JPH0231501B2 - - Google Patents

Info

Publication number
JPH0231501B2
JPH0231501B2 JP59062357A JP6235784A JPH0231501B2 JP H0231501 B2 JPH0231501 B2 JP H0231501B2 JP 59062357 A JP59062357 A JP 59062357A JP 6235784 A JP6235784 A JP 6235784A JP H0231501 B2 JPH0231501 B2 JP H0231501B2
Authority
JP
Japan
Prior art keywords
lead terminal
lead
electronic component
view
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59062357A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60206056A (ja
Inventor
Jusuke Muto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6235784A priority Critical patent/JPS60206056A/ja
Publication of JPS60206056A publication Critical patent/JPS60206056A/ja
Publication of JPH0231501B2 publication Critical patent/JPH0231501B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6235784A 1984-03-29 1984-03-29 電子部品のリ−ド端子構造 Granted JPS60206056A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6235784A JPS60206056A (ja) 1984-03-29 1984-03-29 電子部品のリ−ド端子構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6235784A JPS60206056A (ja) 1984-03-29 1984-03-29 電子部品のリ−ド端子構造

Publications (2)

Publication Number Publication Date
JPS60206056A JPS60206056A (ja) 1985-10-17
JPH0231501B2 true JPH0231501B2 (enrdf_load_stackoverflow) 1990-07-13

Family

ID=13197779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6235784A Granted JPS60206056A (ja) 1984-03-29 1984-03-29 電子部品のリ−ド端子構造

Country Status (1)

Country Link
JP (1) JPS60206056A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182435U (ja) * 1982-05-28 1983-12-05 セイコーエプソン株式会社 半導体素子の外付け端子構造

Also Published As

Publication number Publication date
JPS60206056A (ja) 1985-10-17

Similar Documents

Publication Publication Date Title
JPH0231501B2 (enrdf_load_stackoverflow)
JPS582976U (ja) プリント基板用接続端子
JPS6314474Y2 (enrdf_load_stackoverflow)
JPH06140274A (ja) 複合電子部品
JPH051098Y2 (enrdf_load_stackoverflow)
JPS62180973U (enrdf_load_stackoverflow)
JPS587655Y2 (ja) 部品取付穴の構造
JPS58158401U (ja) リ−ド端子付きチツプ部品
JPS6144879U (ja) 部品取付用はんだ加工板
JPH0498780A (ja) Ｉｃソケット
JPH03205814A (ja) 表面実装用電子部品
JPS59274U (ja) プリント基板への端子ピンの取付装置
JPS60127786A (ja) 回路部品の実装方式
JPS59173366U (ja) 回路基板構造
JPH03134973A (ja) 表面実装用電子部品
JPH01163343U (enrdf_load_stackoverflow)
JPS59104569U (ja) プリント基板のテスト端子装置
JPS5947975U (ja) プリント基板の接続端子
JPS63148579A (ja) コネクタ
JPS5911450U (ja) 集積回路素子の取付基板
JPS5841980U (ja) 端子接続構造
JPS6013772U (ja) チツプ化部品搭載用プリント基板
JPH04186665A (ja) 集積回路パッケージ
JPS6144878U (ja) 部品取付用はんだ加工板
JPS6381837A (ja) 集積回路素子用ソケツト及びその製造方法