JP2012177531A - Auxiliary cooling device for data center - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an auxiliary cooling device that can cool a data center on behalf of a cooling device in the event that the cooling device cannot cool the data center, and also can suppress running cost.SOLUTION: The auxiliary cooling device for a data center includes: an ice thermal storage device 15 including a tank 17 for storing a heat medium, a heat insulating layer 18 for suppressing the tank 17 from being heated by the external heat, and a heat pipe 20 transporting heat in one direction, a part of which is immersed into the heat medium and the other part of which is exposed to the atmosphere, and which thermally transports the heat of the heat medium to dissipate the heat to the outside to solidify the heat medium to perform cooling storage when the temperature of the heat medium is higher than that of the outside and the temperature of the outside is equal to or lower than a predetermined temperature; and a hollow heat exchanger 24 disposed around the heat pipe 20 immersed into the heat medium, and through which a cooling medium is caused to flow to exchange the cold of the heat medium solidified inside the ice thermal storage device 15 with the heat of the cooling medium.

Description

  The present invention relates to an auxiliary cooling device that cools a data center in place of the cooling device when a cooling device that cools the data center fails or power supply to the cooling device is interrupted.

  The data center includes a plurality of computer servers, and each computer server includes, for example, a plurality of electronic components that are disposed on a printed wiring board and generate heat when energized. Therefore, since the temperature in the data center room is increased by the heat of the electronic components, it has been conventionally performed to cool each electronic component by lowering the room temperature using, for example, an air conditioner. In addition, it has been studied to directly or indirectly cool each electronic device with a cooling medium such as water or brine cooled by a chiller unit. Since the data processing by the electronic device is continuously performed, the chiller unit that cools the cooling medium needs to be constantly operated. Therefore, when the heat generation amount of the electronic device increases, the power consumption and running cost of the air conditioner increase accordingly. Moreover, the cooling load of the chiller unit increases. Therefore, it is desired to reduce the running cost of the device that cools the data center.

  If a cooling system such as the air conditioner or chiller unit described above fails or a power failure occurs and the operation of these cooling systems stops, the data center cannot be cooled sufficiently. An auxiliary cooling device having a chiller unit as a main component, which is used to cool the data center instead, is known. This type of auxiliary cooling device operates in the normal time to cool the cooling medium for cooling the data center by operating the chiller unit in case of a failure in the above cooling device, and in an emergency. Even so, it is configured to secure an amount of cooling medium that can sufficiently cool the data center. Specifically, the auxiliary cooling device is configured to store the cooling medium in an amount capable of cooling the data center for about 6 hours while maintaining the temperature of the cooling medium between 5 and 8 ° C. Has been. Therefore, a large-sized auxiliary cooling device is required, and there is a disadvantage that the configuration of the entire cooling system is increased in size. In addition, in order to cool the amount of cooling medium necessary for such a large auxiliary cooling device, it is necessary to always operate the large chiller unit, and its power consumption and carbon dioxide emissions are also reduced. Increase.

  In order to solve the above problem, if the cooling medium is further solidified by cooling and the cold heat is stored in the form of ice, the auxiliary cooling device can be reduced in size. In Patent Document 1, as an example of an ice production apparatus, a heat pipe, a jacket provided on the upper part of the heat pipe and circulating the refrigerant from the refrigerator, a heater provided on the lower part of the heat pipe, and a heat pipe are disclosed. A resin tube that is wound around the center of the coil and in which water is circulated, an ice heat storage tank (that is, a tank), and water discharged from the tube disposed in the tank collides with each other. An apparatus with a breaking plate is described. Then, water is circulated between the tube and the ice heat storage layer, and the refrigerator is operated using nighttime electric power so that the heat pipe functions as a heat exchanger, thereby supercooling the water circulating in the tube. The ice is produced by making the supercooled water collide with the breaking plate.

