JP2008267613A - Temperature control device - Google Patents

Temperature control device Download PDF

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JP2008267613A
JP2008267613A JP2007106814A JP2007106814A JP2008267613A JP 2008267613 A JP2008267613 A JP 2008267613A JP 2007106814 A JP2007106814 A JP 2007106814A JP 2007106814 A JP2007106814 A JP 2007106814A JP 2008267613 A JP2008267613 A JP 2008267613A
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heat
floor
storage container
temperature control
refrigerant
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Daisuke Asagiri
大介 朝桐
Takara Hirano
宝 平野
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature control device capable of reducing costs of electric power by utilizing cheaper midnight power. <P>SOLUTION: A storage container 11 for storing the water (heat medium) at least heater or cooled by a refrigerant of a heat pump 16, is installed on an underfloor face 10 of a foundation internal space under a floor of the first-floor of a building 1, heat exchangers 8a, 8b, 12a, 12b are disposed in spaces respectively between second-floor floorboard 7a, 7b and first-floor ceiling board 6a, 6b, and the underfloor face 10, and the heated or cooled water (heat medium) in the storage container 11 is supplied to the heat exchangers 8a, 8b, 12a, 12b by circulation pipes 14a, 14b and a circulation pipe 13. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、建物の室内冷暖房を行う温調装置に関する。   The present invention relates to a temperature control device that performs indoor air conditioning of a building.

従来より、建物の床下空間（例えば、２階（上階）の床下と１階（下階）の天井との間の空間）に放熱器（熱交換器）を設置し、この放熱器に屋外に設置したボイラから温水を循環させて床下空間を加熱して、室内を床面からの輻射熱によって暖房する構成の温調装置が知られている（例えば、特許文献１参照）。
特開２００２−６１８５４号公報 Conventionally, a radiator (heat exchanger) has been installed in the under-floor space of a building (for example, the space between the floor of the second floor (upper floor) and the ceiling of the first floor (lower floor)). There is known a temperature control device configured to circulate warm water from a boiler installed in the floor to heat the underfloor space and to heat the room by radiant heat from the floor surface (for example, see Patent Document 1).
JP 2002-61854 A

ところで、前記特許文献１のような温調装置（床下暖房装置）では、暖房時にボイラを常に運転して温水を得る必要があるので、割安な深夜電力を利用できず、暖房運転の電力コストが高いものとなってしまう。   By the way, in the temperature control apparatus (underfloor heating apparatus) like the said patent document 1, since it is necessary to always drive | operate a boiler at the time of heating and to obtain warm water, cheap midnight power cannot be utilized and the electric power cost of heating operation is It will be expensive.

そこで、本発明は、割安な深夜電力を利用可能にして電力コストの低減を図ることができる温調装置を提供することを目的とする。   Then, an object of this invention is to provide the temperature control apparatus which can aim at reduction of electric power cost by making cheap late-night electric power available.

前記目的を達成するために請求項１に係る本発明の温調装置は、熱源により加熱または冷却の少なくとも一方が行われる熱媒体を貯留する貯留容器を、建物の最下階床下の基礎内空間に設置すると共に、建物の少なくとも上階床と下階天井との間の空間に熱交換器を設置し、前記貯留容器内の加熱または冷却された前記熱媒体または該熱媒体の熱を、熱搬送手段により前記熱交換器へ供給させることを特徴としている。   In order to achieve the above object, the temperature control apparatus according to the first aspect of the present invention provides a storage container for storing a heat medium that is heated or cooled by a heat source, and a space in the foundation below the bottom floor of the building. And installing a heat exchanger in a space between at least the upper floor and the lower floor of the building, and heating or cooling the heat medium in the storage container or the heat of the heat medium. It is characterized in that the heat exchanger supplies the heat exchanger.

また、請求項２に係る発明は、前記熱搬送手段が、前記貯留容器と前記熱交換器との間で前記熱媒体を循環搬送させる循環パイプであることを特徴としている。   The invention according to claim 2 is characterized in that the heat transfer means is a circulation pipe that circulates and transfers the heat medium between the storage container and the heat exchanger.

また、請求項３に係る発明は、前記熱搬送手段がヒートパイプであることを特徴としている。   The invention according to claim 3 is characterized in that the heat transfer means is a heat pipe.

