圧着完了
するまでの間に該金属細線２がウェッジ６から外れやす
く、また圧着位置がずれて一部分のみの圧着になるとい
う欠点がある。The conventional bonding apparatus described above uses a wedge 6 to guide the thin metal wire 2 sent out from the capillary 1, and guides the thin wire by pushing it down with the lower tip of the wedge 6, and then presses it directly against the pad 4 to crimp it. There are disadvantages in that the thin metal wire 2 tends to come off the wedge 6 during guidance and after the thin metal wire 2 contacts the pad 4 until the crimping is completed, and the crimping position shifts, resulting in only a partial crimping.
本発明の目的は、上記課題を解消したボンディング装置
を提供することにある。An object of the present invention is to provide a bonding device that solves the above problems.
、上述した従来のボンディング装置に対し、本発明は金
属細線をパッドへ誘導する１ａ梢と圧着する＃ＲＪｉｆ
Ａとを機能的に独立させたという相違点を有する。, In contrast to the conventional bonding apparatus described above, the present invention provides a #RJif bonding device that crimps the thin metal wire with the 1a top that guides it to the pad.
The difference is that it is functionally independent from A.
、Ｉ：、２目的を達成するため、本発明のボンディング
装置においては、金属細線を送り出す送り出しｎ横と、
送り出された金属細線を圧着する圧着機構と、前記送り
出し機構から送り出された金属細線をパッド上の前記圧
着機構の作用位置に誘導する誘導ｉ栴とを有するもので
ある。,I:,In order to achieve two objectives, the bonding device of the present invention has a feeding n side for feeding the thin metal wire,
The device has a crimping mechanism that crimps the thin metal wire fed out, and a guiding mechanism that guides the thin metal wire fed out from the feeding mechanism to a working position of the crimping mechanism on the pad.
以下に本発明の実施例を図によって説明する。 Embodiments of the present invention will be described below with reference to the drawings.
（実施例１）
第１図において、ｌは金ＢＩＩＩＩＩ線２の送りａ格と
してのキャピラリーである。キャピラリー１による金属
細線２の送り方向正面には金属測線２の圧着機構として
ウェッジ６が設；ｌされている０本実施例はウェッジ６
の直前にキャピラリー１から送り出された金属細線２を
ウェッジ６の作用位置に誘導する誘導機構５を設置した
ものである。誘導機構５はウェッジ６とは別個の駆動機
構（図示時）により上下送りが与えられ、その下端には
キャピラリー１から受（１入れた金属細線２をその下降
端で中心位置、すなわちウェッジ６の中心線の直下に導
く円弧状切欠きによるカイト５ａを有している。(Example 1) In FIG. 1, l is a capillary serving as a feeder for the gold BIII wire 2. A wedge 6 is provided in front of the capillary 1 in the feeding direction of the thin metal wire 2 as a crimping mechanism for the metal measuring line 2. In this embodiment, a wedge 6 is installed.
A guiding mechanism 5 is installed to guide the thin metal wire 2 sent out from the capillary 1 to the action position of the wedge 6 immediately before the operation. The guiding mechanism 5 is fed vertically by a drive mechanism (as shown) that is separate from the wedge 6, and its lower end receives the thin metal wire 2 from the capillary 1 (1 inserted therein) at the center position of the wedge 6 at its lower end. It has a kite 5a formed by an arc-shaped notch that leads directly below the center line.
実施例において、チップ３のパッド４１に金属細線２が
送り出されると、まず、誘導ａ梢５を下降させ、その下
端のガイド５ａ内に金属細線２を受入れて該細線２の誘
導方向を１６正するとともにパッド４上に金属細線２を
押下げ状態に保持し、次いでウェッジ６を下降させて該
金属細線２をパッド４上に圧着固定する。In the embodiment, when the thin metal wire 2 is sent out to the pad 41 of the chip 3, first, the guide a tree 5 is lowered, the thin metal wire 2 is received in the guide 5a at the lower end, and the guiding direction of the thin wire 2 is changed by 16 degrees. At the same time, the thin metal wire 2 is held down on the pad 4, and then the wedge 6 is lowered to press and fix the thin metal wire 2 onto the pad 4.
（実７１例２） 第２図は本発明の第２の実施例を示す外観図である。(Actual 71 cases 2) FIG. 2 is an external view showing a second embodiment of the present invention.
