JPS62285435A - Wedge-type wire bonder - Google Patents
Wedge-type wire bonderInfo
- Publication number
- JPS62285435A JPS62285435A JP61129576A JP12957686A JPS62285435A JP S62285435 A JPS62285435 A JP S62285435A JP 61129576 A JP61129576 A JP 61129576A JP 12957686 A JP12957686 A JP 12957686A JP S62285435 A JPS62285435 A JP S62285435A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wedge
- cut
- tip
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract 1
- 241000587161 Gomphocarpus Species 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は、半導体チップと外部指導量リードとを、金属
細線（以下ワイヤと称する）によって接続する際に用い
られるワイヤボンダに関する。特に、ワイヤを押しつけ
る部分の形状が大略くさび型であるウェッジ型のワイヤ
ボンダに関する。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention is used to connect a semiconductor chip and an external guidance lead using a thin metal wire (hereinafter referred to as wire). Regarding wire bonder. In particular, the present invention relates to a wedge-shaped wire bonder in which the shape of the portion that presses the wire is roughly wedge-shaped.
従来ウェッジタイプのワイヤボンダは通常釘頭状の接着
形状をもたない熱圧着方式ボンダ、超音波方式ボンダに
主として用いられている。こ、れは釘頭状の接着方式に
比べて接着面積をなるべく小さくしたいような場合に主
として用いられる。また、ワイヤの位置ぎめ方式によっ
て、■ウニ７ジとワイヤ位置決め機構が一体でないもの
、と■ウェッジ先端部にワイヤが通る穴が形成されてお
りそれがワイヤの位置決め機構となっているもの、の２
種類がある。Conventional wedge type wire bonders are mainly used in thermocompression type bonders and ultrasonic type bonders, which usually do not have a nail head-like bonding shape. This method is mainly used when it is desired to reduce the bonding area as much as possible compared to the nail head bonding method. In addition, depending on the wire positioning method, there are two types: (1) in which the wedge and wire positioning mechanism are not integrated, and (2) in which a hole is formed at the tip of the wedge for the wire to pass through, and this serves as the wire positioning mechanism. 2
There are different types.
上述した従来のウェッジ型ボンダは■のような場合は、
ボンディングの位置決めに非常に時間がかかるため量産
には不向きである。■のような場合はワイヤの切断位置
にバラツキを生じやすくさせる接続点におけるワイヤ強
度が弱くなりがちであるという欠点をもつ。これを詳し
く説明する。The conventional wedge type bonder described above is used in cases like ■.
It is not suitable for mass production because it takes a very long time to position the bonding. Case (2) has the disadvantage that the strength of the wire tends to be weak at the connection point, which tends to cause variations in the cutting position of the wire. This will be explained in detail.
■のような型のボンダにおいては、ウェッジ先端部にワ
イヤの先端を位置ぎめし、所望の箇所の第１魚目にそれ
を押しつけて、熱エネルギー超音波エネルギーなどを与
えて被着物とワイヤを接続する。つぎにワイヤを繰シ出
しつつ第２点目の接着箇所にウェッジを移動させ再び押
しつける。第１点目でワイヤ先端は接着されているから
第２点目ではウェッジはワイヤの途中を押しつけること
になる。第２点目を接着した後そこが配線の終了点なら
ばウェッジを押しつけた′１まワイヤをひっばりウェッ
ジ端でワイヤを切断する。当然のことであるがワイヤに
ひっばり力を加えられるのは、ウェッジに関して第１点
目と第２点目に張られたワイヤとは反対側にあるワイヤ
であり、切断される箇所は、その反対側にあるワイヤの
ウェッジとの接触点である。今ウェッジの先端の平な部
分のワイヤが切断される側の端をバックエッヂその反対
側の端をフロントエッヂと名づけると、ワイヤはバック
エッヂの側で切断されてつぎのボンディングの先端部が
出来るわけである。第２点目におけるバックエッヂ側の
ワイヤ強度が強い場合、ひっばられたワイヤの切断箇所
にはバラツキが生じや丁くひどい場合ではバックエッヂ
の近傍からはずれた箇所で切断してしまう場合がある。In the type of bonder shown in (2), the tip of the wire is positioned at the tip of the wedge, pressed against the first groove at the desired location, and heat energy, ultrasonic energy, etc. are applied to bond the adherend and the wire. Connecting. Next, while feeding out the wire, move the wedge to the second bonding point and press it again. Since the tip of the wire is glued at the first point, the wedge will press down on the middle of the wire at the second point. After gluing the second point, if this is the end point of the wiring, press the wedge on the wire and cut the wire at the end of the wedge. Naturally, the tension force is applied to the wire on the opposite side of the wedge from the wires stretched at the first and second points, and the part that is cut is the one on the opposite side of the wedge. This is the point of contact with the wire wedge on the opposite side. If we call the flat end of the wedge where the wire is cut the back edge and the opposite end the front edge, the wire will be cut at the back edge and the next bonding tip will be created. That's why. If the strength of the wire on the back edge side is strong in the second point, the stretched wire may be cut at different points, and in severe cases, it may be cut at a point away from the vicinity of the back edge. .
