JPH02308558A - Semiconductor cooling device - Google Patents
Semiconductor cooling deviceInfo
- Publication number
- JPH02308558A JPH02308558A JP12884189A JP12884189A JPH02308558A JP H02308558 A JPH02308558 A JP H02308558A JP 12884189 A JP12884189 A JP 12884189A JP 12884189 A JP12884189 A JP 12884189A JP H02308558 A JPH02308558 A JP H02308558A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- semiconductor
- semiconductor device
- equipment
- cooling medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 135
- 238000001816 cooling Methods 0.000 title claims abstract description 113
- 238000004378 air conditioning Methods 0.000 claims abstract description 24
- 238000009434 installation Methods 0.000 claims abstract description 9
- 239000002826 coolant Substances 0.000 claims description 59
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000007613 environmental effect Effects 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 abstract 5
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000001143 conditioned effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体装置に係り、特に、半導体装置の冷却
装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a cooling device for a semiconductor device.
ＬＳＩ等の高密度に集積した電子回路をもつ半導体装置
は、動作時の発熱が大きく、半導体装置から発生する熱
の除去性能が装置の動作、及び、設計の制限となってき
ている。特に、最近、高集積化の著しい計算機用の半導
体装置では安定した性能維持のため、半導体装置から発
生する熱の除去は必須の課題になっている。このため、
その冷却構造、及び、冷却方法については、これまで稲
穂方式が考案されている。特に、半導体素子を多数用い
る大型計算機では、多数の半導体素子をひとまとめにし
たモジュール構造とし、このモジュールと水の通る冷却
ジャケットを組み合わせて熱を伝える構造が一般的であ
る。例えば、第４図に示した特公昭５６−２２３８０号
公報に例示゛できるような半導体装置では１発熱部から
の熱をピストン形状の冷却素子と、これを支持するシリ
ンダ群からなる熱伝導体を介して冷却ジャケットに伝え
る構造になっている。このような冷却媒体を用いた冷却
方式による半導体装置は、例えば、ＦＵＪＩＴＳＵ 。2. Description of the Related Art Semiconductor devices such as LSIs, which have electronic circuits that are highly integrated, generate a large amount of heat during operation, and the ability to remove the heat generated from the semiconductor devices has become a limitation on the operation and design of the devices. In particular, in semiconductor devices for computers that have recently become highly integrated, removing heat generated from the semiconductor devices has become an essential issue in order to maintain stable performance. For this reason,
Regarding the cooling structure and cooling method, the Inaho method has been devised so far. In particular, in large computers that use a large number of semiconductor devices, it is common to have a module structure in which a large number of semiconductor devices are grouped together, and a structure in which this module is combined with a cooling jacket through which water passes to transmit heat. For example, in a semiconductor device as exemplified in Japanese Patent Publication No. 56-22380 shown in FIG. The structure is such that the information is transmitted to the cooling jacket through the cooling jacket. A semiconductor device using a cooling method using such a cooling medium is, for example, FUJITSU.
ＶｏＱ、３７，２（１９８６）ｐｐ１２４−１３４に論
じられているように冷却媒体に受けた熱を系外に放出す
るための専用の熱交換器と冷凍装置とを備えた冷却設備
をもち効率的に放熱できる冷却システムを構成している
。この冷却システムの一例を第５図に示す、一方、中・
小型計算機に用いられるような半導体装置は装置規模が
小さく、専用の冷却設備を持たないため、空冷方式によ
る冷却システムを構成していた。このため、半導体装置
で発生した熱は半導体装置の周囲に放散するだけであり
、その放熱能力は限界になりつつある。As discussed in VoQ, 37, 2 (1986) pp 124-134, it is efficient to have cooling equipment equipped with a dedicated heat exchanger and refrigeration device to release the heat received by the cooling medium to the outside of the system. It has a cooling system that can dissipate heat. An example of this cooling system is shown in Figure 5.
Semiconductor devices such as those used in small computers are small and do not have dedicated cooling equipment, so they have been configured with air-cooled cooling systems. For this reason, the heat generated in the semiconductor device is only dissipated to the surroundings of the semiconductor device, and its heat dissipation ability is reaching its limit.
