JPH0233437U - - Google Patents
Info
- Publication number
- JPH0233437U JPH0233437U JP11267188U JP11267188U JPH0233437U JP H0233437 U JPH0233437 U JP H0233437U JP 11267188 U JP11267188 U JP 11267188U JP 11267188 U JP11267188 U JP 11267188U JP H0233437 U JPH0233437 U JP H0233437U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- electrode
- holes
- sorting device
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005259 measurement Methods 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11267188U JPH0233437U (US07847105-20101207-C00016.png) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11267188U JPH0233437U (US07847105-20101207-C00016.png) | 1988-08-26 | 1988-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233437U true JPH0233437U (US07847105-20101207-C00016.png) | 1990-03-02 |
Family
ID=31351821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11267188U Pending JPH0233437U (US07847105-20101207-C00016.png) | 1988-08-26 | 1988-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233437U (US07847105-20101207-C00016.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018021801A (ja) * | 2016-08-02 | 2018-02-08 | 株式会社デンソー | 半導体素子の検査装置 |
| WO2022074952A1 (ja) * | 2020-10-05 | 2022-04-14 | 三菱電機株式会社 | 半導体試験装置および半導体試験方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54146581A (en) * | 1978-05-09 | 1979-11-15 | Mitsubishi Electric Corp | Electric chracteristic measuring device for semiconductor chip |
-
1988
- 1988-08-26 JP JP11267188U patent/JPH0233437U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54146581A (en) * | 1978-05-09 | 1979-11-15 | Mitsubishi Electric Corp | Electric chracteristic measuring device for semiconductor chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018021801A (ja) * | 2016-08-02 | 2018-02-08 | 株式会社デンソー | 半導体素子の検査装置 |
| WO2022074952A1 (ja) * | 2020-10-05 | 2022-04-14 | 三菱電機株式会社 | 半導体試験装置および半導体試験方法 |
