JPH0233439U - - Google Patents
Info
- Publication number
- JPH0233439U JPH0233439U JP11098788U JP11098788U JPH0233439U JP H0233439 U JPH0233439 U JP H0233439U JP 11098788 U JP11098788 U JP 11098788U JP 11098788 U JP11098788 U JP 11098788U JP H0233439 U JPH0233439 U JP H0233439U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- semiconductor device
- underpassivation
- overpassivation
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 238000002161 passivation Methods 0.000 claims 2
Landscapes
- Local Oxidation Of Silicon (AREA)
Description
第１図は本考案の実施例に係る半導体素子の概
略構成を示す断面図、第２図は従来例の半導体素
子の概略構成を示す断面図である。
２……半導体素子本体、４……スクライブライ
ン、６……内部回路配線用ボンデイングパツド部
、８……固定電位線用ボンデイングパツド部、１
０……アンダーパシベーシヨン、１２……オーバ
ーパシベーシヨン、１４……導電体。
FIG. 1 is a sectional view showing a schematic structure of a semiconductor device according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a schematic structure of a conventional semiconductor device. 2... Semiconductor element body, 4... Scribe line, 6... Bonding pad part for internal circuit wiring, 8... Bonding pad part for fixed potential line, 1
0... Underpassivation, 12... Overpassivation, 14... Conductor.
Claims (1)
て内部回路配線用と固定電位線用との少なくとも
２つのボンデイングパツド部を有するとともに、
前記両ボンデイングパツド部を除く部分にパシベ
ーシヨンが形成されている半導体素子であつて、 前記パシベーシヨンをアンダーパシベーシヨン
とするとともに、前記内部回路配線用ボンデイン
グパツド部と前記アンダーパシベーシヨンとの上
にオーバーパシベーシヨンを形成し、かつそのオ
ーバーパシベーシヨンを導電体で覆い、さらに、
その導電体を前記固定電位線用ボンデイングパツ
ド部および／または前記スクライブラインに接続
したことを特徴とする半導体素子。[Claims for Utility Model Registration] Having at least two bonding pads for internal circuit wiring and fixed potential wires on the surface of the main body surrounded by scribe lines,
A semiconductor device in which a passivation is formed in a portion excluding both bonding pad portions, wherein the passivation is an underpassivation, and a bonding pad portion for internal circuit wiring and the underpassivation are formed. forming an overpassivation thereon, and covering the overpassivation with a conductor;
A semiconductor device characterized in that the conductor is connected to the fixed potential line bonding pad portion and/or the scribe line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110987U JP2542206Y2 (en) | 1988-08-24 | 1988-08-24 | Semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988110987U JP2542206Y2 (en) | 1988-08-24 | 1988-08-24 | Semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0233439U true JPH0233439U (en) | 1990-03-02 |
| JP2542206Y2 JP2542206Y2 (en) | 1997-07-23 |
Family
ID=31348647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988110987U Expired - Lifetime JP2542206Y2 (en) | 1988-08-24 | 1988-08-24 | Semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2542206Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62156819A (en) * | 1985-12-28 | 1987-07-11 | Nec Corp | Semiconductor device |
-
1988
- 1988-08-24 JP JP1988110987U patent/JP2542206Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62156819A (en) * | 1985-12-28 | 1987-07-11 | Nec Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2542206Y2 (en) | 1997-07-23 |