JP2010210193A - Cooling device of data center - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device of a data center capable of cooling a cooled section by taking out cold storage heat. <P>SOLUTION: This cooling device 5 of the data center 1 includes a cold storage heat accumulating section 6 for accumulating soil 6a or water 6b, a water-proof heat insulating layer 7 covering the cold storage heat accumulating section 6 so that the cold storage heat accumulating section 6 is hardly affected by water immersion and temperature change of external environment, and a heat conductive member for cooling the cooled section by transporting the accumulated cold to the cooled section as a cold source by radiating the heat of the soil 6a or the water 6b accumulated in the cold storage heat accumulating section 6 to the atmospheric air by a heat pipe 8, and freezing the soil 6a or the water 6b. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a cooling apparatus that uses stored cold energy as a cooling source for cooling.

  Patent Document 1 describes an example in which cold energy in winter is stored and the stored cold energy is used as a cold heat source in summer. In the invention described in Patent Document 1, the cover soil is frozen by introducing outside air (cold heat) in the winter into a blower pipe embedded in the cover soil covering the arch-shaped metal structure. The water stored in the ice-making water tank arranged under the floor of the metal structure is frozen and stored. Patent Document 2 discloses that one end of a heat pipe is buried in the ground, the other end is extended on the ground surface, and heat in the ground is dissipated into the atmosphere to freeze the water in the ground. And an invention configured to store cold.

JP 2003-274749 A Japanese Utility Model Publication No. 6-65764

  According to the invention described in Patent Document 1 described above, the water stored in the ice-making water tank is frozen by using the cold energy in the winter and stored, and the portion to be cooled can be cooled by the latent heat of melting of the ice. Has been. However, in the configuration described in Patent Document 1, since it is configured such that cold heat in winter is naturally transferred to the water stored in the ice making water tank and freezes, there is a possibility that heat cannot be stored efficiently.

  According to the invention described in Patent Document 2, it is configured so that the surroundings of the cooled part are frozen by storing the soil in a frozen state, and the cold storage heat is transferred to the wall forming the cooled part to be cooled. Therefore, the regenerative heat may be dispersed and transmitted to the surroundings. As a result, there is a possibility that the portion to be cooled is not efficiently transmitted and the portion to be cooled cannot be sufficiently cooled.

  The present invention has been made paying attention to the above technical problem, and is a data center configured to efficiently store cold in winter and cool the cooled part efficiently using the stored cold as a cold source. An object of the present invention is to provide a cooling device.

  In order to achieve the above object, the invention of claim 1 is characterized in that the heat of soil or water is transported by a heat pipe and dissipated into the atmosphere, whereby the soil or water is frozen or frozen to store cold. In the cooling device of the data center that cools the cooled part as the cold energy and the cold heat source, the cold storage heat storage part that stores the soil or water, and the cold storage heat storage part is submerged or changes in temperature of the external environment. A waterproof heat insulating layer that covers the cold storage heat storage portion so as not to be easily affected, and the heat of the soil or water stored in the cold storage heat storage portion by the heat pipe is radiated into the atmosphere so that the soil or water is A heat conduction member that cools the cooled portion by transporting heat to the cooled portion using the cold energy stored by freezing or frosting as the cold heat source; And it is characterized in that is.

  According to a second aspect of the present invention, in the first aspect of the invention, the cooled portion includes an electronic component that generates heat, and is provided inside the cold-storage heat storage portion or the waterproof heat insulating layer. Either the second heat pipe for heat transporting the cold-stored cold heat to the cooled part or the heat exchange pipe for heat-transporting the cold-stored cold heat by circulating a heat transport medium through the cooled part A data center cooling apparatus comprising:

  The invention of claim 3 is the invention of claim 2, wherein the heat exchange pipe includes a fan coil unit that performs heat exchange between the heat exchange pipe and the cooled portion. This is a data center cooling device.

  According to a fourth aspect of the present invention, in the first aspect of the invention, the cooled portion is provided adjacent to the cold storage heat storage portion, and the thickness of the waterproof heat insulating layer is on the side in contact with the cooled portion. The data center cooling device is characterized in that the layer is formed relatively thin, and the layer on the side not in contact with the portion to be cooled is formed relatively thick.

  According to the first aspect of the present invention, cold heat in the winter season is transported by heat pipes to the soil or water stored in the cold storage heat storage section. Therefore, compared with the case where the cold in winter is naturally transferred to the soil or water, the cold is quickly transferred and stored. Moreover, since the cool storage heat storage part is covered with the waterproof heat insulation layer, it is hard to receive the influence of an external environment, and can suppress the loss of cool storage heat. Furthermore, since the cold-stored cold heat is taken out by the heat conducting member and is transported to the cooled portion for cooling, the heat transport efficiency of the cold-storage heat can be improved.