また、請求項４に係る発明は、前記熱源がヒートポンプであることを特徴としている。   The invention according to claim 4 is characterized in that the heat source is a heat pump.

本発明に係る温調装置によれば、熱源により加熱または冷却される熱媒体を貯留する貯留容器を有しているので、割安な深夜電力を利用して深夜時間帯に熱源により加熱または冷却された熱媒体を貯留タンク内に貯留しておくことが可能となるので、暖房時または冷房時の電力コストを低減することが可能となる。   According to the temperature control device of the present invention, since the storage container that stores the heat medium heated or cooled by the heat source is used, the heat source is heated or cooled by the heat source in the midnight time zone using cheap midnight power. Since the heat medium can be stored in the storage tank, the power cost during heating or cooling can be reduced.

以下、本発明を図示の実施形態に基づいて説明する。
〈実施形態１〉
図１は、本発明の実施形態１に係る温調装置を備えた建物を示す概略断面図である。 Hereinafter, the present invention will be described based on illustrated embodiments.
<Embodiment 1>
FIG. 1 is a schematic cross-sectional view showing a building including a temperature control device according to Embodiment 1 of the present invention.

図１に示すように、この建物１は、地盤２に設置した複数の建物基礎３上に形成された１階の各部屋４ａ，４ｂと２階の各部屋５ａ，５ｂを備えている。１階の各部屋４ａ，４ｂの天井板６ａ，６ｂと２階の各部屋５ａ，５ｂの床板７ａ，７ｂとの間の空間には、２階用の各熱交換器８ａ，８ｂがそれぞれ設置されている。   As shown in FIG. 1, the building 1 includes first floor rooms 4 a and 4 b and second floor rooms 5 a and 5 b formed on a plurality of building foundations 3 installed on the ground 2. In the space between the ceiling plates 6a, 6b of the rooms 4a, 4b on the first floor and the floor plates 7a, 7b of the rooms 5a, 5b on the second floor, the heat exchangers 8a, 8b for the second floor are respectively installed. Has been.

１階の各部屋４ａ，４ｂの床板９ａ，９ｂの下方に位置する基礎内空間の床下面１０には、熱媒体としての水が貯留されている貯留容器１１と１階用の各熱交換器１２ａ，１２ｂとが設置されており、貯留容器１１と各熱交換器１２ａ，１２ｂは、熱搬送手段としての循環パイプ１３（放熱パネル１２ａ側の循環パイプは不図示）で接続されている。また、２階用の各熱交換器パネル８ａ，８ｂと貯留容器１１との間も、熱搬送手段としての各循環パイプ１４ａ，１４ｂを介して接続されている。   A storage container 11 in which water as a heat medium is stored and each heat exchanger for the first floor are disposed on the lower surface 10 of the foundation space located below the floor plates 9a and 9b of the rooms 4a and 4b on the first floor. 12a and 12b are installed, and the storage container 11 and each of the heat exchangers 12a and 12b are connected by a circulation pipe 13 as a heat transfer means (a circulation pipe on the side of the heat radiation panel 12a is not shown). Further, the heat exchanger panels 8a and 8b for the second floor and the storage container 11 are also connected through the circulation pipes 14a and 14b as heat transfer means.

各循環パイプ１３、１４ａ，１４ｂには、ポンプ１５ａ，１５ｂ，１５ｃがそれぞれ設置されている。なお、各循環パイプ１３、１４ａ，１４ｂは、それぞれ往路パイプと復路パイプの２本のパイプによって構成されている。   Pumps 15a, 15b, and 15c are installed in the circulation pipes 13, 14a, and 14b, respectively. Each circulation pipe 13, 14a, 14b is composed of two pipes, an outward pipe and a return pipe.

貯留容器１１内には、熱源としての周知のヒートポンプ１６に接続された冷媒循環パイプ１７の先端側が配置されている。   In the storage container 11, the front end side of the refrigerant | coolant circulation pipe 17 connected to the well-known heat pump 16 as a heat source is arrange | positioned.

