JPH0230874Y2 - - Google Patents

Info

Publication number

JPH0230874Y2

JPH0230874Y2 JP9430087U JP9430087U JPH0230874Y2 JP H0230874 Y2 JPH0230874 Y2 JP H0230874Y2 JP 9430087 U JP9430087 U JP 9430087U JP 9430087 U JP9430087 U JP 9430087U JP H0230874 Y2 JPH0230874 Y2 JP H0230874Y2

Authority

JP

Japan

Prior art keywords

copper wire

pin terminal

terminal

pedestal

pin

Prior art date

1987-06-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
• 238000005476 soldering Methods 0.000 claims description 5
• 238000005452 bending Methods 0.000 claims description 2
• NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 13
• 238000004804 winding Methods 0.000 description 9
• 229920005989 resin Polymers 0.000 description 4
• 239000011347 resin Substances 0.000 description 4
• 238000007796 conventional method Methods 0.000 description 1
• 230000007547 defect Effects 0.000 description 1
• 238000010292 electrical insulation Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 239000000696 magnetic material Substances 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 229920002050 silicone resin Polymers 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1