JPS61113250A - Wire connecting process of wire bonder - Google Patents

Wire connecting process of wire bonder

Info

Publication number
JPS61113250A
JPS61113250A JP59236282A JP23628284A JPS61113250A JP S61113250 A JPS61113250 A JP S61113250A JP 59236282 A JP59236282 A JP 59236282A JP 23628284 A JP23628284 A JP 23628284A JP S61113250 A JPS61113250 A JP S61113250A
Authority
JP
Japan
Prior art keywords
wire
capillary
clamping means
contact
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59236282A
Other languages
Japanese (ja)
Inventor
Tetsukazu Inoue
哲一 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59236282A priority Critical patent/JPS61113250A/en
Publication of JPS61113250A publication Critical patent/JPS61113250A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE:To make it feasible to let out a wire at minimum specified length without fail by a method wherein a wire is temporarily clamped on the way of wire bonding process by means of temporarily clamping the wire on the way of pressure-fixing the wire from the first contact to the second contact. CONSTITUTION:An end of wire 6 is pressure-fixed to a bonding pad 4a and then a capillary 2 and clamping means 3 are relatively shifted in parallel with a stage while lifting the capillary 2 to be located on the position above a lead wire 5. The wire 6 may be let out at specified length by this shifting process. Later the wire 6 is clamped by the clamping means 3 while the capillary 2 is on the way of descending further descending together with the lead wire 5 heating for pressure-fixing the middle part of wire 6 to the lead wire 5. Successively the clamping means 3 is once released and then the wire 6 on the way of ascending is clamped again by the clamping means 3 and when the wire 6 is ascending together with the capillary 2, the wire 6 is cut off at the pressure- fixing part of lead wire 5 to be bonded on a chip 4. Through these procedures, the specified looping process may be performed to prevent any shortcircuit, etc. from occuring without fail since any wire sagging may be prevented certainly.

Description

【発明の詳細な説明】 （イ）産業上の利用分野 この発明は、ワイヤボンダにおいて、ワイヤを接続する
ワイヤ接続方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application This invention relates to a wire connection method for connecting wires in a wire bonder.

（ロ）従来の技術 従来より例えば、ＩＣチップとパッケージのリード線と
をワイヤボンディングするワイヤボンダは、Ｘ−Ｙ方向
に移動するステージの上方にキャピラリとクランプ手段
とが設けられ、このステージにチップとリード線とが設
けられる一方、クランプ手段とキャピラリを貫通してＡ
ｕワイヤが設けられて構成されている。そして、クラン
プ手段のワイヤクランプを解除した後、キャピラリを下
降してワイヤ先端をチップ（第１接点）に圧着し、キャ
ピラリを上昇させると共にステージを移動し、その後、
再びキャピラリを下降してワイヤ途中をリード線（第２
接点）に圧着した後、ワイヤをクランプ手段でクランプ
してこのクランプ手段と共にキャピラリを上昇し、ワイ
ヤボンディングが完了する。(B) Conventional technology Conventionally, for example, a wire bonder for wire bonding an IC chip and a lead wire of a package has a capillary and a clamping means provided above a stage that moves in the X-Y direction, and the chip and A lead wire is provided, while passing through the clamping means and the capillary.
It is configured with a u-wire. After releasing the wire clamp of the clamping means, the capillary is lowered and the tip of the wire is crimped to the chip (first contact), the capillary is raised and the stage is moved, and then,
Descend the capillary again and connect the lead wire (second
After the wire is crimped to the contact point), the wire is clamped by a clamping means, and the capillary is raised together with the clamping means, thereby completing wire bonding.