ヒートポンプ１６は、暖房時には冷媒を圧縮して冷媒の温度を上昇させ、高温の冷媒が冷媒循環パイプ１７内で循環される。この際、冷媒循環パイプ１７の先端側が貯留容器１１内に位置しているので、冷媒循環パイプ１７内を循環する高温の冷媒により、貯留容器１１内に貯留されている水が加熱され、温水が生成される。   The heat pump 16 compresses the refrigerant to increase the temperature of the refrigerant during heating, and the high-temperature refrigerant is circulated in the refrigerant circulation pipe 17. At this time, since the leading end side of the refrigerant circulation pipe 17 is located in the storage container 11, the water stored in the storage container 11 is heated by the high-temperature refrigerant circulating in the refrigerant circulation pipe 17, and the hot water is Generated.

また、ヒートポンプ１６は、冷房時には冷媒を膨張させて冷媒の温度を低下させ、低温の冷媒が冷媒循環パイプ１７内で循環される。この際、冷媒循環パイプ１７の先端側が貯留容器１１内に位置しているので、冷媒循環パイプ１７内を循環する低温の冷媒により、貯留容器１１内に貯留されている水が冷却され、冷水が生成される。   Further, the heat pump 16 expands the refrigerant during cooling to lower the temperature of the refrigerant, and the low-temperature refrigerant is circulated in the refrigerant circulation pipe 17. At this time, since the front end side of the refrigerant circulation pipe 17 is located in the storage container 11, the water stored in the storage container 11 is cooled by the low-temperature refrigerant circulating in the refrigerant circulation pipe 17, and the cold water is Generated.

本実施形態に係る温調装置は、前記した各熱交換器８ａ，８ｂ、１２ａ，１２ｂ、貯留容器１１、循環パイプ１３、１４ａ，１４ｂ、ポンプ１５ａ，１５ｂ，１５ｃ、ヒートポンプ１６、および冷媒循環パイプ１７によって構成されている。   The temperature control device according to the present embodiment includes the heat exchangers 8a, 8b, 12a, 12b, the storage container 11, the circulation pipes 13, 14a, 14b, the pumps 15a, 15b, 15c, the heat pump 16, and the refrigerant circulation pipe. 17.

前記温調装置によって暖房運転を行う場合は、前記したようにヒートポンプ１６内で冷媒を圧縮して冷媒の温度を上昇させ、高温の冷媒を冷媒循環パイプ１７内で循環させることにより、貯留容器１１内に貯留されている水が加熱され、温水が生成される。そして、貯留タンク１１内の温水を、ポンプ１５ａ（熱交換器１２ａ側は不図示）の運転により循環パイプ１３（熱交換器１２ａ側は不図示）を通して１階用の各熱交換器１２ａ，１２ｂ内を循環させると共に、ポンプ１５ｂ，１５ｃの運転により各循環パイプ１４ａ，１４ｂを通して２階用の各熱交換器８ａ，８ｂ内を循環させる。このようにして、温水が各循環パイプ１３、１４ａ，１４ｂを通して、貯留タンク１１内と各熱交換器８ａ，８ｂ、１２ａ，１２ｂとの間で循環される。   When the heating operation is performed by the temperature control device, as described above, the refrigerant is compressed in the heat pump 16 to increase the temperature of the refrigerant, and the high-temperature refrigerant is circulated in the refrigerant circulation pipe 17 to thereby store the storage container 11. The water stored in the inside is heated to generate hot water. Then, the hot water in the storage tank 11 is passed through the circulation pipe 13 (the heat exchanger 12a side is not shown) by the operation of the pump 15a (the heat exchanger 12a side is not shown), and the heat exchangers 12a, 12b for the first floor. While circulating inside, the inside of each heat exchanger 8a, 8b for 2nd floors is made to circulate through each circulation pipe 14a, 14b by operation of pump 15b, 15c. In this way, hot water is circulated between the inside of the storage tank 11 and the heat exchangers 8a, 8b, 12a, 12b through the circulation pipes 13, 14a, 14b.

