JPH02310532A - Film liquid crystal - Google Patents
Film liquid crystalInfo
- Publication number
- JPH02310532A JPH02310532A JP13341889A JP13341889A JPH02310532A JP H02310532 A JPH02310532 A JP H02310532A JP 13341889 A JP13341889 A JP 13341889A JP 13341889 A JP13341889 A JP 13341889A JP H02310532 A JPH02310532 A JP H02310532A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- film liquid
- leader
- parts
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011889 copper foil Substances 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 21
- 239000010410 layer Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 210000002858 crystal cell Anatomy 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims 1
- 210000001787 dendrite Anatomy 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 9
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 6
- 229910003437 indium oxide Inorganic materials 0.000 abstract description 3
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 241000283070 Equus zebra Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、液晶表示素子の一層の軽薄化をはかるだめの
フィルム液晶に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a film liquid crystal which is intended to further reduce the weight and thickness of liquid crystal display elements.
従来の技術
液晶表示A子は成極として酸化インジウム系の透明薄膜
が用いられているために回路への接続にあたって半田付
が困遥で、一般にゼブラゴム(縦方向にのみ導′成注を
Mする)を用いて圧接したシ、また電憔間隔の小さいも
のや薄型化を要する場合には異方性導電接着剤シートを
熱圧着するなどの方法が用いられている。敢えて半田付
をする場合には、透明薄膜電極の上のみに半田付可能な
銀ペーストを印刷したシ、メッキするなどの方法がある
が液晶セルの製造上、使用上の制約から課題が多く、実
用化は限られている。Conventional technology LCD display A-type uses an indium oxide-based transparent thin film for polarization, which makes it difficult to solder when connecting to a circuit. ), and in cases where the electrode spacing is small or thinning is required, methods such as thermocompression bonding of an anisotropic conductive adhesive sheet are used. If you dare to solder, there are methods such as printing or plating a solderable silver paste only on the transparent thin film electrode, but there are many problems due to limitations in manufacturing and usage of liquid crystal cells. Practical use is limited.
発明が解決しようとする課題
従来のガラス基板の代シにフィルム基板を用いることに
よって薄型化を実現したフィルム液晶を実用化する場合
、電極引出部の接、dによって薄型化の効果が半減し、
またセットのプリント基板などに実装するときに異方性
導電性シートを均一に熱圧着するための設備が複雑でス
ペースを要し、特に小型製品に接読する場合など非効率
的で、融通が効きにくかった。Problems to be Solved by the Invention When commercializing a film liquid crystal that has been made thinner by using a film substrate instead of a conventional glass substrate, the effect of thinning is halved by the contact of the electrode lead-out portions,
Furthermore, when mounting the anisotropic conductive sheet on a set's printed circuit board, etc., the equipment for uniformly thermocompressing the anisotropic conductive sheet is complex and requires space, making it inefficient and inflexible, especially when reading directly onto small products. It wasn't effective.
そこで本発明は、液晶セルの基板がガラスでなくフィル
ムであるために可能となる方法によって半田付のできる
引出1極を容易に効率的に形成して、フィルム液晶の取
付け、接続を簡単にしようとするものである。Therefore, the present invention aims to simplify the installation and connection of the film liquid crystal by easily and efficiently forming one lead-out pole that can be soldered using a method that is made possible because the substrate of the liquid crystal cell is not glass but a film. That is.