上記従来例に示したように、比較的小型の半導体装置は
、周囲雰囲気温度を冷熱源として、空気を半導体装置の
発熱部に吹き付ける空冷部方式が主である。しかし、半
導体装置の高性能化により１チツプ当たりＩＯＷ以上の
熱を生じるようになるにつれ、半導体装置の周囲の空気
を冷熱源とするだけでは冷却が追いつかず、発熱量の大
きい半導体装置、あるいは、比較的低発熱量の半導体装
置ではオフィスなどの限られた空間で多数の機器を使用
する場合には、半導体装置の使用場所にこれを冷却する
ために冷熱源を求めなければならない。このような大き
な発熱を伴う大型の半導体装置には、従来、冷熱源を作
る専用の冷却設備が設けられ、冷却媒体を用いた高効率
な冷却が行なわれていた０本発明の目的は、大型の半導
体装置のように、専用の冷却設備を設置しない小規模の
半導体装置に、簡易設備に冷却媒体を使用した高効率な
冷却性能が得られる半導体冷却システムを得ることにあ
る。本発明の他の目的は、小規模な半導体装置に要求の
多い、設置場所を簡単に移動できる機動性のある冷却シ
ステムを冷却媒体を使用した高効率の冷却方式で実現す
ることにある。さらに、本発明の目的は、これらの冷却
システムを既設設備を利用し、より低コストに構成する
ことにある。As shown in the above-mentioned conventional example, relatively small-sized semiconductor devices mainly use an air cooling system in which air is blown onto a heat generating part of the semiconductor device using the ambient atmosphere temperature as a cooling heat source. However, as semiconductor devices become more sophisticated and generate more heat than IOW per chip, cooling cannot keep up with just using the air around the semiconductor device as a cooling heat source. When using a large number of semiconductor devices with a relatively low calorific value in a limited space such as an office, a cold source must be provided at the place where the semiconductor devices are used to cool them. Conventionally, large-sized semiconductor devices that generate a large amount of heat are equipped with dedicated cooling equipment to generate a cold source, and highly efficient cooling is performed using a cooling medium. An object of the present invention is to provide a semiconductor cooling system that can provide highly efficient cooling performance using a cooling medium in simple equipment for small-scale semiconductor devices that do not require dedicated cooling equipment, such as semiconductor devices. Another object of the present invention is to realize a highly efficient cooling system using a cooling medium, which is highly required for small-scale semiconductor devices, and which is capable of being easily moved from one installation location to another. Furthermore, it is an object of the present invention to configure these cooling systems at a lower cost by using existing equipment.
上記目的は、オフィス、あるいは、業務用ビルなどの通
常半導体装置が使用される場所にあり、これを使用する
人間の快適な活動環境を維持するために設置してある既
設の空調機、あるいは、冷房設備を半導体装置の冷却用
の冷熱源発生装置として利用することで達成できる。す
なわち、冷却媒体楯環系と冷却しようとする半導体装置
の冷却媒体楯環系を、直接、ないし、間接に結合し、さ
らに、既設冷却設備の制御対象温度と共に半導体装置の
温度を入力し、冷却媒体楯環系を最適に制御することに
より解決される。すなわち、冷却媒体楯環系の直接結合
は、各冷却媒体楯環系の冷却媒体を共有するように、直
列、ないし、並列に配管接続することにより行なわれる
。また、間接結合は、既設空調、あるいは、冷房設備の
冷気出口付近に半導体装置の放熱部となる熱交換器を組
み込むことにより行なわれる。The above purpose is to install an existing air conditioner installed in a place where semiconductor devices are normally used, such as an office or a business building, to maintain a comfortable activity environment for the people who use the device, or This can be achieved by using air conditioning equipment as a cold source generator for cooling semiconductor devices. That is, the cooling medium shield ring system and the cooling medium shield ring system of the semiconductor device to be cooled are connected directly or indirectly, and the temperature of the semiconductor device is inputted together with the temperature to be controlled of the existing cooling equipment, and the cooling medium shield ring system is connected directly or indirectly. This problem is solved by optimally controlling the media shield ring system. That is, the direct connection of the cooling medium shield ring systems is performed by connecting the pipes in series or in parallel so that the cooling medium of each cooling medium shield ring system is shared. Further, indirect coupling is performed by incorporating a heat exchanger serving as a heat radiating part of the semiconductor device near the cold air outlet of an existing air conditioner or cooling equipment.