（ハ）発明が解決しようとする問題点 上述したワイヤボンダにおいて、クランプ手段でワイヤ
をクランプするときは、ワイヤボンディングの初期と後
期で、キャピラリの最初の下降前と最後の上昇前である
。従って、キャピラリがワイヤをチップからリード線に
圧着するまでワイヤクランプが解除され、ワイヤが所定
長さ繰出されるようにワイヤにテンシランをかけないよ
うになっていた。(c) Problems to be Solved by the Invention In the wire bonder described above, the wire is clamped by the clamping means at the beginning and end of wire bonding, before the first descent of the capillary and before the final rise. Therefore, the wire clamp was released until the capillary crimped the wire from the chip to the lead wire, and the wire was not tensioned so that the wire could be paid out a predetermined length.

しかし、これでは、ワイヤが所定長さ以上に繰出されて
、所定のルーピングが行われないという問題があった。However, this has the problem that the wire is drawn out beyond a predetermined length and the predetermined looping cannot be performed.

つまり、Ａｕワイヤは可撓性があるので、必要以上に繰
出されると、チップとり−ド線間でほぼ半円弧状に起立
できず、垂れが生じて他の部分に接する場合があり、そ
のまま製品となると、ショートを起こすという問題があ
った。In other words, since the Au wire is flexible, if it is unwound more than necessary, it will not be able to stand up in an almost semicircular arc shape between the tip wire and the lead wire, and it may sag and come in contact with other parts. When it came to products, there was a problem of short circuits.

この発明は、斯かる点に鑑み、ワイヤボンディング途中
でワイヤを一時クランプすることにより、ワイヤが最小
限の所定長さに正確に繰出されるようにしたワイヤボン
ダにおけるワイヤ接続方法を提供することを目的とする
ものである。In view of the above, an object of the present invention is to provide a wire connection method in a wire bonder, in which the wire is temporarily clamped during wire bonding so that the wire is accurately paid out to a minimum predetermined length. That is.

（ニ）問題点を解決するための手段及び作用この発明は
、ステージ上に被接続材が設置される一方、このステー
ジの上方にワイヤが貫通したキャピラリが上下移動自在
に設けられると共に、このキャピラリの上方にワイヤの
クランプ手段が上下移動自在に設けられ、キャピラリ及
びクランプ手段をステージに対して相対的に平行移動す
ると共に、上下動して前記被接続材の第１接点と第２接
点間にワイヤをボンディングするワイヤボンダにおいて
、前記キャピラリ及びクランプ手段を第１接点の上方に
位置し、クランプ手段のワイヤクランプを解除し、キャ
ピラリを下降し、ワイヤを繰出して先端部を第１接点に
圧着した後、キャピラリを上昇すると同時に第２接点の
上方位置にクランプ手段と共に移動してワイヤを所定長
さ繰出し、その後、再びキャピラリを下降し、このキャ
ピラリの下降途中でクランプ手段を動作してワイヤをク
ランプした後、キャピラリと共にクランプ手段を下降し
、ワイヤ途中を第２接点に圧着し、その−後、キャピラ
リ及びクランプ手段の上昇、クランプ手段のワイヤクラ
ンプ並びにワイヤの切断を行うように構成されている。(d) Means and operation for solving the problem In the present invention, a material to be connected is installed on a stage, and a capillary through which a wire passes is provided above the stage so as to be movable up and down. A wire clamping means is provided above so as to be movable up and down, and the capillary and the clamping means are moved parallel to the stage and moved up and down to connect the first contact point and the second contact point of the material to be connected. In a wire bonder for bonding wires, the capillary and the clamping means are positioned above the first contact, the wire clamp of the clamping means is released, the capillary is lowered, the wire is fed out, and the tip is crimped to the first contact. At the same time as the capillary was raised, it was moved together with the clamping means to a position above the second contact to feed out the wire for a predetermined length, and then the capillary was lowered again, and while the capillary was being lowered, the clamping means was operated to clamp the wire. After that, the clamping means is lowered together with the capillary, and the middle of the wire is crimped to the second contact point, and then the capillary and the clamping means are raised, the clamping means clamps the wire, and the wire is cut.