Japanese Patent Laid-Open No. 7-4800

  With the configuration described in Patent Document 1, there is a possibility that ice cannot be produced when the refrigerator breaks down or a power failure occurs. In addition, in the configuration described in Patent Document 1, the cold energy stored in the ice heat storage tank is configured to be taken out by unfrozen water in the ice heat storage tank, and therefore, when all the water in the tank is frozen. There is a risk that cold heat cannot be extracted.

  The present invention has been made paying attention to the above technical problem, and even when a cooling device cannot cool the electronic components of the data center, the data center is cooled instead of the cooling device. It is an object of the present invention to provide an auxiliary cooling device that can reduce the running cost.

  In order to achieve the above object, the invention of claim 1 is provided when the operation of a cooler that cools an electronic component that generates heat when energized is stopped or when the electronic component cannot be sufficiently cooled. In the auxiliary cooling device of the data center configured to cool the electronic component by the cold energy stored in advance, a tank for storing the heat medium, and a heat insulating layer for suppressing the tank from being heated by external heat In the case where at least a part is immersed in the heat medium and the other part is exposed to the atmosphere, the temperature of the heat medium is higher than the external temperature, and the external temperature is equal to or lower than a predetermined temperature. In addition, an ice heat storage device provided with a heat pipe having a heat transport direction in one direction that solidifies and cools the heat medium by passively transporting heat of the heat medium and dissipating it to the outside air, and the heat It is arranged around the heat pipe that is immersed in the body, and by flowing other cooling medium, the cooling heat of the heating medium solidified in the ice heat storage device and the heat of the other cooling medium And a heat exchanger for exchanging the gas.

  According to a second aspect of the present invention, in the first aspect of the invention, the heat insulating layer includes a hollow vacuum panel whose internal pressure is reduced compared to atmospheric pressure, and a heat insulating material having a porous structure, and the heat The pipe encloses a working fluid that transports heat in the form of latent heat by evaporating and condensing inside the closed vessel, and the condensed liquid phase working fluid is refluxed by gravity, so that the heat transport direction is changed. A data center comprising a thermosiphon heat pipe restricted in one direction, wherein the heat exchanger includes a coil-type heat exchanger formed by being coiled around the heat pipe. This is an auxiliary cooling device.

  The invention according to claim 3 is the data center according to claim 2, wherein the hollow tube is formed of any one of copper, copper alloy, aluminum, aluminum alloy, and synthetic resin material. This is an auxiliary cooling device.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the tank is provided in a cold region having a freezing index of 400 ° C. · day or more. It is a cooling device.

  According to the invention of claim 1, when the outside air temperature becomes lower than the temperature of the heat medium stored in the tank and the outside air temperature becomes, for example, a predetermined temperature or less, the heat pipe is stored in the tank. The heat medium is passively transported and dissipated in the air to cool and solidify the heat medium. The cold energy stored in this way is taken out by the heat exchanger, and the electronic components are cooled by the taken cold heat. As a result, even when the heat medium is all solidified, cold heat can be taken out and the electronic component can be cooled. When cool storage, cooling devices such as air conditioners and chiller units are not operated, so electricity is not consumed and greenhouse gases are not discharged. Since the cold heat is passively stored by the heat pipe, the running cost at the time of cold storage is unnecessary, the load on the environment can be suppressed, and the environment-friendly data center can be constructed. Since the heat medium is solidified and stored cold, the amount of cold heat per unit volume can be increased compared to the case where the liquid phase heat medium is cooled and stored, and the ice heat storage device functions as an auxiliary cooling device for the data center. The installation area can be reduced. Since the installation area can be reduced, it is not necessary to prepare a site for installing an ice heat storage device or to expand the site. Therefore, even if an auxiliary cooling device having a chiller unit as a main component has already been provided, the above ice heat storage device can be installed and can be replaced with an existing device.