発熱量が大きく設置規模が大きい大型電子計算機などの
半導体装置は専用の冷却設備によって、発生した熱を効
果的に放散することができた。しかし、装置規模が小さ
い中・小型の半導体装置は専用冷却設備をもたず、空冷
方式による冷却が主であり、半導体装置は発生した熱を
装置周囲に放散させるだけであった。このため、従来の
冷却システムでは表部効率が低く、これら半導体装置の
高性能化による発熱量の増大に対しては新たな放熱源を
確保する必要があった。本発明は、既設の空調機、ある
いは、冷房設備などの冷却設備と半導体装置の冷却媒体
楯環系を結合し、冷却媒体を、直接、あるいは間接に共
用した冷却方式とすることで、半導体装置で発生する熱
を既設の空調機、あるいは、冷房設備を介して半導体装
置の使用環境から系外へ熱を輸送するように作用するに
のため従来、専用冷却設備がなく冷却方式によっていた
半導体装置を簡単な付帯設備を設けるだけで、より大き
い発熱を効率良く放散させることができる冷却媒体循環
式の冷却方式とすることができる。Semiconductor devices such as large electronic computers that generate a large amount of heat and are installed on a large scale have been able to effectively dissipate the generated heat using dedicated cooling equipment. However, small and medium-sized semiconductor devices do not have dedicated cooling equipment and are mainly cooled by air cooling, which simply dissipates the heat generated by the semiconductor device to the surrounding area. For this reason, the surface efficiency of conventional cooling systems is low, and it is necessary to secure a new heat dissipation source to cope with the increase in heat generation due to the improved performance of these semiconductor devices. The present invention combines an existing air conditioner or cooling equipment such as air conditioning equipment with a cooling medium shield ring system for a semiconductor device, thereby creating a cooling system in which the cooling medium is shared directly or indirectly. Conventionally, semiconductor devices that did not have dedicated cooling equipment and used a cooling method to transport the heat generated by the device from the environment in which the semiconductor device is used to the outside of the system via an existing air conditioner or cooling equipment. By simply installing simple ancillary equipment, a cooling medium circulation type cooling system that can efficiently dissipate a large amount of heat can be achieved.
以下、本発明の一実施例を第１図により説明する。本実
施例は、既設汎用の空調膜ｉ１７の冷却媒体楯環系を並
列に分岐し、半導体装置１の冷却媒体楯環系に接続して
冷却媒体５を共有する半導体冷却システムを構成したも
のである。ここで実施例として利用する空調設備はコン
プレッサ９を用いて冷却媒体に熱輸送させる冷凍機方式
のものである。このため、空調設備から半導体装置に導
いた冷却媒体が半導体素子２で発生した熱を、効率的に
吸収できるように、半導体装置内部に膨張弁を設け、冷
却ジャケット内で冷却媒体が熱伝達に有効な低温を作り
出すようにしている。この膨張弁を制御することにより
、半導体素子２の発熱に応じた冷却能力を空調設備７と
独立に冷却ジャケット内に作り出すことができる。しか
し、この空ｌ！Ｉ設備は本来、部屋の環境維持を目的と
したものであり、この設備を半導体装置の冷却に利用す
るには、これらと連動した制御シ＼テムを取り入れるこ
とが望ましい。そのため、本実施例では空調室の温度と
共に半導体装置の温度を検出し、これらに基づいて冷却
系の最適制御をするため、半導体装置温度センサ１２と
空調室温度センサ１３および制御装置１４を設ける。こ
うして、既設空調設備の冷却能力の余裕を有効に利用し
、半導体装置を効率的に冷却することができる。さらに
、室内空調を必要としない場合は、空調機用膨張弁１１
を完全に閉じ、冷却媒体５を半導体装置だけに流れる冷
却媒体楯環系とすることにより、半導体装置のみを冷却
することができる。また、既設空調機が暖房装置として
使用される場合は、本実施例のような空調設備では、一
般に、冷却媒体楯環系とは独立に屋内熱交換器１０の付
近にヒータを備えてあり、これにより暖房を行なうよう
になっている。このため、暖房中の半導体装置の冷却は
、既設空調設備をヒータと冷却媒体楯環系を同時に運転
し、冷却媒体５を半導体装置にだけ循環させればよい。An embodiment of the present invention will be described below with reference to FIG. In this embodiment, a semiconductor cooling system is constructed in which the cooling medium shield ring system of the existing general-purpose air conditioning membrane i17 is branched in parallel and connected to the cooling medium shield ring system of the semiconductor device 1 to share the cooling medium 5. be. The air conditioning system used in this example is of a refrigerator type in which a compressor 9 is used to transport heat to a cooling medium. For this reason, an expansion valve is provided inside the semiconductor device so that the cooling medium guided from the air conditioning equipment to the semiconductor device can efficiently