（ホ）実施例 以下、この発明の一実施例について、図面に基づき詳細
に説明する。(e) Example Hereinafter, an example of the present invention will be described in detail based on the drawings.

先ず、第２図に示すように、ワイヤボンダ１について説
明すると、このワイヤボンダ１は、図示しないステージ
上方にキャピラリ２とクランプ手段３とを備えている。First, as shown in FIG. 2, the wire bonder 1 will be described. The wire bonder 1 is equipped with a capillary 2 and a clamping means 3 above a stage (not shown).

このステージは、Ｘ−Ｙ方向に水平移動するように構成
されており、第１図に示すように、上面にＩＣチップ４
とパッケージのリード線５とが所定間隔を存して設置さ
れるようになっている。This stage is configured to move horizontally in the X-Y direction, and as shown in FIG.
and the lead wires 5 of the package are installed with a predetermined interval between them.

キャピラリ２は、ワイヤ６が貫挿されており、上下移動
自在に設けられている。クランプ手段３は、キャピラリ
２の直上方に上下移動自在に設けられ、ワイヤ６を挟持
してクランプすると共に、そのクランプを解除するよう
に構成されている。A wire 6 is inserted through the capillary 2, and the capillary 2 is provided so as to be movable up and down. The clamping means 3 is provided directly above the capillary 2 so as to be vertically movable, and is configured to clamp the wire 6 and release the clamp.

ワイヤ６はＡｕワイヤで、直径が例えば３０μｍ〜２５
μｍに形成され、ボビン７に巻回されており、このボビ
ン７の６管を通り、ガイド８を介してクランプ手段３及
びキャピラリ２をＭ通している。The wire 6 is an Au wire, and has a diameter of, for example, 30 μm to 25 μm.
.mu.m and is wound around a bobbin 7, passing through the six tubes of this bobbin 7, and passing the clamp means 3 and capillary 2 through the guide 8.

次に、このワイヤボンダ１によるワイヤ接続方法を第１
図に基づいて説明する。Next, the wire bonding method using this wire bonder 1 will be explained as follows.
This will be explained based on the diagram.

先ず、第１図（ａ）に示すように、ワイヤボンディング
の初期において、クランプ手段３はワイヤ６をクランプ
しており、ワイヤ６の先端はキャピラリ２より突出して
球形に形成されている。そして、キャピラリ２の真下に
ｒＣチップ４のポンディングパッド４ａ（第１接点）が
位置し、チップ４０側方にリード線５の端部（第２接点
）が位置している。First, as shown in FIG. 1(a), at the initial stage of wire bonding, the clamping means 3 clamps the wire 6, and the tip of the wire 6 protrudes from the capillary 2 and is formed into a spherical shape. The bonding pad 4a (first contact) of the rC chip 4 is located directly below the capillary 2, and the end of the lead wire 5 (second contact) is located on the side of the chip 40.

この状態より第１図（ｂ）に示すように、クランプ手段
３のクランプを解除した後、キャピラリ２を下降してチ
ップ４のポンディングパッド４ａに圧接し、加熱してワ
イヤ６の先端をポンディングパッドに圧着する。続いて
、キャピラリ２を上昇させると共に第１図（ｃ）に示す
ようにステージを移動してキャピラリ２及びクランプ手
段３をステージに対して相対的に平行移動し、リード線
５の上方に位置させる。この移動によりワイヤ６が所定
長さ繰出されることになる。From this state, as shown in FIG. 1(b), after releasing the clamp of the clamping means 3, the capillary 2 is lowered and brought into pressure contact with the bonding pad 4a of the chip 4, and heated to pump the tip of the wire 6. Crimp it onto the dinging pad. Subsequently, the capillary 2 is raised and the stage is moved as shown in FIG. . This movement causes the wire 6 to be paid out a predetermined length.