一般に、液晶表示素子は第31已に示すようにガラスま
たはフィルムなどの透明な基板1.1′の上に所要パタ
ーン状の透明電極2.2′を形成し、これを一定間隔を
保って相対向させてシール剤3で周辺部を一層し、内部
に液晶4を充填させる。そして必要に応じて両側に偏光
板6.6′ 、反射板などを貼付して構成する。これを
駆動回路と接続するためには第3図すに示すように一方
の基板1′の延長部分に引出用透明電極2′をストライ
ブ状に形成し、この部分に第4図に示すように縦方向の
みに導電性を有するゼブラゴムまたは異方性導電性接着
剤シート13を介してフレキシブル基板または一般のプ
リント基板11の銅箔などの端子部12と圧着して使用
する。ところがこれらの異方性導電性ゴムまた接着剤は
、横方向にはリークせずに縦方向には十分な導電性が要
求されるために、この条件を満足してしかも十分な接着
力を得ることは材料、構成などの点で制約が多く、信頼
性も含めて満足なものを得ることが難しく実用上は補強
などの補助手段も加えて使用されている。フィルム基板
の場合には屈曲するために一ノー課題が多い。In general, a liquid crystal display device is manufactured by forming transparent electrodes 2.2' in a desired pattern on a transparent substrate 1.1' such as glass or film, as shown in Figure 31, and placing the transparent electrodes 2.2' in a desired pattern relative to each other at a constant interval. Then, the peripheral portion is further coated with sealant 3, and the inside is filled with liquid crystal 4. Polarizing plates 6, 6', reflecting plates, etc. are attached to both sides as necessary. In order to connect this to the drive circuit, a transparent electrode 2' for extraction is formed in a stripe shape on the extension part of one substrate 1' as shown in Fig. 3, and on this part as shown in Fig. 4. It is used by being crimped to a terminal portion 12 such as a copper foil of a flexible substrate or a general printed circuit board 11 via a zebra rubber or anisotropic conductive adhesive sheet 13 having conductivity only in the vertical direction. However, these anisotropic conductive rubbers and adhesives are required to have sufficient conductivity in the vertical direction without leaking in the horizontal direction, so it is difficult to satisfy these conditions and still obtain sufficient adhesive strength. This means that there are many restrictions in terms of materials, structure, etc., and it is difficult to obtain a product that is satisfactory in terms of reliability, so in practice, auxiliary measures such as reinforcement are used. In the case of film substrates, there are many problems due to bending.
課題を解決するだめの手段
本発明は、このような制約条件の多い異方性導電材料を
用いる代シに透明電極の引出郡全体に金属層を形成し、
その引出部の透明゛成極に相当する部分以外は金属層の
幅よシ深い位置まで凹型に切除するものである。この場
合、金属ノーとしては、導電塗料、メッキ層、蒸着、ス
パッタなどによる薄膜層、導電性接着剤を介した金属箔
などを用いればよく、あとの半田付の・ら要性などとの
関連で適宜選べばよい。As a means to solve the problem, the present invention, instead of using an anisotropic conductive material with many such restrictions, forms a metal layer over the entire lead group of the transparent electrode,
The portion of the drawn-out portion other than the portion corresponding to the transparent polarization is cut out in a concave shape to a position deeper than the width of the metal layer. In this case, the metal material may be a conductive paint, a plating layer, a thin film layer formed by vapor deposition or sputtering, or a metal foil coated with a conductive adhesive. You can choose as appropriate.
作用
引出電極の間隔にI関係なく全直に亘って金属層による
導体層・部を形成すればよいため、操作が簡単で、しか
も十分な導電性が得られる。また、異方導電性のような
特殊な機能が要求されないので十分な導電ヰと接着力が
同時に満足できる。さらに引出部のみに金属層を形成す
る必要がないので寸法精度や端子間シ1−トなどに関す
る煩雑な対策や作業が不要であシ、切除の精度と方式の
選定のみでよい。また半固付可能な導体層が容易に形成
できるため液晶素子を複雑な装置で熱圧着することなく
、従来からの半田付工法で簡便に瞬時に接続できる利点
がある。Since it is sufficient to form the conductor layer/section of the metal layer over the entire length regardless of the interval I between the working extraction electrodes, the operation is simple and sufficient conductivity can be obtained. Further, since special functions such as anisotropic conductivity are not required, sufficient conductivity and adhesive strength can be satisfied at the same time. Furthermore, since it is not necessary to form a metal layer only on the lead-out portion, there is no need for complicated measures or operations regarding dimensional accuracy, inter-terminal seats, etc., and it is only necessary to select the precision and method of cutting. Furthermore, since a semi-fixable conductor layer can be easily formed, there is an advantage that the liquid crystal element can be easily and instantaneously connected using a conventional soldering method, without having to thermocompress the liquid crystal element using a complicated device.