  According to the invention of claim 2, in addition to the effect similar to the effect of the invention of claim 1, since the cooled part includes the electronic component that generates heat, it is possible to cool the electronic component that generates heat by the cold storage heat. it can. Moreover, since the to-be-cooled part is provided inside the cold storage heat storage part or the waterproof heat insulating layer, it is not easily affected by changes in the external environment. Then, since the stored cold heat is taken out by the second heat pipe or the heat transport medium and transported to the cooled part, the heat transport efficiency of the cool heat can be improved. In addition, since no power is required to store cold heat, a quiet device can be configured.

  According to the invention of claim 3, in addition to the effect similar to the effect of the invention of claim 2, the fan coil unit that performs heat exchange between the heat exchange pipe for heat transporting the cold and the portion to be cooled is provided. Therefore, the part to be cooled can be cooled by the fan coil unit.

  According to invention of Claim 4, in addition to the effect similar to the effect by invention of Claim 1, a to-be-cooled part is provided adjacent to a cool storage heat storage part, and also covers a cool storage heat storage part, and a to-be-cooled part Since the thickness of the waterproof heat insulating layer on the side in contact with the surface is formed relatively thin, cold storage heat can be transmitted to the cooled part via the waterproof heat insulating layer.

It is a figure which shows typically the structural example of the cooling device of the data center which concerns on this invention. It is a figure which shows typically the other structural example of the cooling device of the data center which concerns on this invention. It is a figure which shows typically the further another structural example of the cooling device of the data center which concerns on this invention. It is a figure which shows typically the further another structural example of the cooling device of the data center which concerns on this invention. It is a figure which shows the structural example of the conventional data center typically.

  Next, the present invention will be specifically described with reference to the drawings. FIG. 5 is a diagram schematically illustrating a configuration example of a conventional data center 1. In the data center 1, a plurality of server racks 2 are installed in the room, and more electronic components such as a central processing unit (CPU) are accommodated in the server rack 2. These electronic components that generate heat, such as a CPU, are configured to cool the entire interior of the building 4 in which the server rack 2 is taken up by the cold generated by the air conditioner 3 or the chiller unit 3, and to be cooled thereby. Yes. Therefore, in such a conventional data center 1, as the data processing capacity increases, the amount of cooling heat for cooling electronic components such as the CPU increases, and the air conditioner 3 or chiller unit 3 or the like increases. Power consumption for operating the cooling device tends to increase. A similar tendency can be seen in large computer systems such as supercomputers. Therefore, if the cold energy in winter can be stored and used for cooling large computer systems such as data center 1 or supercomputers, the consumption of cooling The amount of power can be reduced.

  FIG. 1 is a diagram schematically showing a configuration example of a cooling device 5 of a data center 1 according to the present invention. FIG. 1 shows that at least the accumulated coldness is 300 ° C. This is an example in which a facility having a large computer system such as a data center 1 or a supercomputer is constructed in a cold region of day or more, and cold energy in the winter is stored and used as a cold heat source in the summer. More specifically, the building 4 of the data center 1 is constructed underground with a material such as concrete having excellent durability, and on the outer periphery thereof, soil 6a or water 6b for storing cold in winter is stored in the cold storage heat storage section 6. It is stored and arranged. Moreover, the cold storage heat storage part 6 is covered with the waterproof heat insulation layer 7 which has waterproofness or heat insulation, and is comprised so that it may be hard to receive the change of an external environment. The cold storage heat storage unit 6 is provided with one end of a heat pipe 8 for heat transport of cold in winter to the soil 6a or water 6b so as to be able to transfer heat. The other end of the heat pipe 8 extends to the ground surface, and a plurality of radiating fins 8a are provided so that heat can be transferred. That is, when the outside air temperature is lower than that of the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is transported to the ground surface by the heat pipe 8 to be radiated fin 8a. It is configured to radiate heat from the atmosphere to the atmosphere. Therefore, the soil 6a or the water 6b stored in the cold storage heat storage unit 6 by the cold in the winter is frozen or frozen and stored in cold storage. In addition, it is preferable to use the thermosiphon type heat pipe which does not operate | move on top heat conditions, such as summer, as the heat pipe 8 which carries out heat transport of the cold heat of external air to the cool storage heat storage part 6. FIG. Moreover, it is preferable that the moisture content of the soil 6a stored by the cool storage heat storage part 6 is 5 to 40%. The soil 6a having such a moisture content can obtain strength comparable to that of concrete by frosting.