その後、キャピラリ２を下降して、その下降途中におい
て第１図（ｄ）に示すようにクランプ手段３でワイヤ６
をクランプし、このクランプ手段３をキャピラリ２と共
に下降してキャピラリ２をリード線５に圧接し、加熱し
てワイヤ６の途中をリード線５に圧着する。Thereafter, the capillary 2 is lowered, and as shown in FIG. 1(d), the wire 6 is
The clamping means 3 is lowered together with the capillary 2 to press the capillary 2 to the lead wire 5, and is heated to press the middle of the wire 6 to the lead wire 5.

引き続いて、第１図（ｅ）に示すように、クランプ手段
３のクランプを解除し、その上昇途中で第１図（ｆ）に
示すように再びクランプ手段３でワイヤ６をクランプす
る。そして、第１１Ｎ（ｇ）に示すように、クランプ手
段３をキャピラリ２と共に上昇すると、ワイヤ６がリー
ド線５の圧着部で切断され、チップ４とリード線５とが
ワイヤポンディングされる。Subsequently, as shown in FIG. 1(e), the clamping of the clamping means 3 is released, and the wire 6 is again clamped by the clamping means 3 as shown in FIG. 1(f) during its ascent. Then, as shown in 11N(g), when the clamping means 3 is raised together with the capillary 2, the wire 6 is cut at the crimped portion of the lead wire 5, and the chip 4 and the lead wire 5 are wire bonded.

最後に、第１図（ｈ）に示すように水素トーチ９でワイ
ヤ６の先端を加熱し、第１図（ｉ）に示すようにワイヤ
６の先端を球形に形成して完了する。この動作をステー
ジを移動して繰返すことになる。Finally, the tip of the wire 6 is heated with a hydrogen torch 9 as shown in FIG. 1(h), and the tip of the wire 6 is formed into a spherical shape as shown in FIG. 1(i). This operation will be repeated by moving the stage.

尚、クランプ手段３のクランプタイミングは、２つのカ
ムを用いた所謂合わせカムで調節し、ワイヤ６の長さや
キャピラリ２の上昇高さを考慮し、キャピラリ２の下降
途中でクランプするように構成されている。The clamping timing of the clamping means 3 is adjusted by a so-called matching cam using two cams, and the clamping means 3 is configured to clamp the capillary 2 during its descent, taking into account the length of the wire 6 and the height of the capillary 2. ing.

尚また、この実施例の被接続材はＩＣチップとリード線
５としたが、この発明は、各種の電子部品のワイヤボン
ディングに通用することができる。Furthermore, although the materials to be connected in this embodiment are an IC chip and the lead wire 5, the present invention can be applied to wire bonding of various electronic components.

更に、ワイヤ６の切断等は、実施例に限られないことは
勿論である。Furthermore, it goes without saying that the cutting of the wire 6 and the like are not limited to the embodiments.

（へ）発明の効果 以上のように、この発明によれば、ワイヤを第ｘＷ点か
ら第２接点に圧着する途中で、ワイヤを一時クランプす
るようにしたために、ワイヤが常に所定長さ宛繰出され
ることになるので、所定のルーピングが行われ、ワイヤ
の垂れが確実に防止されるから、ショート等を生起する
不良品の作製が確実に防止することができる。(f) Effects of the Invention As described above, according to the present invention, the wire is temporarily clamped while the wire is being crimped from the xW point to the second contact, so that the wire is always fed out to a predetermined length. Therefore, a predetermined looping is performed and the wire is reliably prevented from sagging, so that it is possible to reliably prevent the production of defective products that may cause short circuits or the like.

また、ワイヤの長さを制御できるので、径の小さいワイ
ヤを用いることができる。Furthermore, since the length of the wire can be controlled, a wire with a small diameter can be used.