  According to the invention of claim 2, in addition to the effect similar to the effect of the invention of claim 1, the thermosiphon heat pipe has a one-way heat flow, so the temperature of the heat medium stored in the tank is When the outside air temperature is higher than that, the heat transport can be passively stopped, the backflow of heat can be prevented or suppressed, and the loss of cold can be prevented or suppressed. Since the tank is thermally insulated by members generally used in the past, it is possible to reduce the cost for thermal insulation and to prevent or suppress the loss of cold. In the coil type heat exchanger, heat is exchanged between the cooling medium and the solidified heat medium to cool the cooling medium so that the cold heat is taken out. Cold heat can be taken out and electronic components can be cooled.

  According to invention of Claim 3, in addition to the effect similar to the effect by invention of Claim 2, the hollow tube which comprises each heat exchanger is copper, copper alloy, aluminum, aluminum alloy which has heat conductivity. Therefore, it is possible to efficiently extract cold heat compared to the case where the hollow tube is formed of a synthetic resin material. Further, when the hollow tube is formed of a synthetic resin material, the material cost of the heat exchanger can be reduced as compared with the case where the hollow tube is formed of the metal material.

  According to the invention of claim 4, in addition to the effect similar to the effect of any one of the inventions of claims 1 to 3, the tank is provided in a cold region having a freezing index of 400 ° C. · day or more. The cooling efficiency of the heat medium by the heat pipe can be improved, and the heat medium can be solidified and stored.

It is a figure which shows typically an example of the auxiliary | assistant cooling device of the data center which concerns on this invention. It is a figure which shows typically the installation example of the auxiliary | assistant cooling device of the data center shown in FIG. It is an external view of the ice thermal storage apparatus shown in FIG. It is sectional drawing of the ice thermal storage apparatus shown in FIG. It is the figure which expanded a part of sectional drawing shown in FIG. It is a figure which shows typically an example for taking out cold heat from an ice thermal storage apparatus. It is a figure which shows typically the state which the water around a coil type heat exchanger frozen.

  Next, the present invention will be specifically described. FIG. 1 schematically shows an example of an auxiliary cooling device for a data center according to the present invention. The data center 1 is configured by providing a rack 3 for accommodating a plurality of computer servers inside a predetermined housing 2. As the housing 2, for example, an appropriate one such as a construction building or a shipping container can be used. Each computer server accommodated in the server rack 3 includes a plurality of substrates, and a large number of electronic components 4 that generate heat are disposed. As an example, the electronic component 4 includes a CPU (Central Processing Unit), a storage device such as a memory and a storage, a power supply unit, and the like. Each electronic component 4 is in contact with a cold plate 5 so that the heat generated when the electronic component 4 processes data is transferred to the cold plate 5 so that the electronic component 4 is directly cooled. It is configured.

  Specifically, the cold plate 5 is formed in a hollow plate shape, and a cooling medium flows through the hollow interior. The cold plate 5 is preferably made of a material having thermal conductivity because it is necessary to transfer the heat from the outside to the cooling medium flowing inside. As an example, the cold plate 5 is preferably formed of copper or a copper alloy. The cold plate 5 is connected to the chiller unit 6 via a supply pipeline, and a supply switching valve 7 is provided between the cold plate 5 and the chiller unit 6 on the supply pipeline. Therefore, the cooling medium cooled by the chiller unit 6 is supplied to the cold plate 5 via the supply switching valve 7. In addition, the cold plate 5 is also connected to the chiller unit 6 via a return pipe, and a reflux switching valve 8 is provided between the cold plate 5 and the chiller unit 6 on the return pipe. . Therefore, the heat transferred from the electronic component 4 to the cold plate 5 can be returned to the chiller unit 6 by the cooling medium. For example, water can be used as the cooling medium. Further, in order to prevent the pipe line and the cold plate 5 from being oxidized, a predetermined amount of an arbitrary rust inhibitor may be added to the cooling medium. Further, in order to lower the freezing point of the cooling medium, brine (sometimes referred to as antifreeze) or R-134a or the like containing ethylene glycol or calcium chloride as a main component and adjusted so that the freezing point is 0 ° C. or lower. Alternative chlorofluorocarbon may be used.