  The cold storage heat storage unit 6 can transfer heat from one end of the second heat pipe 9 that transports the stored cold heat into the room 4 of the data center 1 in which the server rack 2 is disposed. Is provided. The other end of the second heat pipe 9 extends into the room of the data center 1 and has a plurality of radiating fins so that heat can be exchanged between the heat in the room of the data center 1 and the cold transported heat. 9a is provided so that heat transfer is possible. In the data center 1, an air conditioner 3 or an indoor unit 3a of the chiller unit 3 is arranged in the room so that the room temperature can be adjusted. The air conditioner 3 or the outdoor unit 3b of the chiller unit 3 is installed on the ground surface.

  Therefore, according to the cooling device 5 configured as described above, when the outside air temperature is lower than the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is obtained. Is heat transported to the ground surface by the heat pipe 8. The heat thus transported is radiated into the atmosphere from the radiation fins 8a, and the soil 6a or the water 6b stored in the cold storage heat storage section 6 can be frozen or frozen and stored cold. Then, the stored cold heat is transported by heat to the room of the data center 1 by the second heat pipe 9, that is, the heat of fusion of the frozen soil 6a or water 6b is heat transported to cool the room. It is configured. Therefore, it is possible to cool an electronic component that generates heat, such as a CPU, by cold storage heat. Moreover, since the cool storage heat storage part 6 is covered with the waterproof heat insulation layer 7, and it is hard to receive the influence of the change of external environment, the loss of cool storage heat can be suppressed. Furthermore, since cold energy in winter can be stored and used for cooling the data center 1, the power consumption required for the operation of the air conditioner 3 or chiller unit 3 that cools the data center 1 can be reduced.

  FIG. 2 is a diagram schematically showing another configuration example of the cooling device 5 of the data center 1 according to the present invention. About the structure similar to FIG. 1, the same code | symbol is attached | subjected to FIG. 2, and the description is abbreviate | omitted. In FIG. 2, the building 4 of the data center 1 has at least an accumulated coldness of 300 ° C. A cold storage area 6 is installed adjacent to the data center 1 for storing cold heat in the winter. The cold storage heat storage unit 6 is provided with a heat pipe 8 for transporting the cold heat in winter to the soil 6a or water 6b stored therein. Further, the cold storage heat storage unit 6 is covered with a waterproof heat insulating layer 7. The thickness of the waterproof heat insulating layer 7 is smaller than the thickness of the waterproof heat insulating layer 7 on the side in contact with the outside air, on the side in contact with the building 4 of the data center 1. It is configured as follows. In addition, it is preferable to use the thermosiphon type heat pipe which does not operate | move on top heat conditions, such as summer, as the heat pipe 8 which carries out heat transport of the cold heat of external air to the cool storage heat storage part 6. FIG. Moreover, it is preferable that the moisture content of the soil 6a stored by the cool storage heat storage part 6 is 5 to 40%. The soil 6a having such a moisture content can obtain strength comparable to that of concrete by frosting. Furthermore, the air conditioner 3 or the indoor unit 3a of the chiller unit 3 is arranged in the room so that the room temperature can be adjusted. The outdoor unit 3b of the air conditioner 3 or the chiller unit 3 is installed on the ground surface.

  Therefore, according to the cooling device 5 configured as described above, when the outside air temperature is lower than the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is obtained. Is heat transported by the heat pipe 8 and is radiated to the atmosphere from the radiation fins 8a, and the soil 6a or water 6b stored in the cold storage heat storage section 6 is frozen or frozen and stored cold. And the cold storage heat stored in the cold storage heat storage part 6 transfers the waterproof heat insulating layer 7 having a thin layer thickness, that is, the heat of fusion of the frozen soil 6a or water 6b transfers, The data center 1 is configured to be cooled. As a result, it is possible to cool electronic components that generate heat, such as a CPU, by cold storage heat. Moreover, since the cool storage heat storage part 6 is covered with the waterproof heat insulation layer 7, and it is hard to receive the influence of the change of external environment, the loss of cool storage heat can be suppressed. Furthermore, since the cold energy in the winter is stored and this stored heat is transmitted to the data center 1 to cool the data center 1, when the data center 1 is cooled by the air conditioner 3 or the chiller unit 3, etc. The power consumption required for the operation of the cooling device can be reduced.