温水が循環される１階用の各熱交換器１２ａ，１２ｂと２階用の各熱交換器８ａ，８ｂは、周囲の空気と熱交換して１階の床板９ａ，９ｂと２階の床板７ａ，７ｂをそれぞれ暖めることにより、１、２階の各部屋４ａ，４ｂ、５ａ，５ｂを輻射熱によって暖房することができる。   The heat exchangers 12a and 12b for the first floor and the heat exchangers 8a and 8b for the second floor through which hot water is circulated exchange heat with the surrounding air, and the floor boards 9a and 9b on the first floor and the floor boards on the second floor By heating 7a and 7b, the rooms 4a, 4b, 5a and 5b on the first and second floors can be heated by radiant heat.

一方、前記温調装置によって冷房運転を行う場合は、前記したようにヒートポンプ１６内で冷媒を膨張させて冷媒の温度を低下させ、低温の冷媒を冷媒循環パイプ１７内で循環させることにより、貯留容器１１内に貯留されている水が冷却され、冷水が生成される。そして、貯留タンク１１内の冷水を、ポンプ１５ａ（熱交換器１２ａ側は不図示）の運転により循環パイプ１３（熱交換器１２ａ側は不図示）を通して１階用の各熱交換器１２ａ，１２ｂ内を循環させると共に、ポンプ１５ｂ，１５ｃの運転により各循環パイプ１４ａ，１４ｂを通して２階用の各熱交換器８ａ，８ｂ内を循環させる。   On the other hand, when the cooling operation is performed by the temperature control device, as described above, the refrigerant is expanded in the heat pump 16 to lower the temperature of the refrigerant, and the low-temperature refrigerant is circulated in the refrigerant circulation pipe 17 to store the refrigerant. Water stored in the container 11 is cooled to generate cold water. Then, the cold water in the storage tank 11 is passed through the circulation pipe 13 (the heat exchanger 12a side is not shown) by the operation of the pump 15a (the heat exchanger 12a side is not shown), and the heat exchangers 12a, 12b for the first floor. While circulating inside, the inside of each heat exchanger 8a, 8b for 2nd floors is made to circulate through each circulation pipe 14a, 14b by operation of pump 15b, 15c.

冷水が循環される１階用の各熱交換器１２ａ，１２ｂと２階用の各熱交換器８ａ，８ｂは、周囲の空気と熱交換して、１階の床板９ａ，９ｂと２階の床板７ａ，７ｂをそれぞれ冷やすことにより、１、２階の各部屋４ａ，４ｂ、５ａ，５ｂを輻射によって冷房することができる。   The first floor heat exchangers 12a and 12b and the second floor heat exchangers 8a and 8b through which cold water is circulated exchange heat with the surrounding air, and the first floor boards 9a and 9b and the second floor heat exchangers 8a and 8b. By cooling the floor boards 7a and 7b, the rooms 4a, 4b, 5a and 5b on the first and second floors can be cooled by radiation.

このように、本実施形態に係る温調装置によれば、割安な深夜電力を利用して深夜時間帯にヒートポンプ１６を運転し、貯留容器１１内の水を温水または冷水に生成して貯留しておくことが可能となるので、貯留容器１１内に貯留された温水または冷水を、暖房時または冷房時に各循環パイプ１３、１４ａ，１４ｂを通して各熱交換器８ａ，８ｂ、１２ａ，１２ｂにそれぞれ循環供給して室内の暖房または冷房を行うことにより、暖房時または冷房時の電力コストを低減することが可能となる。   As described above, according to the temperature control device according to the present embodiment, the heat pump 16 is operated at midnight time using cheap midnight power, and the water in the storage container 11 is generated and stored as hot water or cold water. Therefore, hot water or cold water stored in the storage container 11 is circulated to the heat exchangers 8a, 8b, 12a, 12b through the circulation pipes 13, 14a, 14b during heating or cooling, respectively. By supplying and heating or cooling the room, the power cost during heating or cooling can be reduced.

更に、貯留容器１１を基礎内空間の床下面１０に設置したことにより、建物敷地内に貯留容器１１の設置スペースを確保する必要がない。
〈実施形態２〉 Furthermore, since the storage container 11 is installed on the floor lower surface 10 of the foundation space, it is not necessary to secure an installation space for the storage container 11 in the building site.
<Embodiment 2>

図２は、本発明の実施形態２に係る温調装置を備えた建物を示す概略断面図である。なお、図１に示した実施形態１と同一機能を有する部材には同一符号を付し、重複する説明は省略する。   FIG. 2 is a schematic cross-sectional view showing a building including a temperature control device according to Embodiment 2 of the present invention. In addition, the same code | symbol is attached | subjected to the member which has the same function as Embodiment 1 shown in FIG. 1, and the overlapping description is abbreviate | omitted.