本実施例は誘導機構を角筒型とし、圧着機構に外装した
例を示している。すなわち、ウェッジ６を内包して上下
動可能に設置しノご誘導機構８をウェッジ６とともに」
１方に待機させたものである。This embodiment shows an example in which the guiding mechanism is of a rectangular tube type and is externally mounted on the crimping mechanism. In other words, the wedge 6 is enclosed and installed so that it can move up and down, and the saw guiding mechanism 8 is installed together with the wedge 6.
One side was kept on standby.
誘導機構８の下部先端には第１の実施例同様にカイト８
ａとして円弧状切欠きが形成されている。A kite 8 is attached to the lower tip of the guiding mechanism 8 as in the first embodiment.
An arcuate notch is formed as a.
キャピラリー１から送り出された金属細線２をチップ３
のパッド４ヘボンデインクできるようパッド４上へ移動
させ、ウェッジ６を覆いかつ独立して動くよう収り付け
られた誘導機構８で押し下げてそのままパッド４に半固
定し、続いて該誘導装置８内のウェッジ６を下降させて
金属細線２をパッド４に圧着固定する要領は同じである
が、本実施例ではウェッジ６の軸心をはさんで前後２個
所で金属細線２を押えることができる。The thin metal wire 2 sent out from the capillary 1 is connected to the tip 3
The pad 4 is moved onto the pad 4 so that it can be deinked, and the guiding mechanism 8 that covers the wedge 6 and is housed so as to move independently pushes it down and semi-fixes it to the pad 4. The method of lowering the wedge 6 and crimping and fixing the thin metal wire 2 to the pad 4 is the same, but in this embodiment, the thin metal wire 2 can be pressed at two locations, front and back, across the axis of the wedge 6.
さらに本実施例では、例えば誘導機構８をバネなどを介
してウェッジ６を支持固定している機構と接続してウェ
ッジ６の駆動装置を利用することによりウェッジの下降
に先立って下降させることができ、ひいては、従来のボ
ンディング装置の機構をそのまま利用できるという利点
がある。Furthermore, in this embodiment, by connecting the guiding mechanism 8 to a mechanism that supports and fixes the wedge 6 via a spring or the like, and using the driving device of the wedge 6, the wedge can be lowered prior to lowering. Furthermore, there is an advantage that the mechanism of a conventional bonding device can be used as is.
以上説明したように本発明は、金ｍ細線を圧着機構に導
く機構を別個に装備することにより、ボンディング装置
の圧着工程を容易にしかも確実に行うことができ、製品
の信頼性を向上させる効果がある。As explained above, the present invention has the effect of improving the reliability of the product by separately equipping the mechanism for guiding the thin gold wire to the crimping mechanism, thereby making it possible to perform the crimping process of the bonding device easily and reliably. There is.
第１図は本発明の第１の実施例を示す外観図、第２図は
本発明の第２の実施例を示す外観図、第３図は従来例を
示す外観図である。
１・・・キャピラリー ２・・・金属＋ｌ１ｌＩ線
３・・・チップ
４・・・パッド
５．８・・・誘導装置
５ａ、８ａ・・・ガイド
６・・・ウエッジFIG. 1 is an external view showing a first embodiment of the present invention, FIG. 2 is an external view showing a second embodiment of the present invention, and FIG. 3 is an external view showing a conventional example. 1... Capillary 2... Metal +l1lI wire 3... Chip 4... Pad 5.8... Guidance device 5a, 8a... Guide 6... Wedge
Claims (1)
た金属細線を圧着する圧着機構と、前記送り出し機構か
ら送り出された金属細線をパッド上の前記圧着機構の作
用位置に誘導する誘導機構とを有することを特徴とする
ボンディング装置。(1) It has a feeding mechanism that feeds out a thin metal wire, a crimping mechanism that crimps the fed thin metal wire, and a guiding mechanism that guides the thin metal wire fed out from the feeding mechanism to a working position of the crimping mechanism on the pad. A bonding device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63186193A JPH0235748A (en) | 1988-07-26 | 1988-07-26 | Bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63186193A JPH0235748A (en) | 1988-07-26 | 1988-07-26 | Bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235748A true JPH0235748A (en) | 1990-02-06 |
Family
ID=16184012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63186193A Pending JPH0235748A (en) | 1988-07-26 | 1988-07-26 | Bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235748A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60226859A (en) * | 1984-04-25 | 1985-11-12 | Otsuka Pharmaceut Co Ltd | Oxyindole derivative |
-
1988
- 1988-07-26 JP JP63186193A patent/JPH0235748A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60226859A (en) * | 1984-04-25 | 1985-11-12 | Otsuka Pharmaceut Co Ltd | Oxyindole derivative |
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