  FIG. 3 is a diagram schematically showing still another configuration example of the cooling device 5 of the data center 1 according to the present invention. The same configurations as those in FIG. 2 described above are denoted by the same reference numerals in FIG. 3 and description thereof is omitted. In FIG. 3, the building 4 of the data center 1 has at least an accumulated cold temperature of 300 ° C. A cold storage area 6 is installed adjacent to the data center 1 for storing cold heat in the winter. The cold storage heat storage unit 6 is provided with a heat pipe 8 for transporting the cold heat in winter to the soil 6a or water 6b stored therein. Further, the cold storage heat storage unit 6 is covered with a waterproof heat insulating layer 7. The thickness of the waterproof heat insulating layer 7 is similar to that of the waterproof heat insulating layer 7 on the side in contact with the outside air as in FIG. 2, and the layer on the side in contact with the building 4 of the data center 1. It is comprised so that thickness may become thin. It is preferable to use a thermosiphon heat pipe that does not operate under top heat conditions such as summer, for the heat pipe 8 that transports the cold heat of the outside air to the regenerator storage unit 6. Moreover, it is preferable that the moisture content of the soil 6a stored by the cool storage heat storage part 6 is 5 to 40%. The soil 6a having such a moisture content can obtain strength comparable to that of concrete by frosting.

  The cold storage heat storage unit 6 can transfer heat from one end of the second heat pipe 9 that transports the stored cold heat into the room 4 of the data center 1 in which the server rack 2 is disposed. Is provided. The other end of the second heat pipe 9 extends to the server rack 2 arranged in the room of the data center 1. A plurality of radiating fins 9a are provided so that heat can be directly exchanged between the heat generated by the server rack 2 and the cold transported heat. Here, the other end of the second heat pipe 9 is provided so as to be able to transfer heat to a heat generating part such as a CPU housed in the server rack 2 so as to directly take heat from the heat generating part. May be. Further, the air conditioner 3 or the indoor unit 3a of the chiller unit 3 is disposed in the room, and the room temperature can be adjusted. The outdoor unit 3b of the air conditioner 3 or the chiller unit 3 is installed on the ground surface.

  Therefore, according to the cooling device 5 configured as described above, when the outside air temperature is lower than the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is obtained. Is heat transported by the heat pipe 8 and is radiated to the atmosphere from the radiation fins 8a, and the soil 6a or water 6b stored in the cold storage heat storage section 6 is frozen or frozen and stored cold. And the regenerative heat stored in the regenerative heat storage section 6 not only transfers the waterproof heat insulating layer 7 to cool the data center 1 but is also thermally transported into the data center 1 by the second heat pipe 9. That is, since the heat of fusion of the frozen soil 6a or water 6b is transported by heat and the room is cooled, the heat generating electronic components such as the CPU can be cooled by the cold storage heat. Moreover, since the cool storage heat storage part 6 is covered with the waterproof heat insulation layer 7, and it is hard to receive the influence of the change of external environment, the loss of cool storage heat can be suppressed. Furthermore, since the cold energy in the winter is stored and the stored heat is transported to the data center 1 to cool the data center 1, when the data center 1 is cooled by the air conditioner 3 or the chiller unit 3, etc. The power consumption required for the operation of the cooling equipment can be reduced.

  FIG. 4 is a diagram schematically showing still another configuration example of the cooling device 5 of the data center 1 according to the present invention. The components similar to those in FIG. 3 described above are denoted by the same reference numerals in FIG. 4 and description thereof is omitted. In FIG. 4, the building 4 of the data center 1 has at least an accumulated coldness of 300 ° C. A cold storage area 6 is installed adjacent to the data center 1 for storing cold heat in the winter. The cold storage heat storage unit 6 is provided with a heat pipe 8 for transporting the cold heat in winter to the soil 6a or water 6b stored therein. Further, the cold storage heat storage unit 6 is covered with a waterproof heat insulating layer 7. The thickness of the waterproof heat insulating layer 7 is similar to that of the waterproof heat insulating layer 7 on the side in contact with the outside air as in FIG. 2, and the layer on the side in contact with the building 4 of the data center 1. It is comprised so that thickness may become thin. It is preferable to use a thermosiphon heat pipe that does not operate under top heat conditions such as summer, for the heat pipe 8 that transports the cold heat of the outside air to the regenerator storage unit 6. Moreover, it is preferable that the moisture content of the soil 6a stored by the cool storage heat storage part 6 is 5 to 40%. The soil 6a having such a moisture content can obtain strength comparable to that of concrete by frosting.