以上のようにガラス基板による液晶では不可能なフィル
ム液晶独特の端子接続法を提供するものである。As described above, the present invention provides a terminal connection method unique to film liquid crystals, which is not possible with liquid crystals using glass substrates.
実施例
(実施例1)
第3図に示すような構成の液晶セルを基板と偏光板を一
体にした200μm厚の偏光板一体型pxs(ポリエー
テルスルフォン)のフィルムを基板1.1′ に用い
て構成する。この際引出部は酸化インジウム系の透明電
極を延長して形成し、I MMg、13r1間隔で形成
する。この上に第1図のように幅1.6朋の導電性粘着
剤つきの樹枝状凸凹■を有する電解銅箔(36μm)1
4を圧着する。次に第2図のように透明電極2′のなh
部分を切除するが、その幅はあとの半田付時に短絡しな
い値を選べば透明電極2′ の幅と同じでも、それ以下
でもよい。しかし切込長は形成した電解鋼箔140幅(
1,s m )以上にして隣接端子が完全に分離される
ことが必要である。この切除は200μmのフィルムと
36μm程度の銅箔であるから切除でt1ブレス打抜で
も可能である。このようにして得られたフィルム液晶素
子は半田ゴテを用いてフレキシブルプリント基板の銅箔
部分に容易に接続でき、小型の機器への取付けに特に有
効である。Example (Example 1) A liquid crystal cell having the structure shown in Fig. 3 was prepared using a 200 μm thick PXS (polyether sulfone) film with an integrated polarizing plate as the substrate 1.1'. Configure. At this time, the lead-out portions are formed by extending indium oxide-based transparent electrodes, and are formed at intervals of IMMg and 13r1. On top of this, as shown in Figure 1, an electrolytic copper foil (36 μm) 1 with dendritic unevenness with a conductive adhesive of width 1.6 mm is applied.
Crimp 4. Next, as shown in Figure 2, the transparent electrode 2' is
The width of the portion to be cut out may be the same as or less than the width of the transparent electrode 2', as long as the width is selected so as not to cause short circuit during soldering later. However, the cut length is 140 mm width of the formed electrolytic steel foil (
1, s m ) or more so that adjacent terminals are completely separated. Since the film is 200 .mu.m thick and the copper foil is about 36 .mu.m thick, this cutting can be done by t1 press punching. The film liquid crystal element thus obtained can be easily connected to the copper foil portion of a flexible printed circuit board using a soldering iron, and is particularly effective for attachment to small equipment.
また端面で曲げて裏面まで形成すれば一層強固になる。Also, if you bend the end face and form it all the way to the back side, it will become even stronger.
(実施例2)
実施例1と同様に形成したフィルム液晶素子に金属層に
よる導体として半田付可能な低温硬化型銀ペーストを印
刷した場合も同様な効果が得られた。(Example 2) A similar effect was obtained when a solderable low-temperature curing silver paste was printed as a conductor using a metal layer on a film liquid crystal element formed in the same manner as in Example 1.
(実施例3)
実施列1と同様にして、導体としてニッケルメッキ層を
2〜3μ厚に形成した場合にも同様の効果が得られた。(Example 3) Similar effects were obtained when a nickel plating layer was formed as a conductor to a thickness of 2 to 3 μm in the same manner as in Example 1.
発明の効果 本発明はフィルム基板の特長である自由に切抜。Effect of the invention The present invention features free cutting, which is a feature of film substrates.