本実施形態では、図２に示すように、建物１ａの１階の各部屋４ａ，４ｂの天井板６ａ，６ｂと２階の各部屋５ａ，５ｂの床板７ａ，７ｂとの間の空間に、２階用の各熱交換器８ａ，８ｂと、該熱交換器８ａ，８ｂにそれぞれ循環パイプ１８を介して接続された熱媒体としての水が貯留されている２階用の貯留容器１９を設置し、この貯留容器１９内と１階用の貯留容器１１内との間を周知のヒートパイプ２１で熱的に接続した構成である。各循環パイプ１８には、ポンプ２０がそれぞれ設置されている。なお、循環パイプ１８は、それぞれ往路パイプと復路パイプの２本のパイプによって構成されている。他の構成は前記実施形態１と同様である。   In this embodiment, as shown in FIG. 2, in the space between the ceiling boards 6a, 6b of the rooms 4a, 4b on the first floor of the building 1a and the floor boards 7a, 7b of the rooms 5a, 5b on the second floor, The heat exchangers 8a and 8b for the second floor and the storage container 19 for the second floor in which water as a heat medium connected to the heat exchangers 8a and 8b via the circulation pipe 18 are stored. The interior of the storage container 19 and the storage container 11 for the first floor are thermally connected by a well-known heat pipe 21. Each circulation pipe 18 is provided with a pump 20. The circulation pipe 18 is composed of two pipes, an outward path pipe and a return path pipe. Other configurations are the same as those of the first embodiment.

ヒートパイプ２１内には作動液が封入されており、この作動液によって貯留容器１１内に貯留されている温水の熱または冷水の冷熱を貯留タンク１９へ熱搬送することができる。   The working fluid is enclosed in the heat pipe 21, and the heat of hot water stored in the storage container 11 or the cold heat of the cold water can be transferred by heat to the storage tank 19.

本実施形態に係る温調装置は、前記した各熱交換器８ａ，８ｂ、１２ａ，１２ｂ、貯留容器１１，１９、循環パイプ１３、１８、ポンプ１５、２０、ヒートポンプ１６、冷媒循環パイプ１７、およびヒートパイプ２１によって構成されている。   The temperature control device according to the present embodiment includes the heat exchangers 8a, 8b, 12a, 12b, the storage containers 11, 19, the circulation pipes 13, 18, the pumps 15, 20, the heat pump 16, the refrigerant circulation pipe 17, and The heat pipe 21 is used.

前記温調装置によって暖房運転を行う場合は、ヒートポンプ１６内で冷媒を圧縮して冷媒の温度を上昇させ、高温の冷媒を冷媒循環パイプ１７内で循環させることにより、貯留容器１１内に貯留されている水が加熱され、温水が生成される。そして、貯留タンク１１内の温水を、各ポンプ１５の運転により各循環パイプ１３を通して１階用の各熱交換器１２ａ，１２ｂ内を循環させる。   When heating operation is performed by the temperature control device, the refrigerant is compressed in the heat pump 16 to increase the temperature of the refrigerant, and the hot refrigerant is circulated in the refrigerant circulation pipe 17 to be stored in the storage container 11. The heated water is heated to produce hot water. Then, the hot water in the storage tank 11 is circulated in the heat exchangers 12 a and 12 b for the first floor through the circulation pipes 13 by operating the pumps 15.

更に、ヒートパイプ２１内の作動液により貯留容器１１内に貯留されている温水の熱を２階用の貯留容器１９へ熱搬送して、貯留容器１９内に貯留されている水を加熱して温水を生成する。そして、貯留容器１９内の温水を、各ポンプ２０の運転により各循環パイプ１８を通して２階用の各熱交換器８ａ，８ｂ内に循環させる。   Furthermore, the heat of hot water stored in the storage container 11 is thermally transferred to the storage container 19 for the second floor by the working fluid in the heat pipe 21 to heat the water stored in the storage container 19. Generate warm water. And the warm water in the storage container 19 is circulated in each heat exchanger 8a, 8b for 2nd floors through each circulation pipe 18 by each pump 20 driving | operation.