absorb the heat generated in the semiconductor element 2, and the cooling medium is used for heat transfer inside the cooling jacket. I try to create an effective low temperature. By controlling this expansion valve, a cooling capacity corresponding to the heat generated by the semiconductor element 2 can be created in the cooling jacket independently of the air conditioning equipment 7. But this sky! I equipment is originally intended for maintaining the room environment, and in order to use this equipment for cooling semiconductor devices, it is desirable to incorporate a control system that works with these equipment. Therefore, in this embodiment, a semiconductor device temperature sensor 12, an air conditioned room temperature sensor 13, and a control device 14 are provided in order to detect the temperature of the semiconductor device as well as the temperature of the air conditioned room, and optimally control the cooling system based on these. In this way, the excess cooling capacity of the existing air conditioning equipment can be effectively utilized to efficiently cool the semiconductor device. Furthermore, if indoor air conditioning is not required, the air conditioner expansion valve 11
By completely closing the cooling medium 5 and forming a cooling medium shield ring system in which the cooling medium 5 flows only to the semiconductor device, only the semiconductor device can be cooled. Furthermore, when an existing air conditioner is used as a heating device, the air conditioner as in this embodiment is generally equipped with a heater near the indoor heat exchanger 10, independent of the cooling medium shield ring system. This provides heating. Therefore, to cool the semiconductor device during heating, it is sufficient to simultaneously operate the heater and the cooling medium shield ring system in the existing air conditioning equipment, and circulate the cooling medium 5 only to the semiconductor device.
第２図は、既設冷却設備に半導体装置の冷却媒体楯環系
を直列に°接続ｑた場合の−実施例を示したものである
。本例では既設空調設備の冷却媒体が屋内熱交換器を通
過し、空調室の熱をある程度吸収した後に、半導体装置
の冷却ジャケットに入り、半導体素子を冷却する。この
ため、半導体装置の冷却制御は、空調機用膨張弁１１で
作り出す低温と室内熱交換器１０の熱交換量を制御する
必要があり、本実施例では、コンプレッサ９．空調機用
膨張弁１１と共に室内熱交換器１０のファンを制御する
ように制御系を構成している。また、室内空調を必要と
しない場合や暖房時には、冷却媒体が室内熱交換機１０
をバイパスし半導体装置のみを冷却出来るよう冷却媒体
バイパス管２ｏを備えている。このように、本冷却シス
テムは半導体装置内に駆動部分となる制御弁を持たない
ので、廉価に構成できる簡易冷却システムとして有効で
ある。第３図は、第１図に示した本発明の実施例と冷却
媒体楯環系の構成は同一であるが、半導体装置と既設空
調設備との接続配管にフレキシブル管１５を適用した一
実施例を示したものである。このため、本半導体装置の
設置場所を自由に変えることができる。しかも、半導体
装置との接続部には簡単に接続、切り離しができるワン
タッチジヨイント１６を使用している。FIG. 2 shows an embodiment in which a cooling medium shield ring system for a semiconductor device is connected in series to an existing cooling facility. In this example, the cooling medium of the existing air conditioning equipment passes through the indoor heat exchanger and absorbs some heat from the air conditioning room, and then enters the cooling jacket of the semiconductor device to cool the semiconductor element. Therefore, in cooling control of the semiconductor device, it is necessary to control the low temperature generated by the air conditioner expansion valve 11 and the amount of heat exchanged by the indoor heat exchanger 10. In this embodiment, the compressor 9. A control system is configured to control the fan of the indoor heat exchanger 10 together with the air conditioner expansion valve 11. In addition, when indoor air conditioning is not required or during heating, the cooling medium is used in the indoor heat exchanger 10.