  The chiller unit 6 is radiated by a compressor 9 that pressurizes and compresses a refrigerant such as alternative chlorofluorocarbon, and a condenser 10 that condenses the refrigerant by dissipating heat of the compressed refrigerant to the outside. The heat pump includes an expansion valve 11 that expands a refrigerant that has been condensed at a low temperature and an evaporator 12 that absorbs ambient heat from the refrigerant that has become a low temperature due to expansion.

  The condenser 10 of the chiller unit 6 is connected to a cooling tower 13 provided outside by a pipe line forming a circulation circuit, and the cooling water is circulated in the circulation circuit. Therefore, in the condenser 10, the heat of the refrigerant circulating inside the chiller unit 6, that is, the heat transmitted from the electronic component 4 is transmitted to the cooling water, and thus the heat transmitted to the cooling water is the cooling tower 13. The heat is radiated to the atmosphere by the fan 14 or the like.

  The supply line from the ice heat storage device 15 also extends to the cold plate 5, and the supply line from the ice heat storage device 15 joins the supply line extending from the chiller unit 6 in the supply switching valve 7. . On the other hand, the return pipe extending from the cold plate 5 is branched at the return switching valve 8 so as to be connected to the ice heat storage device 15. Therefore, by switching these switching valves 7 and 8, circulation pipes are formed between the cold plate 5 and the chiller unit 6 and between the cold plate 5 and the ice heat storage device 15, respectively.

  As the switching valves 7 and 8, an arbitrary switching valve such as an electromagnetically controlled three-way valve can be used. Although not shown in detail, for example, a detection means for detecting a failure such as the temperature of the room or the electronic component 4 in which the data center 1 is provided, the operation stop of the chiller unit 6 or a cooling failure, and a signal from the detection means Control means for controlling the switching valves 7 and 8 is provided. Therefore, the above-described circulation circuit is switched by operating the switching valves 7 and 8 by the control means based on the detection signal from the detection means regarding the room temperature in the data center 1 and the operating status of the chiller unit 6.

  A pump 16 is interposed between the supply switching valve 7 and the cold plate 5 in order to circulate the cooling medium in each of the above-described circulation circuits, that is, the cold plate 5, the chiller unit 6 and the ice heat storage device 15. It is disguised. The pump 16 may be one that is conventionally used.

  Therefore, in the example shown in FIG. 1, the cooling medium is circulated between the cold plate 5 and the chiller unit 6 by operating the switching valves 7 and 8 to switch the flow path by the above-described control means, or A cooling medium is circulated between the cold plate 5 and the ice heat storage device 15. Therefore, the cooling medium whose temperature has risen due to the heat of the electronic components being taken away from the cold plate is returned to the chiller unit 6 or the ice heat storage device 15 and cooled, and the cooling medium thus cooled is as described above. In addition, the cold plate 5 is selectively supplied according to the room temperature in the data center 1 and the operating condition of the chiller unit 6.

  FIG. 2 schematically shows an installation example of the auxiliary cooling device for the data center shown in FIG. The ice heat storage device 15 is configured to store cold heat by freezing the heat medium stored therein using outside air. Therefore, in order to efficiently freeze the heat medium in the ice heat storage device 15, the data center 1 is preferably provided in a cold region having a freezing index of 400 ° C. · day or more. In addition, as shown in FIG. 2, it is desirable that the ice heat storage device 15 be embedded in soil having a small temperature change compared to the ground surface in order to improve the heat insulation efficiency.

