JPH0231585B2 - - Google Patents

Info

Publication number
JPH0231585B2
JPH0231585B2 JP56144250A JP14425081A JPH0231585B2 JP H0231585 B2 JPH0231585 B2 JP H0231585B2 JP 56144250 A JP56144250 A JP 56144250A JP 14425081 A JP14425081 A JP 14425081A JP H0231585 B2 JPH0231585 B2 JP H0231585B2
Authority
JP
Japan
Prior art keywords
coil
coil unit
wire
laser beam
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56144250A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5846852A (ja
Inventor
Tokuo Yoshida
Sakuo Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP56144250A priority Critical patent/JPS5846852A/ja
Publication of JPS5846852A publication Critical patent/JPS5846852A/ja
Publication of JPH0231585B2 publication Critical patent/JPH0231585B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K15/00Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/04Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of windings prior to their mounting into the machines
    • H02K15/0414Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of windings prior to their mounting into the machines the windings consisting of separate elements, e.g. bars, segments or half coils
    • H02K15/0421Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of windings prior to their mounting into the machines the windings consisting of separate elements, e.g. bars, segments or half coils and consisting of single conductors, e.g. hairpins
    • H02K15/0428Processes or apparatus for simultaneously twisting two or more hairpins

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Windings For Motors And Generators (AREA)
JP56144250A 1981-09-12 1981-09-12 無鉄心電機子用コイルユニツトの製法 Granted JPS5846852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56144250A JPS5846852A (ja) 1981-09-12 1981-09-12 無鉄心電機子用コイルユニツトの製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56144250A JPS5846852A (ja) 1981-09-12 1981-09-12 無鉄心電機子用コイルユニツトの製法

Publications (2)

Publication Number Publication Date
JPS5846852A JPS5846852A (ja) 1983-03-18
JPH0231585B2 true JPH0231585B2 (enrdf_load_stackoverflow) 1990-07-13

Family

ID=15357724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56144250A Granted JPS5846852A (ja) 1981-09-12 1981-09-12 無鉄心電機子用コイルユニツトの製法

Country Status (1)

Country Link
JP (1) JPS5846852A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166773A (en) * 1989-07-03 1992-11-24 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
US5209390A (en) * 1989-07-03 1993-05-11 General Electric Company Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid
JP6221574B2 (ja) * 2013-09-27 2017-11-01 アイシン・エィ・ダブリュ株式会社 ワニス含浸装置及びワニス含浸方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048986B2 (ja) * 1977-06-25 1985-10-30 三菱電機株式会社 誘導電動機回転子の製造方法
JPS5915462B2 (ja) * 1979-04-30 1984-04-10 松下電工株式会社 無鉄芯型電機子の製造法

Also Published As

Publication number Publication date
JPS5846852A (ja) 1983-03-18

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