A cooling medium bypass pipe 2o is provided so that only the semiconductor device can be cooled by bypassing the cooling medium. As described above, since the present cooling system does not have a control valve as a driving part within the semiconductor device, it is effective as a simple cooling system that can be constructed at low cost. FIG. 3 shows an embodiment in which the configuration of the cooling medium shield ring system is the same as the embodiment of the present invention shown in FIG. This is what is shown. Therefore, the installation location of this semiconductor device can be changed freely. Furthermore, a one-touch joint 16 that can be easily connected and disconnected is used at the connection part with the semiconductor device.
これは配管の切り離しと同時に配管を流れる流体が止ま
るものであり、半導体装置を切り離した場合、空調設備
の独立稼働をすみやかに行なうことができる。このため
、本システムは設置場所の移動が比較的頻繁に生じやす
いデスクトップ型計算機等の半導体装置の冷却システム
として有効なものである。以上の実施例は冷却媒体楯環
系を半導体装置と既設冷却設備と配管で、直接、接続し
た冷却媒体を共有する冷却システムであった。しかし、
第６図に示す実施例は、既設冷却設備と半導体装置の冷
却媒体楯環系は独立であり、熱交換器を介して熱的な接
続を図ったものである。すなわち、本冷却システムでは
既設冷却設備が作った冷気により半導体装置で加熱され
た冷却媒体を間接的に冷却するものである。この構成は
、汎用の空調設備７の冷気吹き出し部分に半導体装置１
の放熱用熱交換器６を配置し、半導体素子２で発生する
熱を冷却ジャケット３を介して冷却水１９に伝え、これ
をポンプ１８を用いて半導体装置１と放熱用熱交換器６
の間を循環させることにより、半導体装置で発生した熱
を空調設備７の冷気吹き出し部分に放散させることがで
きる。この放熱用熱交換器６の設置部分は、空調設備７
で発生した冷気が吹き出しているため半導体装置周囲の
室温より温度が低く、単に、半導体装置から、直接、放
熱させることより放熱用熱交換器との温度差を大きく取
れ、大きな熱量を放散することができる。This means that the fluid flowing through the piping is stopped at the same time as the piping is disconnected, and when the semiconductor device is disconnected, the air conditioning equipment can be operated independently. Therefore, this system is effective as a cooling system for semiconductor devices such as desktop computers, which are likely to be moved relatively frequently. The embodiments described above are cooling systems in which the cooling medium shield ring system is directly connected to the semiconductor device, existing cooling equipment, and piping to share the cooling medium. but,
In the embodiment shown in FIG. 6, the existing cooling equipment and the cooling medium shield ring system of the semiconductor device are independent, and are thermally connected through a heat exchanger. That is, in this cooling system, the cooling medium heated in the semiconductor device is indirectly cooled by the cold air generated by the existing cooling equipment. In this configuration, the semiconductor device 1 is placed in the cold air blowing section of the general-purpose air conditioner 7.
The heat generated in the semiconductor element 2 is transferred to the cooling water 19 via the cooling jacket 3, and the heat is transferred to the semiconductor device 1 and the heat exchanger 6 using the pump 18.
By circulating the heat generated in the semiconductor device, it is possible to dissipate the heat generated in the semiconductor device to the cold air blowing portion of the air conditioning equipment 7. The installation part of this heat exchanger 6 for heat dissipation is the air conditioning equipment 7
Since the cold air generated by the semiconductor device is blown out, the temperature is lower than the room temperature around the semiconductor device, and by simply radiating heat directly from the semiconductor device, there is a large temperature difference between the semiconductor device and the heat exchanger for heat radiation, and a large amount of heat can be dissipated. I can do it.
ただし、この半導体装置から放出した熱量分だけ通常よ
り空調室の温度が上昇する。そこで、この温度を室温温
度センサ１３で感知し、空調設備の動作にフィードバッ
クしなければならず、このための制御装置１４を設ける
。この制御装置は半導体装置温度センサ１２で半導体装
置の温度も感知し、これらの温度信号をもとに最適に空
調設備や半導体装置の冷却水循環系を制御する。この結
果、既設空調設備は空調室の熱と半導体装置の発生熱を
合せて屋内熱交換器１０より吸収し、冷却媒体５により
屋外熱交換器８へ運ぶことができ、最終的に無限の熱容
量をもつ屋外の外気に、半導体装置の熱を放散すること
ができる。この実施例のような冷却媒体楯環系が独立な
間接接続方法では半導体装置の冷却媒体に既設冷却設備
の冷却媒体と異なるものを利用することができる。そこ
で半導体装置の冷却媒体楯環系を駆動装置の無い最も簡
単な適用例としてヒートパイプを冷却媒体楯環系として
利用した実施例を第７図に示す。これはヒートパイプの
熱吸収部を半導体装置の冷却ジャケット内に挿入し、熱
放出部を空調機の冷気出口に設置し、半導体装置の発熱
を既設空調設備の屋内熱交換器を介して外に放出するも
のである。ここで、半導体装置の冷却ジャケットは熱伝
導性のよい液体で満たさ、れており、半導体素子で発生
した熱を熱伝導とジャケット内対流を利用して効率良く
ヒートパイプに伝える構造になっている。However, the temperature of the air conditioned room rises more than usual by the amount of heat released from the semiconductor device. Therefore, this temperature must be sensed by the room temperature sensor 13 and fed back to the operation of the air conditioning equipment, and a control device 14 is provided for this purpose. This control device also senses the temperature of the semiconductor device with a semiconductor device temperature sensor 12, and optimally controls the air conditioning equipment and the cooling water circulation system of the semiconductor device based on these temperature signals. As a result, the existing air conditioning equipment can absorb the combined heat of the air conditioning room and the heat generated by the semiconductor devices from the indoor heat exchanger 10 and transport it to the outdoor heat exchanger 8 using the cooling medium 5, ultimately achieving an infinite heat capacity. The heat of the semiconductor device can be dissipated to the outdoor air with a high temperature. In the indirect connection method in which the cooling medium shield ring system is independent as in this embodiment, a cooling medium different from that of the existing cooling equipment can be used as the cooling medium for the semiconductor device. Therefore, as the simplest application example of a cooling medium shield ring system for a semiconductor device without a driving device, an embodiment in which a heat pipe is used as a cooling medium shield ring system is shown in FIG. This involves inserting the heat absorbing part of the heat pipe into the cooling jacket of the semiconductor device, installing the heat releasing part at the cold air outlet of the air conditioner, and discharging the heat generated by the semiconductor device outside through the indoor heat exchanger of the existing air conditioner. It is something that is emitted. Here, the cooling jacket of the semiconductor device is filled with a liquid with good thermal conductivity, and has a structure that efficiently transfers the heat generated in the semiconductor element to the heat pipe using heat conduction and convection inside the jacket. .
以上の実施例は、汎用の空調設備を既設冷却設備として
例示したが、この他、家庭用クーラなどの冷房装置や冷
凍機、あるいは、ヒートポンプシステム等、半導体装置
の機能維持温度である８５℃以下の温度を生成できる冷
熱源を発生する冷却設備のすべてに適用可能である。In the above embodiments, general-purpose air conditioning equipment is used as an example of existing cooling equipment, but in addition, there are other cooling equipment such as household coolers, refrigerators, heat pump systems, etc. It is applicable to all cooling equipment that generates a cold heat source that can generate a temperature of .
本発明によれば、汎用冷却設備で半導体装置の冷却媒体
による冷却システムを構成し、しかも。According to the present invention, a cooling system using a cooling medium for a semiconductor device can be configured using general-purpose cooling equipment.
