JPH0231444A - Dicer - Google Patents

Abstract

PURPOSE:To improve the dicing operation in productivity by a method wherein a holder container, provided with an opening which faces in an axial direction, is provided to a stage, and a holder, which holds a whetstone that abrades a rotary edge, is provided to the holder container in such a manner that it is capable of moving back or forth. CONSTITUTION:A holder container 12, provided with an opening that faces in an axial direction, is provided to a stage 11, and a holder 13, holding a whetstone 14 that abrades a dicing edge, is provided to the holder container 12 in such a manner that it is able to move freely back or forth, and the holder 13 is connected to a controller through a wiring 15. The holder 13 is so positioned as not to interrupt the dicing at the suction of a wafer. And, the whetstone 14 on the holder 13 becomes capable of abrading the dicing edge when it bites slightly, so that the whetstone 14 is made to decrease its part exposed above the stage 11 when the abrading is performed. By the structure mentioned above, the whetstone 14 is made to advance to a wafer side on the stage 11 at abrading of the dicing edge and to retreat to the holder container 12 at the dicing of the wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a dicer used when dividing a wafer into a large number of chips.

[Conventional technology]

Conventionally, this type of dicer (dicing device) has been constructed as shown in FIG. This will be explained based on the same figure. In the same figure, the one indicated by reference numeral 1 is an air intake hole (
(not shown). Note that this stage 1 is positioned below an artificial diamond dicing blade (not shown) that rotates at high speed during polishing.

In a dicer configured in this way, stage 1
After holding the wafer 2 by suction, dicing is performed by rotating a dicing blade (not shown) while running water to cut into the wafer 2 to a predetermined depth.

By the way, in this type of dicer, the dicing blade (not shown) gradually wears out due to long-term use, and the dicing width of the wafer 2 becomes wider and chipping occurs. It is necessary to install a dressing material (grindstone) and polish the cutting edge periodically (every several dozen wafers in the film).

[Problem to be solved by the invention]

However, in the conventional dicer, the external dimensions of the stage 1 are limited, and therefore a grindstone (not shown) cannot be placed on the stage 1 at all times. As a result, dressing material (not shown) is used each time polishing is performed.
It became necessary to install the dicing device on the stage 1, and this work took a lot of time, resulting in a problem that the productivity of dicing decreased.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a dicer that eliminates the need to install a grindstone on a stage when polishing a rotary blade, thereby increasing dicing productivity. .

[Means to solve the problem]

In the dicer according to the present invention, a holder housing section opening in the axial direction is provided on the stage, and a holder for holding a grindstone for polishing a rotary blade is provided in the holder housing section so as to be movable forward and backward.

[For production]

In the present invention, the grindstone can be advanced toward the wafer side of the stage during polishing of the rotary blade, and can be retreated into the holder housing during dicing.

[Example] Hereinafter, the structure of the present invention will be explained in detail with reference to an example shown in the drawings.

1 and 2 are a front view and a plan view showing a dicer according to the present invention, and in these figures, the same members as in FIG. 3 are denoted by the same reference numerals, and detailed description thereof will be omitted. In the figure, a stage indicated by reference numeral 11 is provided with a holder storage section 12 that opens in the axial direction. 13 is a grindstone 1 for polishing a dicing blade (not shown) as a rotary blade.
4, which is provided in the holder storage section 12 so as to be movable forward and backward, and is connected to a controller (not shown) by a wiring 15. In addition, this holder 1
3 is positioned at a position where it does not interfere with dicing when the wafer 2 is attracted. Furthermore, since the grindstone 14 on the holder 13 can be polished by slightly biting into it with a dicing blade (not shown), the portion exposed above the stage 11 during polishing is reduced. Furthermore, the rotation speed of the dicing blade (not shown) is several thousand rpm.
+m.

In the dicer configured in this manner, the grindstone 14 is advanced toward the wafer side of the stage 11 when polishing the dicing blade (not shown).

On the other hand, during dicing, the grindstone 1 is placed in the holder storage section 12.
Move 4 back.

Therefore, in the present invention, it is possible to eliminate the need for installing the grindstone 14 on the stage 11 when polishing the dicing blade (not shown).

In addition, in the present invention, the holder 13 is
A dicing blade (not shown) can be polished by the upper grindstone 14.

Note that in this embodiment, a controller (not shown)
The polishing of the dicing blade (not shown) and the dicing of the wafer 2 can be performed automatically.

Furthermore, in the present invention, since the degree of wear of the dicing blade (not shown) differs depending on the processed wafer 2,
By appropriately adjusting the amount of polishing of the cutting edge using a controller (not shown), stable dicing of the wafer 2 can be performed.

Incidentally, the replacement of the dicing blade (not shown) in the present invention differs depending on the substance (silicon, oxide film, metal, glass, etc.) attached to the dicing line, but it is desirable to replace it every time dicing is performed.

Further, the material of the grindstone 14 in the present invention may be changed as appropriate depending on the use, but generally contains silicon carbide, corundum, chromium oxide, iron oxide, etc.

〔Effect of the invention〕

As explained above, according to the present invention, the stage is provided with a holder storage section that opens in the axial direction, and the holder that holds the grindstone for polishing the rotary blade is provided in this holder storage section so that it can move forward and backward. During polishing, the grindstone can be advanced toward the wafer side of the stage, and during dicing, it can be moved back into the holder storage section. Therefore, the work of installing a grindstone on a stage, which was conventionally required when polishing a rotary blade, is no longer necessary, so that the productivity of dicing can be reliably increased.

[Brief explanation of the drawing]

1 and 2 are a front view and a plan view showing a dicer according to the present invention, and FIG. 3 is a front view showing a conventional dicer. 2...Wafer, 11...Stage, 12...
・Holder storage part, work 3...Holder, 14...
・Whetstone.

Claims (1)

[Claims] In a dicer that performs dicing on a wafer on a stage with a rotary blade, the stage is provided with a holder storage part that opens in the axial direction, and a holder that holds a grindstone for polishing the rotary blade is provided in the holder storage part so that it can move forward and backward. A dicer characterized by: