JP2010098063A - In-building cooling mechanism - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an in-building cooling mechanism which efficiently cools OA equipment installed in various positions in a building without using pumps. <P>SOLUTION: The in-building cooling mechanism 10 for cooling an OA equipment room 41 wherein OA equipment 17 installed on a floor 42 in a building 42 are stored includes a heat pipe 11 which has a working fluid 14 sealed therein and has a loop shape. The heat pipe 11 includes a heat reception part 12 disposed in the OA equipment room 41, and a heat dissipation part 13 disposed outside the OA equipment room 41, for example, outside the building 42. The heat pipe 11 includes a first pipe 15 which the working fluid 14 passes when the working fluid 14 circulates from the heat reception part 12 to the heat dissipation part 13, and a second pipe 16 which the working fluid 14 passes when the working fluid 14 circulates from the heat dissipation part 13 to the heat reception part 12. A part 15a of the first pipe 15 and a part 16a of the second pipe 16 are in contact with each other. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a building cooling mechanism that cools a building using a heat pipe.

  In a building where OA equipment such as a computer is arranged indoors, the heat load generated inside the OA equipment is large, and therefore it is necessary to cool the room throughout the year even when the building is cool. For this reason, in this kind of building, there exists a problem that the energy cost required for the operation | movement of the apparatus which cools a room, for example, an air conditioner, increases.

  As an example of a conventional air conditioner, an air conditioning system including an air conditioner including a heat pump including a pump and a coolant circulating in the heat pump is known. By cooling indoor air using this air conditioning system, OA equipment arranged indoors is cooled.

  However, in the air conditioning system, the OA equipment is cooled by the air conditioning system through the air having a small thermal conductivity, so that the cooling efficiency is poor. Moreover, since it is necessary to always drive the heat pump even when the building is cool, it is not desirable in terms of energy saving. Further, since it is necessary to circulate the coolant using the pump, extra energy is consumed and noise is generated when the pump is driven.

Then, the indoor air conditioner using a heat pipe which can cool a building using outside air when a pump is unnecessary and the building outside is cool is proposed (patent document 1). .
JP 2005-195223 A

  However, the indoor air conditioner shown in Patent Document 1 has a heat pipe, and this heat pipe is provided in a straight line only in a limited area between the room and the underfloor space. For this reason, it is difficult to cool OA equipment installed in various places in the building by the indoor air conditioner disclosed in Patent Document 1.

  The present invention has been made in consideration of such points, and can cool OA equipment installed at various locations in a building without using a pump and with high cooling efficiency. An object of the present invention is to provide an indoor cooling mechanism having a heat pipe.

  The present invention relates to a building cooling mechanism that cools an area to be cooled in a building, and includes a heat pipe in which a working liquid is enclosed and has a loop shape, and the heat pipe is a heat receiving unit disposed in the area to be cooled. And a heat dissipating part arranged outside the area to be cooled, and the working fluid circulates in one direction between the heat receiving part and the heat dissipating part.

  The present invention is a building cooling mechanism in which the heat radiating portion of the heat pipe is disposed outside the building.

  The present invention includes a cooling device that cools a part of a heat pipe, temperature monitoring means that monitors the temperature of a cooling target area, and a control device that controls the cooling device according to the monitored temperature of the cooling target area. The building cooling mechanism is further provided.

  In the present invention, the cooling target is an OA device, and the heat receiving portion of the heat pipe is in direct or indirect contact with the OA device.

  According to the present invention, an OA device includes a housing, a heat generating component housed in the housing and generating heat during operation, one end thereof connected to the heat generating component, and the other end connected to a part of the inner surface of the housing. A heat transfer means for transferring generated heat to the housing, and the heat receiving portion of the heat pipe is in contact with a part of the outer surface of the housing of the OA equipment.

  The present invention is a building cooling mechanism in which the cooling device includes a cooling water pipe that contacts a part of the heat pipe, and a cooling water pump that distributes the cooling water to the cooling water pipe.

  According to the present invention, a building cooling mechanism that cools a cooling target area in a building includes a heat pipe in which a working fluid is enclosed and has a loop shape, and the heat pipe is disposed in the cooling target area. It has a heat receiving part and a heat radiating part arranged outside the area to be cooled. For this reason, the area to be cooled can be cooled without using a pump. Thereby, the energy required to drive the pump can be reduced.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. 1 and 2 are views showing a building cooling mechanism according to the first embodiment of the present invention. Among these, FIG. 1 is sectional drawing which shows the building cooling mechanism provided in the building in the 1st Embodiment of this invention, FIG. 2 is a heat pipe in the 1st Embodiment of this invention. It is a figure which expands and shows the heat receiving part of a heat pipe.

  First, the overall configuration of the building cooling mechanism 10 will be described with reference to FIG. As shown in FIG. 1, an indoor cooling mechanism 10 is installed to cool the OA equipment room 41 (cooling target area) that houses the OA equipment 17 (cooling target) placed on the floor 43 of the building 42. Has been. The building cooling mechanism 10 includes a heat pipe 11 in which a working fluid 14 is enclosed and has a loop shape. In this case, the heat pipe 11 includes the heat receiving part 12 disposed in the OA equipment room 41, the heat radiation part 13 disposed outside the OA equipment room 41, for example, the outside 42a of the building 42, and the circulation pipe 11a. The hydraulic fluid 14 circulates in the circulation pipe 11a between the heat receiving portion 12 and the heat radiating portion 13 in the direction indicated by the arrow in FIG.

  Further, in order to cool a part 18 of the circulation pipe 11 a of the heat pump 11, a cooling device 20 is installed in the duct space 42 b in the building 42. Further, in the OA equipment room 41, temperature monitoring means 25 for monitoring the temperature inside the OA equipment 17 installed in the OA equipment room 41, particularly the temperature of a heat generating component 28 described later, is provided, and the monitored OA. The cooling device 20 is controlled by the control device 26 in accordance with the temperature inside the device 17.

  Among them, the cooling device 20 is installed in the duct space 42 b of the building 42, and the cooling water pipe 22 that contacts the part 18 of the circulation pipe 11 a of the heat pipe 11, and the cooling water 23 is installed in the duct space 42 b and distributes the cooling water 23 to the cooling water pipe 22. And a cooling water pump 21 to be operated. Further, the part 18 of the circulation pipe 11a that contacts the cooling water pipe 22 has a plurality of bent portions so that the contact area with the cooling water pipe 22 becomes larger. Similarly, a portion of the cooling water pipe 22 that contacts the part 18 of the heat pipe 11 has a plurality of bent portions 22a.

  As shown in FIG. 2, the OA device 17 is housed in a housing 27, a heat generating component 28 that generates heat during operation, one end 29 a thereof is connected to the heat generating component 28, and the other end 29 b is connected to the housing 27. And a heat transfer means 29 for transferring the heat generated from the heat generating component 28 to the housing 27. The heat receiving portion 12 of the heat pipe 11 is in contact with a part 27 b of the outer surface of the housing 27 of the OA device 17. In this case, as shown in FIG. 2, a heat radiation sheet 30 a is interposed between the heat generating component 28 and one end 29 a of the heat transfer means 29, and a part 27 b of the outer surface of the housing 27 and the other end 29 b of the heat transfer means 29. A heat radiating sheet 30b is interposed therebetween. Further, a heat radiating sheet 30 c is interposed between the heat receiving portion 12 of the heat pipe 11 and a part 27 b of the outer surface of the housing 27 of the OA device 17.

  The heat generating component 28 is a component that generates heat during operation of the OA device 17 and reaches a high temperature, and is, for example, a CPU, a chip set, a hard disk, or the like. The heat transfer means 29 is means for transferring heat generated from the heat generating component 28 to the housing 27, and is, for example, a heat pipe for OA equipment, a heat sink, a metal plate, or the like. The heat radiation sheets 30a, 30b, and 30c are sheets having high thermal conductivity and flexibility and adhesiveness. For example, the heat dissipation sheets 30a, 30b, and 30c are, for example, sheets in which a thermal conductive filler is blended in a silicon-based adhesive material.

  Next, the heat pipe 11 will be described in detail with reference to FIGS. 1 and 2. As shown in FIG. 1, the circulation pipe 11 a of the heat pipe 11 includes a first pipe portion 15 through which the hydraulic fluid 14 passes when the hydraulic fluid 14 flows from the heat receiving portion 12 to the heat radiating portion 13, and the hydraulic fluid 14 is the heat radiating portion. 13 and a second pipe portion 16 through which the hydraulic fluid 14 passes when flowing from the heat receiving portion 12 to the heat receiving portion 12. As shown in FIGS. 1 and 2, a part 15 a of the first pipe part 15 is in contact with a part 16 a of the second pipe part 16, whereby the first pipe part 15, the second pipe part 16, Heat is conducted between them. In the present embodiment, as will be described later, the temperature of the part 15a of the first pipe part 15 is higher than the temperature of the part 16a of the second pipe part 16, so Heat is conducted to the part 16 a of the two pipe part 16. That is, the part 15 a of the first pipe part 15 is cooled by the part 16 a of the second pipe part 16.

  Further, as shown in FIG. 2, the heat receiving portion 12 of the heat pipe 11 is connected to a part 27 b of the outer surface of the housing 27 of the OA device 17, so that the heat generated in the OA device 17 is directly applied to the heat pipe 11. Is conducted to the heat receiving portion 12. As a result, the heat receiving portion 12 of the heat pipe 11 is heated, and as a result, the working fluid 14 sealed in the heat pipe boils and a vapor bubble 19 is generated. In this embodiment, water is used as the working fluid 14 and the inside of the heat pipe 11 is depressurized to an atmospheric pressure or lower. Therefore, the hydraulic fluid 14 can boil even at a temperature of 40 degrees or less.

  Next, the operation of the present embodiment having such a configuration will be described.

  As shown in FIGS. 1 and 2, the hydraulic fluid 14 sealed in the heat pipe 11 circulates in the direction indicated by the arrow between the heat receiving portion 12 and the heat radiating portion 13 of the heat pipe 11. Here, the temperature of the working fluid 14 when reaching the heat receiving portion 12 of the heat pipe 11 is about 20 degrees, the temperature of the heat generating component 28 of the OA equipment 17 is about 70 degrees, and the outer surface of the casing 27 of the OA equipment 17 is outside. It is assumed that the temperature of the part 27b is about 65 degrees. In this case, since the heat receiving part 12 of the heat pipe 11 is connected to a part 27 b of the outer surface of the housing 27 of the OA equipment, heat is conducted from the OA equipment 17 to the heat receiving part 12 of the heat pipe 11. As a result, the hydraulic fluid 14 in the heat receiving portion 12 of the heat pipe 11 is heated, and as a result, the hydraulic fluid 14 boils and vapor bubbles 19 are generated.

The generated vapor bubble 19 rises due to buoyancy acting on the vapor bubble 19. At this time, the vapor bubble 19 rises with the surrounding hydraulic fluid 14. For this reason, the hydraulic fluid 14 can circulate in the direction shown by the arrow in FIG. 1 and FIG. Thus, in this embodiment, since the working fluid 14 of the heat pipe 11 can be circulated by natural convection without using a pump, the energy required to drive the pump is reduced and the pump is generated. It can also solve problems caused by noise.
Generally, since a pump has a movable part, regular maintenance is required to maintain its performance. In the present embodiment, since the heat pipe 11 having no moving part is used instead of using a pump, the reliability and durability of the building cooling mechanism 10 are improved. The cost required for 10 maintenance can be reduced.

  Thereafter, the vapor bubble 19 rising to the part 15 a of the first pipe part 15 is absorbed by the gas part 19 a formed in the part 15 a of the first pipe part 15. Thereafter, the gas part 19 a formed in the part 15 a of the first pipe part 15 is cooled by the working fluid 14 that flows through the part 16 a of the second pipe part 16. As a result, the gas portion 19a is condensed to become the working fluid 14 having a temperature of about 40 degrees. In addition, since the hydraulic fluid 14 which distribute | circulates in the part 16a of the 2nd pipe part 16 is the hydraulic fluid 14 after cooling with the external air outside the building 42 and the cooling device 20 so that it may mention later, the temperature is 12 for example. It is a degree.

  Thereafter, the working fluid 14 having a temperature of about 40 degrees passes through a part 15 a of the first pipe portion 15 and then reaches the heat radiating portion 13 of the heat pipe 11. The temperature of the outside air outside the building 42 is lower than the temperature of the working fluid 14, for example, about 20 degrees. Therefore, the working fluid 14 is cooled by the outside air while the working fluid 14 passes through the heat radiating portion 13 of the heat pipe. . As a result, the temperature of the hydraulic fluid 14 is about 22 degrees to about 25 degrees. As shown in FIG. 1, in the heat radiating portion 13 of the heat pipe, the heat pipe 11 is provided with a large number of bent portions 13 a. These many bent portions 13a are provided in order to lengthen the time required for the hydraulic fluid 14 to pass through the heat radiating portion 13 of the heat pipe, thereby cooling the hydraulic fluid 14 to a lower temperature by the outside air.

  Next, the hydraulic fluid 14 of the heat pipe 11 reaches a part 18 of the circulation pump 11 a of the heat pipe 11 that is in contact with the cooling water pipe 22 of the cooling device 20. Cooling water 23 is circulated through the cooling water pipe 22 by a cooling water pump 21 of the cooling device 20. The temperature of the cooling water 23 is lower than the temperature of the hydraulic fluid 14, for example, 10 degrees. For this reason, while the hydraulic fluid 14 passes through a part 18 of the circulation pump 11a of the heat pipe 11, the hydraulic fluid 14 is cooled by the cooling water pipe 22 of the cooling device 20, and thereby the temperature of the hydraulic fluid 14 becomes about 12 degrees. . As shown in FIG. 1, the part 18 of the circulation pump 11 a that contacts the cooling water pipe 22 has a plurality of bent portions 18 a so that the contact area with the cooling water pipe 22 becomes larger. Similarly, the cooling water pipe 22 also has a plurality of bent portions 22 a corresponding to the part 18 of the heat pipe 11. Thereby, the hydraulic fluid 14 can be cooled to a lower temperature.

  Thereafter, the working fluid 14 of the heat pipe 11 reaches the part 16a of the second pipe portion 16 through the second pipe portion 16 of the heat pipe, as shown in FIGS. In the part 16 a of the second pipe part 16, as described above, the hydraulic fluid 14 in the part 16 a of the second pipe part 16 flows from the gas part 19 a formed in the part 15 a of the first pipe part 15. By receiving heat, the working fluid 14 in the portion 16a of the second pipe portion 16 is heated to about 20 degrees. Thereafter, the hydraulic fluid 14 after passing through the part 16a of the second pipe portion 16 reaches the heat receiving portion 12 of the heat pipe 11 and cools the OA device 17 as described above.

  During this time, the temperature of the cooling water 23 of the cooling device 20 is adjusted by the control device 26. For example, when the heat load of the OA device 17 is small, the OA device 17 can be appropriately cooled even if the temperature of the cooling water 23 of the cooling device 20 is higher than the above-described 10 degrees. In this case, the control device 26 can set the temperature of the cooling water to a temperature higher than the above-described 10 degrees, for example, 13 degrees. As a result, the energy used to generate the cooling water 23 of the cooling device 20 can be reduced, and thereby the energy consumption of the building cooling mechanism 10 can be reduced. In this case, the control device 26 controls the temperature of the cooling water 23 of the cooling device 20 so that the temperature of the heat generating component 28 of the OA device 17 monitored by the monitoring means 25 does not exceed a predetermined temperature, for example, 70 degrees. can do.

  Further, when the temperature of the outside air outside the building 42 is lower than 20 degrees, for example, about 10 degrees, the control device 26 stops the cooling device 20, and the working fluid 14 of the heat pipe 11 is sent only to the outside air outside the building 42. It may be cooled by. Thereby, the energy consumed by the cooling device 20 can be reduced, and the energy consumption of the building cooling mechanism 10 can be further reduced. In this case as well, the control device 26 causes the cooling device 20 to operate again when the temperature of the heat generating component 28 of the OA device 17 monitored by the monitoring means 25 exceeds a predetermined temperature, for example, 70 degrees. 20 may be controlled.

  As described above, according to the present embodiment, the building cooling mechanism 10 includes the heat pipe 11 including the circulation pipe 11a having a loop shape, in which the working fluid 14 is enclosed. For this reason, the OA equipment 17 can be directly cooled by the heat pipe 11 without passing through air having a low thermal conductivity. As a result, the cooling efficiency of the building cooling mechanism 10 can be improved.

  Moreover, according to this Embodiment, the heat pipe 11 of the building cooling mechanism 10 is arrange | positioned in the heat receiving part 12 arrange | positioned in the OA equipment room 41, and the outside 42a of the OA equipment room 41, for example, the exterior 42a of the building 42. And the heat dissipating part 13. The heat pipe 11 includes a first pipe portion 15 through which the hydraulic fluid 14 passes when the hydraulic fluid 14 flows from the heat receiving portion 12 to the heat radiating portion 13, and a heat pipe 11 when the hydraulic fluid 14 flows from the heat radiating portion 13 to the heat receiving portion 12. And a second pipe portion 16 through which the hydraulic fluid 14 passes. For this reason, the hydraulic fluid 14 of the heat pipe 11 can be circulated in one direction in the circulation pipe 11 a between the heat receiving portion 12 and the heat radiating portion 13 without using a pump. This can reduce the energy required to drive the pump when cooling the OA device 17, and can also solve the problem caused by the noise generated by the pump. Moreover, the reliability and durability of the building cooling mechanism 10 can be improved by using the heat pipe 11 which does not have a movable part instead of using a pump. Thereby, the cost required for maintenance of the building cooling mechanism 10 can be reduced.

  Further, according to the present embodiment, the building cooling mechanism 10 includes the cooling device 20 that cools the heat pipe 11, the temperature monitoring means 25 that monitors the temperature inside the OA equipment 17 installed in the OA equipment room 41, and And a control device 26 that controls the cooling device 20 in accordance with the temperature inside the monitored OA device 17. For this reason, the cooling device 20 can be optimally controlled according to the heat load of the OA device 17. Thereby, the energy consumed by the building cooling mechanism 10 can be reduced to the minimum necessary amount.

  In the present embodiment, an example in which a heat radiation sheet 30c is interposed between the heat receiving portion 12 of the heat pipe 11 and a part 27b of the outer surface of the housing 27 of the OA device 17 is shown. However, the present invention is not limited to this, and heat radiating grease may be interposed instead of the heat radiating sheet 30c, or the heat receiving portion 12 of the heat pipe 11 may be directly connected to a part 27b of the outer surface of the housing 27 of the OA device 17. You may make it contact. Alternatively, a plate having high thermal conductivity may be interposed between the heat receiving portion 12 of the heat pipe 11 and a part 27b of the outer surface of the casing 27 of the OA device 17. For example, in the OA equipment room 41, the heat receiving portion 12 of the heat pipe 11 may be covered with a steel wall surface (not shown). Thereby, the appearance in the OA equipment room 41 can be improved without significantly impairing the cooling efficiency of the building cooling mechanism 10.

  Further, in the present embodiment, after the heat generated from the heat generating component 28 is transferred to the other end 29b of the heat transfer means 29, the transferred heat passes through the heat dissipation sheet 30b, the housing 27 of the OA equipment, and the heat dissipation sheet 30c. An example in which the heat is transferred to the heat receiving portion 12 of the heat pipe 11 is shown. However, the present invention is not limited to this, and the transferred heat may be conducted to the heat receiving portion 12 of the heat pipe 11 through the heat radiating sheet 30b and the heat radiating sheet 30c. In this case, for example, by opening a region corresponding to the heat dissipation sheet 30b in the housing 27 of the OA device (not shown) and fitting the heat dissipation sheet 30b into the open region, the heat dissipation sheet 30b and the heat dissipation sheet 30c As a result, the transferred heat is conducted to the heat receiving portion 12 of the heat pipe 11 through the heat radiating sheet 30b and the heat radiating sheet 30c. In this case, the heat radiating sheet 30b fitted in the opening and the heat radiating sheet 30c on the heat receiving portion 12 side may be integrally formed.

  Moreover, in this Embodiment, the heat receiving part 12 of the heat pipe 11 showed the example arrange | positioned in the OA equipment room 41. FIG. However, the present invention is not limited to this, and the heat receiving portion 12 of the heat pipe 11 may be arranged in a location outside the OA equipment room 41 in the building 42. In this case, the heat receiving part 12 of the heat pipe 11 is in contact with the side wall or floor of the OA equipment room 41 directly or indirectly through a heat conducting component such as a heat sink or a heat radiating sheet. The heat receiving part 12 of the heat pipe 11 is arranged at the place (not shown). And the side wall or floor which contacts the heat receiving part 12 directly or indirectly, and the OA equipment 17 are connected by heat conduction means, for example, a heat pipe (not shown) for the OA equipment room, thereby the OA equipment. The heat generated from 17 may be conducted to the heat receiving portion 12 of the heat pipe 11 through the heat pipe for the OA equipment room.

  Moreover, in this Embodiment, the cooling device 20 showed the example which has the cooling water pipe 22 which contacts the part 18 of the heat pipe 11, and the cooling water pump 21 which distribute | circulates the cooling water 23 to the cooling water pipe 22. FIG. . However, the present invention is not limited to this, and the cooling device 20 may have a water storage tank (not shown) in which the cooling water 23 is stored. In this case, the hydraulic fluid 14 of the heat pipe 11 is cooled by passing the heat pipe 11 through the water storage tank of the cooling device 20.

  Moreover, in this Embodiment, the example in which water is used as the working fluid 14 of the heat pipe 11 was shown. However, the working fluid 14 is not limited to this, and a liquid having a large density difference between the gas state and the liquid state, for example, alcohol, liquid metal, magnetic fluid, or the like may be used.

  Moreover, in this Embodiment, the inside of the heat pipe 11 was pressure-reduced below to atmospheric pressure, Therefore For example, the hydraulic fluid 14 showed the boiling at the temperature below 40 degree | times. However, the present invention is not limited to this, and the inside of the heat pipe 11 may be decompressed so that the working fluid 14 boils at 60 degrees, for example. In this case, even if the temperature of the outside air outside the building 42 is high, for example, 40 degrees, the gas portion 19a formed by the vapor bubbles 19 generated by boiling the working fluid 14 is cooled and condensed by the outside air. be able to. Thereby, even if the temperature of the outside air outside the building 42 is high, for example, 40 degrees, the OA equipment can be cooled without using the cooling device 20.

Second Embodiment Hereinafter, a second embodiment of the present invention will be described with reference to FIG. Here, FIG. 3 is a cross-sectional view showing the building cooling mechanism provided in the building in the second embodiment of the present invention.

  The second embodiment shown in FIG. 3 differs only in that the area to be cooled consists of the living room 53 and the radiation panel 52 is disposed between the heat receiving portion 12 of the heat pipe 11 and the living room 53. Other configurations are substantially the same as those of the first embodiment shown in FIGS. 3, the same parts as those of the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 3, the radiation panel 52 is attached above the ceiling 54 of the living room 53, and the heat receiving part 12 of the heat pipe 11 in the building cooling mechanism 10 is in contact with the radiation panel 52. In the living room 53, monitoring means 51 for monitoring the temperature in the living room 53 is provided. In the living room 53, the operator 34 operates the desktop 33 toward the desk 31.

  Next, the operation of the present embodiment having such a configuration will be described.

  As shown in FIG. 3, the working fluid 14 sealed in the heat pipe circulates in the direction indicated by the arrow in the circulation pipe 11 a between the heat receiving portion 12 and the heat radiating portion 13 of the heat pipe 11. . In this embodiment, the outside air temperature of the outside 42a of the building 42 is about 20 degrees. Since an electronic device such as the desktop 33 is used in the living room 52, the temperature in the living room 52 is higher than the outside air temperature of the outside 42a of the building 42, for example, about 28 degrees. In this case, the temperature of the hydraulic fluid 14 when it reaches the heat receiving portion 12 of the heat pipe 11 is about 15 degrees, the temperature of the hydraulic fluid 14 after passing through the part 15a of the first pipe portion 15 is about 25 degrees, cooling The temperature of the cooling water 23 of the apparatus 20 is about 10 degrees, and the temperature of the hydraulic fluid 14 immediately after being cooled by the cooling apparatus 20 is about 12 degrees.

  As in the case of the first embodiment shown in FIGS. 1 and 2, in FIG. 3, the radiant panel 52 is cooled by the hydraulic fluid 14 passing through the heat receiving portion 12 of the heat pipe 11. For this reason, the interior of the living room 52 is cooled by radiation cooling from the radiation panel 52. As a result, the interior of the living room 52 can be cooled without directly applying cold air to the operator 34 as in a conventional air conditioner.

  At this time, the hydraulic fluid 14 that passes through the heat receiving portion 12 of the heat pipe 11 boils due to the heat conducted from the living room 52 through the radiation panel 52. Since the subsequent action of the hydraulic fluid 14 is the same as that of the first embodiment shown in FIGS. 1 and 2, detailed description thereof is omitted.

  As described above, according to the present embodiment, the radiation panel 52 is attached to the ceiling portion 54 of the living room 53, and the heat receiving portion 12 of the heat pipe 11 in the building cooling mechanism 10 is in contact with the radiation panel 52. For this reason, the interior of the living room 52 is cooled by radiation cooling from the radiation panel 52. As a result, the interior of the living room 52 can be cooled without directly applying cold air to the operator 34 as in a conventional air conditioner.

  Moreover, according to this Embodiment, the heat pipe 11 of the building cooling mechanism 10 is arrange | positioned in the heat receiving part 12 arrange | positioned in the OA equipment room 41, and the outside 42a of the OA equipment room 41, for example, the exterior 42a of the building 42. And the heat dissipating part 13. The heat pipe 11 includes a first pipe portion 15 through which the hydraulic fluid 14 passes when the hydraulic fluid 14 flows from the heat receiving portion 12 to the heat radiating portion 13, and a heat pipe 11 when the hydraulic fluid 14 flows from the heat radiating portion 13 to the heat receiving portion 12. And a second pipe portion 16 through which the hydraulic fluid 14 passes. For this reason, the hydraulic fluid 14 of the heat pipe 11 can be circulated in one direction between the heat receiving part 12 and the heat radiating part 13 without using a pump. This can reduce the energy required to drive the pump when cooling the interior of the living room 52, and can solve the problem caused by the noise generated by the pump. Moreover, the reliability and durability of the building cooling mechanism 10 can be improved by using the heat pipe 11 which does not have a movable part instead of using a pump. Thereby, the cost required for maintenance of the building cooling mechanism 10 can be reduced.