  Further, a heat exchange pipe 10 through which the heat transport medium 10 a flows is laid between the cold storage heat storage unit 6 and the inside of the building 4 of the data center 1, and the cold storage heat is transferred to the building 4 of the data center 1. It is configured so that heat can be transported indoors. A part of the heat exchange pipe 10 is exposed inside the building 4 of the data center 1, and a fan coil unit that exchanges heat between the heat in the room of the data center 1 and the heat transport medium 10a that has been heat transported. 11 is provided. Further, the air conditioner 3 or the indoor unit 3a of the chiller unit 3 is disposed in the room, and the room temperature can be adjusted. The outdoor unit 3b of the air conditioner 3 or the chiller unit 3 is installed on the ground surface.

  Therefore, according to the cooling device 5 configured as described above, when the outside air temperature is lower than the soil 6a or water 6b stored in the cold storage heat storage unit 6 in winter, the heat of the soil 6a or water 6b is obtained. Is heat transported by the heat pipe 8 and is radiated to the atmosphere from the radiation fins 8a, and the soil 6a or water 6b stored in the cold storage heat storage section 6 is frozen or frozen and stored cold. The cold storage heat stored in the cold storage heat storage unit 6 transfers the waterproof heat insulating layer 7, that is, the heat of fusion of the frozen soil 6 a or the water 6 b transfers the heat to cool the data center 1. The cold storage heat is also transported into the data center 1 by the heat transport medium 10 a flowing through the heat exchange pipe 10. The cold storage heat transported into the room of the data center 1 is exchanged with the indoor heat by the fan coil unit 11 to cool the room, so that the heat generated by the CPU or the like is generated by the cold storage heat. The electronic parts can be cooled. Moreover, since the cool storage heat storage part 6 is covered with the waterproof heat insulation layer 7, and it is hard to receive the influence of the change of external environment, the loss of cool storage heat can be suppressed. Furthermore, since the cold energy in the winter is stored and the stored heat is transported to the data center 1 to cool the data center 1, when the data center 1 is cooled by the air conditioner 3 or the chiller unit 3, etc. The power consumption required for the operation of the cooling equipment can be reduced.

  According to the data center cooling apparatus of the present invention, a facility having a large computer system such as a data center or a supercomputer is installed at an integrated cold temperature of 300 ° C. By constructing in a cold area of day or more and storing cold in winter, a cold source of a large computer system such as a data center or a supercomputer in summer can be secured. In addition, since a cold heat source can be secured, it is possible to reduce power consumption related to cooling a large computer system such as a data center or a supercomputer.

  DESCRIPTION OF SYMBOLS 1 ... Data center, 5 ... Cooling device, 6 ... Cold storage heat storage part, 6a ... Soil, 6b ... Water, 7 ... Waterproof heat insulation layer, 8 ... Heat pipe, 9 ... Second heat pipe, 10 ... Heat exchange piping 10a ... heat transport medium, 11 ... fan coil unit.

Claims (4)

The heat of the soil or water is transported by a heat pipe and dissipated to the atmosphere, so that the soil or water is frozen or frozen and stored cold, and the cooled part is cooled as the cold storage and cold heat source. In the data center cooling system,
A cold-storage heat storage section for storing the soil or water;
A waterproof heat insulating layer that covers the cold storage heat storage portion so that the cold storage heat storage portion is not easily affected by water changes or temperature changes in the external environment;
The heat stored in the cold storage heat storage section by the heat pipe is radiated into the atmosphere, and the cold heat stored as the soil or water is frozen or frozen is used as the cold heat source. A data center cooling apparatus, comprising: a heat conduction member that transports heat to the cooled part to cool the cooled part. The cooled portion includes an electronic component that generates heat, and is provided inside the cold-storage heat storage portion or the waterproof heat insulating layer,
The heat conduction member is a second heat pipe that heat-transports the cold-stored cold heat to the cooled part, or heat exchange that heat-transports the cold-stored cold heat by circulating a heat-transporting medium through the cooled part. The data center cooling apparatus according to claim 1, further comprising any one of pipes for operation.   3. The data center cooling apparatus according to claim 2, wherein the heat exchange pipe includes a fan coil unit that performs heat exchange between the heat exchange pipe and the portion to be cooled. The cooled part is provided adjacent to the cold storage heat storage part,
The thickness of the waterproof heat insulating layer is such that the layer on the side in contact with the part to be cooled is relatively thin, and the layer on the side not in contact with the part to be cooled is relatively thick. The data center cooling device according to claim 1, wherein the data center cooling device is formed.

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