温水が循環される１階用の各熱交換器１２ａ，１２ｂと２階用の各熱交換器８ａ，８ｂは、周囲の空気と熱交換して、１階の床板９ａ，９ｂと２階の床板７ａ，７ｂをそれぞれ暖めることにより、１、２階の各部屋４ａ，４ｂ、５ａ，５ｂを輻射熱によって暖房することができる。   The heat exchangers 12a, 12b for the first floor through which hot water is circulated and the heat exchangers 8a, 8b for the second floor exchange heat with the surrounding air, and the floor plates 9a, 9b on the first floor and the second floor By heating the floor boards 7a and 7b, the rooms 4a, 4b, 5a and 5b on the first and second floors can be heated by radiant heat.

一方、前記温調装置によって冷房運転を行う場合は、ヒートポンプ１６内で冷媒を膨張させて冷媒の温度を低下させ、低温の冷媒を冷媒循環パイプ１７内で循環させることにより、貯留容器１１内に貯留されている水が冷却され、冷水が生成される。そして、貯留容器１１内の冷水を、各ポンプ１５の運転により各循環パイプ１３を通して１階用の各熱交換器１２ａ，１２ｂ内を循環させる。   On the other hand, when the cooling operation is performed by the temperature control device, the refrigerant is expanded in the heat pump 16 to lower the temperature of the refrigerant, and the low-temperature refrigerant is circulated in the refrigerant circulation pipe 17, so that The stored water is cooled and cold water is generated. Then, the cold water in the storage container 11 is circulated through the heat exchangers 12 a and 12 b for the first floor through the circulation pipes 13 by the operation of the pumps 15.

更に、ヒートパイプ２１内の作動液によって貯留容器１１内に貯留されている冷水の冷熱を２階用の貯留容器１９へ熱搬送して、貯留容器１９内に貯留されている水を冷却して冷水を生成する。そして、貯留容器１９内の冷水を、各ポンプ２０の運転により各循環パイプ１８を通して２階用の各熱交換器８ａ，８ｂ内を循環させる。   Furthermore, the cold water stored in the storage container 11 is thermally transferred to the storage container 19 for the second floor by the working fluid in the heat pipe 21 to cool the water stored in the storage container 19. Generate cold water. Then, the cold water in the storage container 19 is circulated in the heat exchangers 8 a and 8 b for the second floor through the circulation pipes 18 by the operation of the pumps 20.

冷水が循環される１階用の各熱交換器１２ａ，１２ｂと２階用の各熱交換器８ａ，８ｂは、周囲の空気と熱交換して、１階の床板９ａ，９ｂと２階の床板７ａ，７ｂをそれぞれ冷やすことにより、１、２階の各部屋４ａ，４ｂ、５ａ，５ｂを輻射によって冷房することができる。   The first floor heat exchangers 12a and 12b and the second floor heat exchangers 8a and 8b through which cold water is circulated exchange heat with the surrounding air, and the first floor boards 9a and 9b and the second floor heat exchangers 8a and 8b. By cooling the floor boards 7a and 7b, the rooms 4a, 4b, 5a and 5b on the first and second floors can be cooled by radiation.

このように、本実施形態に係る温調装置においても、前記した実施形態１と同様の効果を得ることができる。   Thus, also in the temperature control apparatus which concerns on this embodiment, the effect similar to above-described Embodiment 1 can be acquired.

なお、前記した各実施形態に係る温調装置が設置される建物としては、住宅を構成する居室等を箱型の複数の建物ユニットとして工場で作製し、これらの各建物ユニットを現場に輸送して組み立てるようにしたユニット式建物や、通常の戸建の建物、更には集合住宅などが挙げられる。   In addition, as a building where the temperature control device according to each of the above-described embodiments is installed, a room or the like constituting a house is manufactured as a plurality of box-type building units in a factory, and each of these building units is transported to the site. These include unit buildings that are assembled and assembled, ordinary detached buildings, and apartment houses.