  Further, according to the present embodiment, the building cooling mechanism 10 includes the cooling device 20 that cools the heat pipe 11, the temperature monitoring means 51 that monitors the temperature in the living room 52, and the temperature in the monitored living room 52. Accordingly, a control device 26 that controls the cooling device 20 is provided. For this reason, the cooling device 20 can be optimally controlled according to the temperature in the living room 52. Thereby, the energy consumed by the building cooling mechanism 10 can be reduced to the minimum necessary amount.

FIG. 1 is a cross-sectional view showing a building cooling mechanism provided in a building in the first embodiment of the present invention. FIG. 2 is an enlarged view showing a heat receiving portion of the heat pipe in the heat pipe in the first embodiment of the present invention. FIG. 3 is a cross-sectional view showing a building cooling mechanism provided in the building in the second embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Building cooling mechanism 11 Heat pipe 11a Circulation pipe 12 Heat receiving part 13 of heat pipe Heat-radiating part 13a of heat pipe Bending part 14 of heat-radiating part Hydraulic fluid 15 First pipe part 15a of heat pipe Part of first pipe part 16 Heat Second pipe portion 16a of the pipe Part 17 of the second pipe part 17 OA equipment 18 Part of the circulation pipe 18a Bent part of the circulation pipe 19 Steam bubble 19a Gas part 20 Cooling device 21 Cooling water pump 22 Cooling water pipe 23 Cooling Water 25 Temperature monitoring means 26 Control device 27 OA equipment housing 27a Housing inner surface part 27b Housing outer surface part 28 Heat generating component 29 Heat transfer means 29a Heat transfer means one end 29b Heat transfer means other end 30a Heat dissipation sheet 30b Heat radiation sheet 30c Heat radiation sheet 31 Desk 32 Monitor for OA equipment 33 Desktop 34 Worker 35 Chair 4 1 OA equipment room 42 Building 42a Building exterior 42b Building duct space 43 Floor 51 Temperature monitoring means 52 Radiation panel 53 Living room 54 Ceiling

Claims (6)

In the building cooling mechanism that cools the area to be cooled in the building,
The inside is filled with hydraulic fluid and has a heat pipe with a loop shape.
The heat pipe has a heat receiving part arranged in the area to be cooled and a heat radiating part arranged outside the area to be cooled,
The building interior cooling mechanism characterized in that the working fluid circulates in one direction between the heat receiving portion and the heat radiating portion.   The building cooling mechanism according to claim 1, wherein the heat radiating portion of the heat pipe is disposed outside the building. A cooling device for cooling a part of the heat pipe;
Temperature monitoring means for monitoring the temperature of the area to be cooled;
The building cooling mechanism according to claim 1, further comprising a control device that controls the cooling device in accordance with the monitored temperature of the area to be cooled. The cooling target is OA equipment,
The building cooling mechanism according to any one of claims 1 to 3, wherein the heat receiving portion of the heat pipe is in direct or indirect contact with the OA equipment. The OA equipment is a housing, a heat generating component housed in the housing and generating heat during operation, one end of which is connected to the heat generating component, and the other end connected to a part of the inner surface of the housing to generate heat generated from the heat generating component. Heat transfer means for transferring to
The building cooling mechanism according to claim 4, wherein the heat receiving portion of the heat pipe is in contact with a part of the outer surface of the OA device housing.   The building according to any one of claims 3 to 5, wherein the cooling device includes a cooling water pipe that contacts a part of the heat pipe, and a cooling water pump that distributes the cooling water to the cooling water pipe. Cooling mechanism.

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