【図面の簡単な説明】 第１図及び第２図は、この発明の一実施例を示し、第１
図（ａ）　　（ｂ）　　（ｃ）　　（ｄ）（ｅ）（ｆ）
（ｇ）（ｈ）（ｉ）はそれぞれワイヤ接続動作を示すワ
イヤボンダの概略正面図、第２図は、同概略側面図であ
る。 １：ワイヤボンダ、　２：キャピラリ、３：クランプ手
段、　４：ＩＣチップ、５：リード線、　　　　６：ワ
イヤ。[BRIEF DESCRIPTION OF THE DRAWINGS] FIGS. 1 and 2 show an embodiment of the present invention.
Figures (a) (b) (c) (d) (e) (f)
(g), (h), and (i) are schematic front views of the wire bonder showing wire connection operations, respectively, and FIG. 2 is a schematic side view of the wire bonder. 1: wire bonder, 2: capillary, 3: clamp means, 4: IC chip, 5: lead wire, 6: wire.

Claims (1)

【特許請求の範囲】[Claims] （１）ステージ上に被接続材が設置される一方、このス
テージの上方にワイヤが貫通したキャピラリが上下移動
自在に設けられると共に、このキャピラリの上方にワイ
ヤのクランプ手段が上下移動自在に設けられ、キャピラ
リ及びクランプ手段をステージに対して相対的に平行移
動すると共に、上下動して前記被接続材の第１接点と第
２接点間にワイヤをボンディングするワイヤボンダにお
いて、前記キャピラリ及びクランプ手段を第１接点の上
方に位置し、クランプ手段のワイヤクランプを解除し、
キャピラリを下降し、ワイヤを繰出して先端部を第１接
点に圧着した後、キャピラリを上昇すると同時に第２接
点の上方位置にクランプ手段とともに移動して、ワイヤ
を所定長さ繰出し、その後、再びキャピラリを下降し、
このキャピラリの下降途中でクランプ手段を動作してワ
イヤをクランプした後、キャピラリと共にクランプ手段
を下降し、ワイヤ途中を第２接点に圧着し、クランプ手
段のワイヤクランプを解除し、その後、キャピラリ及び
クランプ手段の上昇、クランプ手段のワイヤクランプ並
びにワイヤの切断を行うことを特徴とするワイヤボンダ
におけるワイヤ接続方法。(1) While the material to be connected is placed on a stage, a capillary through which a wire passes is provided above the stage so as to be movable up and down, and a clamping means for the wire is provided above the capillary so as to be movable up and down. , a wire bonder in which a capillary and a clamping means are moved in parallel relative to a stage and moved up and down to bond a wire between a first contact and a second contact of the material to be connected; 1, and releases the wire clamp of the clamping means,
The capillary is lowered, the wire is fed out, and the tip is crimped to the first contact, and then the capillary is raised and simultaneously moved to a position above the second contact with the clamping means to feed out the wire for a predetermined length, and then the wire is drawn out again. descend,
After operating the clamping means to clamp the wire while the capillary is descending, the clamping means is lowered together with the capillary, crimping the wire midway to the second contact, releasing the wire clamp of the clamping means, and then removing the capillary and the clamp. A method for connecting wires in a wire bonder, characterized by raising a means, clamping a wire using a clamping means, and cutting the wire.
JP59236282A 1984-11-08 1984-11-08 Wire connecting process of wire bonder Pending JPS61113250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59236282A JPS61113250A (en) 1984-11-08 1984-11-08 Wire connecting process of wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59236282A JPS61113250A (en) 1984-11-08 1984-11-08 Wire connecting process of wire bonder

Publications (1)

Publication Number Publication Date
JPS61113250A true JPS61113250A (en) 1986-05-31

Family

ID=16998473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59236282A Pending JPS61113250A (en) 1984-11-08 1984-11-08 Wire connecting process of wire bonder

Country Status (1)

Country Link
JP (1) JPS61113250A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501648A (en) * 1973-05-07 1975-01-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501648A (en) * 1973-05-07 1975-01-09

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