半導体装置設置場所付近にあるいかなる既設の冷却設備
とも半導体装置冷却用の冷熱源系として利用することが
できる半導体の冷却システムを構成することができ、半
導体装置専用の冷却設備をもたなくても半導体装置で発
生する熱を効率的に系外に放散させることができる。ま
た、配管接続だけで実施可能な簡単な付帯設備で冷却媒
体を使用した高効率な半導体冷却システムを構成でき、
しかも、廉価な設備で空冷方式より大発熱の冷却に対応
することができる。It is possible to configure a semiconductor cooling system that can be used as a cold source system for cooling semiconductor devices with any existing cooling equipment near the location where semiconductor equipment is installed, without having to have dedicated cooling equipment for semiconductor equipment. Heat generated in the semiconductor device can be efficiently dissipated outside the system. In addition, it is possible to configure a highly efficient semiconductor cooling system using a cooling medium with simple ancillary equipment that can be implemented simply by connecting piping.
Furthermore, it is possible to cool large amounts of heat with inexpensive equipment compared to air cooling methods.
第１図、第２図および第３図は本発明の一実施例の半導
体冷却システムの系統図、第４図は従来の半導体冷却方
法の説明図、第５・図は従来の半導体冷却システムの系
統図、第６図、第７図は本発明の他の実施例のシステム
系統図である。
１・・・半導体装置、２・・・半導体素子、３・・・冷
却ジャケット、４・・・半導体装置用膨張弁、５・・・
冷却媒体、６・・・放熱用熱交換器、７・・・空調設備
、８・・・屋外熱第１図
第２図
第５図
ｔ８Figures 1, 2, and 3 are system diagrams of a semiconductor cooling system according to an embodiment of the present invention, Figure 4 is an explanatory diagram of a conventional semiconductor cooling method, and Figure 5 is a diagram of a conventional semiconductor cooling system. 6 and 7 are system diagrams of other embodiments of the present invention. DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Semiconductor element, 3... Cooling jacket, 4... Expansion valve for semiconductor device, 5...
Cooling medium, 6... Heat exchanger for heat radiation, 7... Air conditioning equipment, 8... Outdoor heat Figure 1 Figure 2 Figure 5 t8
Claims (8)
体装置の冷却装置において、 パッケージ型エアコン，ヒートポンプ装置，吸収式冷凍
機等、８５℃以下の低温を生成できる汎用冷却機器を半
導体装置冷却の冷熱源として使用することを特徴とする
半導体冷却装置。1. In semiconductor device cooling equipment that removes heat generated by semiconductor devices via a cooling medium, general-purpose cooling equipment that can generate temperatures below 85°C, such as packaged air conditioners, heat pump devices, and absorption refrigerators, is used as the cold source for cooling semiconductor devices. A semiconductor cooling device characterized by being used as a semiconductor cooling device.
体装置の冷却装置において、 前記半導体装置の設置してあるオフィスあるいは業務用
ビルなどの環境状態を維持する目的で設置してある空調
機や冷房装置などの既設汎用冷却設備の冷却媒体循環系
や前記半導体装置の冷却媒体循環系を冷却媒体を共有す
るよう配管結合し、前記半導体装置の冷却のため前記半
導体装置の稼働に合わせ、前記汎用冷却設備を室内空調
目的と同時、または、独立に運転出来るようにし、前記
汎用冷却設備を前記半導体装置の冷熱源として利用でき
るようにしたことを特徴とする半導体冷却装置。2. In a cooling device for a semiconductor device that removes heat generated by the semiconductor device via a cooling medium, an air conditioner or cooling device installed for the purpose of maintaining the environmental condition of an office or business building where the semiconductor device is installed. The cooling medium circulation system of the existing general-purpose cooling equipment such as the cooling medium circulation system of the semiconductor device and the cooling medium circulation system of the semiconductor device are connected by piping so as to share the cooling medium, and the cooling medium circulation system of the existing general-purpose cooling equipment such as 1. A semiconductor cooling device characterized in that the general-purpose cooling equipment can be operated as a cooling source for the semiconductor device by operating the general-purpose cooling equipment simultaneously with or independently from the purpose of indoor air conditioning.