打抜などの切除ができるという特長を利用して、その駆
1t!1回路との接αを半田づけによって容易にできる
ように引出電極を形成するものである。その方法は引出
電極部全体に金属層を形成し、その電極部分以外をフィ
ルム基板ごと切除するもので、十分な導電性と接着力が
得られ、しかも半田付による確実な接続ができるために
従来の異方性導電剤による接続よりも高信頼性が得られ
る。また全面に金属層を形成するために、電極の寸法精
度に起因する工法上のiJJ約がなく簡単な操作で半田
付可能な引出電極を形成することができる。その結果、
駆動回路との接続も、熱圧着のための煩雑な装置を必要
とせず、従来の簡単なハンダづけ工法が応用できるため
に、小型の機器の表示部形成などにおいて特に有効であ
り、実用的効果が著しい。Utilizing the feature of being able to perform cutting such as punching, the drive is 1t! The lead electrode is formed so that connection α with one circuit can be easily made by soldering. This method involves forming a metal layer over the entire extraction electrode part, and cutting off the entire film substrate except for the electrode part.This method provides sufficient conductivity and adhesive strength, and also allows for reliable connection by soldering. This provides higher reliability than connections using anisotropic conductive materials. Further, since a metal layer is formed on the entire surface, there is no IJJ error in the construction method due to the dimensional accuracy of the electrode, and a lead electrode that can be soldered can be formed with a simple operation. the result,
Connection with the drive circuit does not require complicated equipment for thermocompression bonding, and conventional simple soldering methods can be applied, making it particularly effective in forming display parts of small devices, and has practical effects. is remarkable.
第1図、第2図は本発明の一実施例によるフィルム液晶
の製造工程の一部を示す平面図、第3図a、bは一般の
液晶表示素子の断面図および上面図、第4図は駆動回路
との接続の一例を示す断面図である。
1.1′・・・・・・基板、2,2′・・・・・・透明
電極、4・・・・・・液晶、14・旧・・電解銅箔。1 and 2 are plan views showing part of the manufacturing process of a film liquid crystal according to an embodiment of the present invention, FIGS. 3a and 3b are a cross-sectional view and a top view of a general liquid crystal display element, and FIG. 4 FIG. 2 is a cross-sectional view showing an example of connection with a drive circuit. 1.1'...Substrate, 2,2'...Transparent electrode, 4...Liquid crystal, 14.Old...Electrolytic copper foil.
Claims (5)
透明電極の引出部に金属層を設け、その引出部の透明電
極以外の部分を切除したことを特長とするフィルム液晶
。(1) A film liquid crystal characterized in that a metal layer is provided on the lead-out portion of the transparent electrode of a liquid crystal cell formed by sandwiching the liquid crystal between film substrates, and the portion of the lead-out portion other than the transparent electrode is removed.
1記載のフィルム液晶。(2) The film liquid crystal according to claim 1, wherein a metal thin film layer is provided on the lead-out portion of the transparent electrode.
箔を設けた請求項1記載のフィルム液晶。(3) The film liquid crystal according to claim 1, wherein a metal foil is provided on the lead-out portion of the transparent electrode via a conductive adhesive layer.
した請求項1記載のフィルム液晶。(4) The film liquid crystal according to claim 1, wherein a thin metal plate is crimped along the substrate at the lead-out portion of the transparent electrode.
が接するように圧接着した請求項3記載のフィルム液晶
。(5) The film liquid crystal according to claim 3, wherein an electrolytic copper foil is pressure-bonded to the lead-out portion of the transparent electrode so that the dendrite surface is in contact with the lead-out portion of the transparent electrode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13341889A JPH07122715B2 (en) | 1989-05-26 | 1989-05-26 | Film liquid crystal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13341889A JPH07122715B2 (en) | 1989-05-26 | 1989-05-26 | Film liquid crystal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02310532A true JPH02310532A (en) | 1990-12-26 |
JPH07122715B2 JPH07122715B2 (en) | 1995-12-25 |
Family
ID=15104308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13341889A Expired - Fee Related JPH07122715B2 (en) | 1989-05-26 | 1989-05-26 | Film liquid crystal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07122715B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04273214A (en) * | 1991-02-28 | 1992-09-29 | Rohm Co Ltd | Method for connecting electrode of display device |
US6259036B1 (en) * | 1998-04-13 | 2001-07-10 | Micron Technology, Inc. | Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps |
-
1989
- 1989-05-26 JP JP13341889A patent/JPH07122715B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04273214A (en) * | 1991-02-28 | 1992-09-29 | Rohm Co Ltd | Method for connecting electrode of display device |
US6259036B1 (en) * | 1998-04-13 | 2001-07-10 | Micron Technology, Inc. | Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps |
Also Published As
Publication number | Publication date |
---|---|
JPH07122715B2 (en) | 1995-12-25 |
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