切断後のワイヤの位置切めはある一定長さ分のワイヤを
繰９出してやってフロントエッチよシ若干前のあたりに
ワイヤの先端がくるようになされるが、上記のように切
断位置にバラツキが出るとこの先端の位置にもバラツキ
が生じてくる。ワイヤ先端がフロントエッチよシ前に出
ないまま接続作業に入ると正常な場合に比べて単位長さ
当りの荷重、超音波エネルギーなどが大きくなり、必然
的にワイヤの変形量が大きくなって接続点のネックで切
断しやすくなってしまう。After cutting, the position of the wire is cut by letting out a certain length of wire so that the tip of the wire is slightly in front of the front etch, but as mentioned above, the cutting position varies. When this happens, the position of this tip will also vary. If you start the connection work without the wire tip coming out in front of the front etch, the load per unit length, ultrasonic energy, etc. will be larger than in the normal case, and the amount of deformation of the wire will inevitably increase, making the connection difficult. The neck of the point makes it easy to cut.
第２点目におけるバックエッヂ側のワイヤ強度が偶い場
合、前述したような不具合はなくなるが、第１点目のワ
イヤのネックが弱いことになり信頼点上の問題になりや
すい。If the wire strengths on the back edge side at the second point are even, the above-mentioned problem will disappear, but the neck of the wire at the first point will be weak, which will easily lead to reliability problems.
本発明は従来のこのような欠点を除去するためになされ
たもので、ウェッジ型ワイヤボンダにおいて所望の箇所
に接続を完了した後、ワイヤ表面にウェッジ先端を固定
したまま接続面に対するウェッジ角度を変える機構を有
している。The present invention was made in order to eliminate such drawbacks of the conventional wedge wire bonder, and provides a mechanism for changing the angle of the wedge relative to the connection surface while keeping the wedge tip fixed to the wire surface after completing the connection at a desired location in a wedge-type wire bonder. have.
第１図は本発明の一実施例の部分図であり、第２図は従
来のボンダの相当する部分図である。FIG. 1 is a partial view of one embodiment of the present invention, and FIG. 2 is a corresponding partial view of a conventional bonder.
ウェッジ１がウェッジを支える支持棒２にネジ３で固定
され、ワイヤ４がウェッジ先端近傍の穴５に通されてい
るのは第２図の従来ポンダと同じであるが、支持棒が２
つの部分に分かれており、その２つの部分が折れ曲がり
が出来るようにビン６で接続されており、また一体とし
て働くようにする補助棒７が付加されている。通常のボ
ンディング作業時は２つの部分をつなぐように補助棒が
差し込まれており、切断すべき時はこの補助棒をひきぬ
くとビンによってウェッジ先端のバックウェッジが押し
つりられるようにウェッジ角度が変わるようになる。The wedge 1 is fixed to a support rod 2 that supports the wedge with a screw 3, and the wire 4 is passed through a hole 5 near the tip of the wedge, as in the conventional ponder shown in FIG.
It is divided into two parts, and the two parts are connected by a pin 6 so that they can be bent, and an auxiliary rod 7 is added to make them work as one unit. During normal bonding work, an auxiliary rod is inserted to connect two parts, and when it is time to cut, when this auxiliary rod is pulled out, the wedge angle changes so that the back wedge at the tip of the wedge is pushed by the pin. It becomes like this.
以上に説明したように、本発明は接続を行った後、接続
面に対するウェッジ角度が変えられるようになっている
ため、ワイヤ切断すべき箇所でバックェツジを押しつけ
るようにウェッジ角度をかえ、ワイヤの変形量を大きく
できる。このため、第１点目のワイヤのネック部は強い
ままワイヤ切断すべき箇所でバラツキが少くワイヤ切断
をすることが出来るようになった。As explained above, in the present invention, after the connection is made, the wedge angle relative to the connection surface can be changed, so the wedge angle is changed so as to press the back wedge at the point where the wire is to be cut, thereby deforming the wire. You can increase the amount. For this reason, it is now possible to cut the wire with less variation in the location where the wire should be cut while keeping the neck portion of the first wire strong.
第１図は本発明の一実施例の部分図、第２図は従来の同
じ箇所の部分図である。
１・・・・・・ウェッジ、２・・・・・・支持棒、３・
・・・・・とめネジ、４・・・・・・ワイヤ、５・・・
・・・ウェッジの穴、６・・・・・・ビン、７・・・・
・・補助棒、８・・・・・・フロントエツジ、９・・・
・・・バックェツジ。FIG. 1 is a partial view of one embodiment of the present invention, and FIG. 2 is a partial view of the same portion of the conventional device. 1...Wedge, 2...Support rod, 3.
...Set screw, 4...Wire, 5...
...Wedge hole, 6...Bin, 7...
...Auxiliary rod, 8...Front edge, 9...
...back tsuji.
Claims (1)
表面にウェッジを固定したままボンディング面に対する
ウェッジ角度が変えられる機構を持つことを特徴とする
ウェッジ型ワイヤボンダ。A wedge-type wire bonder characterized by having a mechanism that allows the angle of the wedge relative to the bonding surface to be changed while the wedge is fixed to the wire surface after the wire bonding work is completed at the wire bonding point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61129576A JPS62285435A (en) | 1986-06-03 | 1986-06-03 | Wedge-type wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61129576A JPS62285435A (en) | 1986-06-03 | 1986-06-03 | Wedge-type wire bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62285435A true JPS62285435A (en) | 1987-12-11 |
Family
ID=15012879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61129576A Pending JPS62285435A (en) | 1986-06-03 | 1986-06-03 | Wedge-type wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62285435A (en) |
-
1986
- 1986-06-03 JP JP61129576A patent/JPS62285435A/en active Pending
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