却装置において、 前記汎用冷却設備と前記半導体装置の冷却媒体楯環系の
結合配管をフレキシブル配管で結合し前記半導体装置の
設置位置を移動可能にしたことを特徴とする半導体冷却
システム。3. In the semiconductor cooling device according to claim 1 or 2, the general-purpose cooling equipment and the connecting pipe of the cooling medium shield ring system of the semiconductor device are connected by a flexible pipe, so that the installation position of the semiconductor device can be moved. A semiconductor cooling system characterized by:
置において。 前記汎用冷却設備の冷却媒体循環系に複数の前記半導体
装置の冷却媒体循環系を直列、あるいは、並列に接続し
たことを特徴とする半導体冷却システム。4. In the semiconductor cooling device according to claims 1 to 3. A semiconductor cooling system characterized in that a cooling medium circulation system of a plurality of semiconductor devices is connected in series or in parallel to a cooling medium circulation system of the general-purpose cooling equipment.
置において、 前記汎用冷却設備の制御対象温度と共に前記半導体装置
の温度を入力しこれらの温度を基に前記冷却設備を最適
に動作させる制御装置を設けたことを特徴とする半導体
冷却装置。5. In the semiconductor cooling device according to claims 1 to 4, a control device inputs the temperature of the semiconductor device together with the temperature to be controlled of the general-purpose cooling equipment and optimally operates the cooling equipment based on these temperatures. A semiconductor cooling device characterized by being provided with.
体装置の冷却装置において、 前記半導体装置の設置してあるオフィスあるいは業務用
ビルなどの環境状態を維持するため、設置してある空調
機や冷房装置などの既設汎用冷却設備の冷却媒体循環系
と前記半導体装置の前記冷却媒体循環系を熱交換器を介
して間接に結合し、前記冷却設備を前記半導体装置の冷
熱源として利用したことを特徴とする半導体冷却装置。6. In a cooling device for a semiconductor device that removes heat generated by the semiconductor device via a cooling medium, an air conditioner or cooling device installed in order to maintain the environmental condition of the office or business building where the semiconductor device is installed is used. The cooling medium circulation system of an existing general-purpose cooling equipment such as the above and the cooling medium circulation system of the semiconductor device are indirectly connected via a heat exchanger, and the cooling equipment is used as a cold source for the semiconductor device. semiconductor cooling equipment.
体装置の熱放散用熱交換器をもつ半導体冷却装置。7. The semiconductor cooling device according to claim 6, comprising a heat exchanger for heat dissipation of the semiconductor device that can be installed at a cold air outlet of the existing general-purpose cooling equipment.
置において、 前記半導体装置の前記冷却媒体循環系をヒートパイプを
用いて構成したことを特徴とする半導体冷却装置。8. The semiconductor cooling device according to claim 6 or 7, wherein the cooling medium circulation system of the semiconductor device is configured using a heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12884189A JPH02308558A (en) | 1989-05-24 | 1989-05-24 | Semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12884189A JPH02308558A (en) | 1989-05-24 | 1989-05-24 | Semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02308558A true JPH02308558A (en) | 1990-12-21 |
Family
ID=14994716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12884189A Pending JPH02308558A (en) | 1989-05-24 | 1989-05-24 | Semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02308558A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6370897B1 (en) * | 1999-07-02 | 2002-04-16 | Tokyo Electron Limited | Semiconductor manufacturing facility |
| US7612448B2 (en) | 2004-12-13 | 2009-11-03 | Daikin Industries, Ltd. | Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
| JP2010098063A (en) * | 2008-10-15 | 2010-04-30 | Mitsubishi Jisho Sekkei Inc | In-building cooling mechanism |
| CN103648254A (en) * | 2013-11-25 | 2014-03-19 | 银川博聚工业产品设计有限公司 | Low-temperature air source direct server machine room cooling device |
-
1989
- 1989-05-24 JP JP12884189A patent/JPH02308558A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6370897B1 (en) * | 1999-07-02 | 2002-04-16 | Tokyo Electron Limited | Semiconductor manufacturing facility |
| US7612448B2 (en) | 2004-12-13 | 2009-11-03 | Daikin Industries, Ltd. | Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
| EP1830406A4 (en) * | 2004-12-13 | 2011-04-06 | Daikin Ind Ltd | Power module, method for producing same and air conditioner |
| JP2010098063A (en) * | 2008-10-15 | 2010-04-30 | Mitsubishi Jisho Sekkei Inc | In-building cooling mechanism |
| CN103648254A (en) * | 2013-11-25 | 2014-03-19 | 银川博聚工业产品设计有限公司 | Low-temperature air source direct server machine room cooling device |
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