JPH0235451B2 - - Google Patents
Info
- Publication number
- JPH0235451B2 JPH0235451B2 JP57018667A JP1866782A JPH0235451B2 JP H0235451 B2 JPH0235451 B2 JP H0235451B2 JP 57018667 A JP57018667 A JP 57018667A JP 1866782 A JP1866782 A JP 1866782A JP H0235451 B2 JPH0235451 B2 JP H0235451B2
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- irradiation
- start position
- deflector
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013078 crystal Substances 0.000 claims description 33
- 238000010894 electron beam technology Methods 0.000 claims description 33
- 239000004065 semiconductor Substances 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 12
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/16—Heating of the molten zone
- C30B13/22—Heating of the molten zone by irradiation or electric discharge
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1866782A JPS58135629A (ja) | 1982-02-08 | 1982-02-08 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1866782A JPS58135629A (ja) | 1982-02-08 | 1982-02-08 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58135629A JPS58135629A (ja) | 1983-08-12 |
JPH0235451B2 true JPH0235451B2 (fr) | 1990-08-10 |
Family
ID=11977955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1866782A Granted JPS58135629A (ja) | 1982-02-08 | 1982-02-08 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58135629A (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61234034A (ja) * | 1985-04-10 | 1986-10-18 | Agency Of Ind Science & Technol | 半導体単結晶層の製造方法 |
JPH0242717A (ja) * | 1988-08-03 | 1990-02-13 | Hitachi Ltd | エネルギービーム照射方法 |
US5322589A (en) * | 1989-02-09 | 1994-06-21 | Fujitsu Limited | Process and apparatus for recrystallization of semiconductor layer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55150238A (en) * | 1979-05-10 | 1980-11-22 | Matsushita Electric Ind Co Ltd | Method of irradiating laser beam |
-
1982
- 1982-02-08 JP JP1866782A patent/JPS58135629A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55150238A (en) * | 1979-05-10 | 1980-11-22 | Matsushita Electric Ind Co Ltd | Method of irradiating laser beam |
Also Published As
Publication number | Publication date |
---|---|
JPS58135629A (ja) | 1983-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5371381A (en) | Process for producing single crystal semiconductor layer and semiconductor device produced by said process | |
JP4263403B2 (ja) | シリコン結晶化方法 | |
JPS58164219A (ja) | 積層型半導体装置の製造方法 | |
JPH0235451B2 (fr) | ||
JPH0136972B2 (fr) | ||
JPS58180019A (ja) | 半導体基体およびその製造方法 | |
JPH0236050B2 (fr) | ||
JPS60246621A (ja) | シリコン結晶層の製造方法 | |
JPH04380B2 (fr) | ||
JPS6159820A (ja) | 半導体装置の製造方法 | |
JPH0136688B2 (fr) | ||
JPH0368532B2 (fr) | ||
JPH0371767B2 (fr) | ||
JPH0337729B2 (fr) | ||
JPS62226621A (ja) | 単結晶シリコン薄膜形成方法 | |
JPS63265464A (ja) | 半導体装置の製造方法 | |
JPS60176220A (ja) | 半導体装置の製造方法 | |
JPS59224114A (ja) | 単結晶半導体薄膜の製造方法 | |
JPH0136244B2 (fr) | ||
JPS62130509A (ja) | 半導体基体の製造方法 | |
JPS62130510A (ja) | 半導体基体の製造方法 | |
JPS62206817A (ja) | 半導体装置 | |
JPH0797556B2 (ja) | Soi基板の製造方法 | |
JPS60191090A (ja) | 半導体装置の製造方法 | |
JPH0377654B2 (fr) |