  3 is an enlarged view schematically showing the appearance of the ice heat storage device 15 shown in FIGS. 1 and 2, and FIG. 4 is a cross-sectional view of the ice heat storage device 15 shown in FIG. Specifically, the ice heat storage device 15 includes a tank 17 that stores a heat medium, a heat insulating layer 18 that insulates the tank 17 from external heat, and water from outside enters the inside of the tank 17. The waterproof layer 19 which prevents this and a plurality of thermosiphon heat pipes 20 for radiating the heat of the heat medium stored in the tank 17 to the outside air are provided. The shape of the tank 17 is not limited to a specific shape. When the outer shape of the tank 17 is formed in a cylindrical shape, the surface area is smaller than that in the case where the tank 17 is formed in a rectangular parallelepiped so as to have the same volume. And thereby improve heat insulation. Therefore, in the embodiment of the present application, the tank 17 is formed in a cylindrical shape as shown in FIG.

  FIG. 5 is an enlarged view of a part of the sectional view of the ice heat storage device 15 shown in FIG. As shown in FIG. 5, the heat insulating layer 18 includes an inner heat insulating layer 21 formed by a hollow plate and an outer heat insulating layer 22 formed by a porous structure. As the inner heat insulating layer 21, for example, a hollow vacuum panel that is generally commercially available and whose internal pressure is reduced compared to the atmospheric pressure can be used, and the outer heat insulating layer 22 is, for example, It can be formed of foamed polyurethane, foamed polystyrene or glass wool.

  As described above, the waterproof layer 19 is provided on the outer side of the outer heat insulating layer 22 in order to prevent external water from entering the tank 17, and the waterproof layer 19 is formed of, for example, a synthetic resin material. Waterproof tarpaulin can be used. The heat pipe 20 is specifically a thermosiphon having a thermal diode characteristic, and therefore, the heat transport direction of the heat pipe 20 is limited to one direction. The heat pipe 20 is hermetically sealed with a working fluid such as ammonia having a boiling point of 10 ° C. or less or an alternative chlorofluorocarbon such as R-134a, and the amount is about 20 of the internal volume of the heat pipe 20. It is preferable to make it -30 vol%. One end of the heat pipe 20 is immersed in a heat medium and functions as an evaporation unit 20a in which the working fluid evaporates. The other end of the heat pipe 20 is exposed to the ground surface outside the tank 17 so as to be in contact with the outside air, and functions as a condensing unit 20b in which the working fluid is condensed. In addition, in order to efficiently dissipate the heat of the heat medium into the air, the condensing unit 20b is provided with a plurality of fins 23.

  FIG. 6 schematically shows an example of a heat exchanger for taking out the cold energy from the ice heat storage device. As shown in FIG. 6, a coil-type heat exchanger 24 formed of, for example, a hollow tube is wound around the evaporation portion 20a of the thermosiphon heat pipe 20, and the inside thereof is used for cooling the liquid phase. The media is in circulation. Specifically, the heat exchanger 24 is formed of heat-conductive copper, copper alloy, aluminum, aluminum alloy or the like, and includes a heat medium stored in the tank 17 and a liquid-phase cooling medium. Heat exchange between the two. The length of the heat exchanger 24 is the amount of cooling heat necessary for cooling the data center 1 to a desired temperature, in other words, the amount of heat exchanged between the cooling medium and the heat medium via the heat exchanger 24. The length can be adjusted accordingly, and the length can be obtained in advance by experiments or simulations. Moreover, in order to suppress material cost, the heat exchanger 24 can also be formed with the tube made from a synthetic resin. In that case, since the heat conductivity of the tube made of synthetic resin is lower than the heat conductivity of the above-mentioned metal material, when using the tube made of synthetic resin, the length of the heat exchanger 24 is made of the metal material. What is necessary is just to make it longer than when forming.

  The cooling medium heated by taking the heat of the electronic component 4 by the cold plate 5 is returned to the ice heat storage device 15 through the return pipe, and from the upper side to the lower side of the heat exchanger 24 in FIG. Flow inside. As a result, the heat of the cooling medium flowing in the heat exchanger 24 and the cold heat of the heat medium in the tank 17 of the ice heat storage device 15 are exchanged. Thus, the cooling medium cooled in the ice heat storage device 15 is supplied toward the cold plate 5 through the supply pipe line.