本発明の実施形態１に係る温調装置を備えた建物を示す概略断面図。The schematic sectional drawing which shows the building provided with the temperature control apparatus which concerns on Embodiment 1 of this invention. 本発明の実施形態２に係る温調装置を備えた建物を示す概略断面図。The schematic sectional drawing which shows the building provided with the temperature control apparatus which concerns on Embodiment 2 of this invention.

符号の説明Explanation of symbols

１、１ａ 建物
３ 建物基礎
４ａ，４ｂ １階の部屋
５ａ，５ｂ ２階の部屋
６ａ，６ｂ 天井板
７ａ，７ｂ、９ａ，９ｂ 床板
８ａ，８ｂ、１２ａ，１２ｂ 熱交換器
１０ 床下面
１１、１９ 貯留容器
１６ ヒートポンプ
２１ ヒートパイプ DESCRIPTION OF SYMBOLS 1, 1a Building 3 Building foundation 4a, 4b First floor room 5a, 5b Second floor room 6a, 6b Ceiling board 7a, 7b, 9a, 9b Floor board 8a, 8b, 12a, 12b Heat exchanger 10 Floor lower surface 11, 19 Storage container 16 Heat pump 21 Heat pipe

Claims (4)

熱源により加熱または冷却の少なくとも一方が行われる熱媒体を貯留する貯留容器を、建物の最下階床下の基礎内空間に設置すると共に、建物の少なくとも上階床と下階天井との間の空間に熱交換器を設置し、
前記貯留容器内の加熱または冷却された前記熱媒体または該熱媒体の熱を、熱搬送手段により前記熱交換器へ供給させる、
ことを特徴とする温調装置。 A storage container for storing a heat medium that is heated or cooled by a heat source is installed in the foundation space below the lowest floor of the building, and at least the space between the upper floor and the lower floor ceiling of the building Installed a heat exchanger,
Heating or cooling the heat medium in the storage container or the heat of the heat medium is supplied to the heat exchanger by a heat transfer means;
A temperature control device characterized by that. 前記熱搬送手段は、前記貯留容器と前記熱交換器との間で前記熱媒体を循環搬送させる循環パイプである、
ことを特徴とする請求項１に記載の温調装置。 The heat transfer means is a circulation pipe that circulates and conveys the heat medium between the storage container and the heat exchanger.
The temperature control apparatus according to claim 1, wherein: 前記熱搬送手段は、ヒートパイプである、
ことを特徴とする請求項１に記載の温調装置。 The heat transfer means is a heat pipe.
The temperature control apparatus according to claim 1, wherein: 前記熱源は、ヒートポンプである、
ことを特徴とする請求項１に記載の温調装置。 The heat source is a heat pump.
The temperature control apparatus according to claim 1, wherein:
JP2007106814A 2007-04-16 2007-04-16 Temperature control device Pending JP2008267613A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010210193A (en) * 2009-03-12 2010-09-24 Fujikura Ltd Cooling device of data center
JP2018179409A (en) * 2017-04-13 2018-11-15 積水化学工業株式会社 Floor heating system, building, and unit building
JP2020101325A (en) * 2018-12-21 2020-07-02 株式会社竹中工務店 Air-conditioning system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07301439A (en) * 1994-05-02 1995-11-14 Matsushita Electric Works Ltd Heat exchanging and ventilating device
JPH09119723A (en) * 1995-10-25 1997-05-06 Furukawa Electric Co Ltd:The Heat accumulator and air conditioner system
JPH11223360A (en) * 1998-02-10 1999-08-17 Mitsubishi Electric Corp Air-conditioning system and its operation control method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07301439A (en) * 1994-05-02 1995-11-14 Matsushita Electric Works Ltd Heat exchanging and ventilating device
JPH09119723A (en) * 1995-10-25 1997-05-06 Furukawa Electric Co Ltd:The Heat accumulator and air conditioner system
JPH11223360A (en) * 1998-02-10 1999-08-17 Mitsubishi Electric Corp Air-conditioning system and its operation control method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010210193A (en) * 2009-03-12 2010-09-24 Fujikura Ltd Cooling device of data center
JP2018179409A (en) * 2017-04-13 2018-11-15 積水化学工業株式会社 Floor heating system, building, and unit building
JP2020101325A (en) * 2018-12-21 2020-07-02 株式会社竹中工務店 Air-conditioning system

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