  Next, the operation of the ice heat storage device 15 configured as described above will be described. When the temperature of the heat medium stored in the tank 17 is higher than the outside air temperature and the outside air temperature becomes a predetermined temperature or less, the heat of the heat medium stored in the tank 17 causes the thermosiphon heat pipe 20 to The working fluid in the evaporator 20a is heated and evaporated, and the heat of the heat medium is transported to the condenser 20b in the form of latent heat by the gas-phase working fluid. The heat of the heat medium transported to the condensing unit 20b is dissipated into the atmosphere through the fins 23, whereby the gas-phase working fluid is condensed and returned to the evaporating unit 20a by gravity. As a result, the heat medium in the tank 17 is cooled as shown in FIG. When the outside air temperature falls below 0 ° C., the heat medium in the tank 17 is further cooled and frozen. The heat medium is first frozen from the vicinity of the surface of the evaporation unit 20a, the freezing range is gradually expanded, the heat medium around the heat exchanger 24 is also gradually frozen, and finally all the heat medium stored in the tank 17 is stored. to freeze. Thus, the cold heat of the outside air is stored in the tank 17 in the form of ice. On the contrary, when the temperature of the heat medium stored in the tank 17 is lower than the outside air temperature and the outside air temperature becomes equal to or higher than the predetermined temperature, the heat transport by the thermosiphon heat pipe 20 is stopped.

  When the temperature of the data center 1 becomes equal to or higher than the predetermined temperature by the above control means, or when the malfunction of the chiller unit 6 is determined, the switching valves 7 and 8 are operated by the control means to cool the data center 1. The cold heat source is switched from the chiller unit 6 to the ice heat storage device 15. As a result, the cooling medium heated by the heat of the electronic component 4 in the cold plate 5 returns to the coil heat exchanger 24 of the ice heat storage device 15 through the return pipe. Therefore, the heat of the high-temperature cooling medium flowing through the coil-type heat exchanger 24 is transmitted to the ice stored in the tank 17 and melted, and the cold heat of the ice is transmitted to the cooling medium to reduce its temperature. . The cooling medium thus cooled is supplied to the cold plate 5 via the supply pipe line. As a result, the electronic component 4 is cooled by the cooling heat of the cooling medium supplied to the cold plate 5.

  Thus, in the above-described configuration, the ice heat storage device 15 is configured to store the cold heat in the cold season using the thermosiphon heat pipe 20, so that power is consumed at the time of cold storage, carbon dioxide, etc. Does not emit any greenhouse gases. Therefore, the running cost for the ice heat storage device 15 that is an auxiliary cooling device is not required, and in addition, the load on the environment can be suppressed. The cold energy stored by solidifying the heat medium is transferred to the liquid-phase cooling medium via the coil heat exchanger 24 and taken out. Therefore, even if the heat medium is completely solidified, It can be taken out. Further, since the ice heat storage device 15 is provided in the ground and the tank 17 is covered with the heat insulating layer 18, the ice heat storage device 15 is hardly affected by the temperature change of the ground surface, and the stored cold heat is the temperature of the ground surface. It can be prevented or suppressed from being lost due to change. Since the ice heat storage device 15 is configured to condense the heat medium to store the cold, the amount of cold heat per unit volume of the heat medium is increased as compared with the case where the liquid phase heat medium is cooled and stored. it can. As a result, the size and installation area of the ice heat storage device 15 can be suppressed.

  As described above, the data center cooling system of the present application cools the data center in an emergency by the ice heat storage device 15 configured to store the cold heat by solidifying the heat medium stored therein only by the external cold heat. Therefore, a design change is easy compared with a conventional data center cooling system that cools a data center in an emergency by an existing chiller unit configured to cool a heat medium such as water by electric power. Specifically, for example, when it is necessary to increase the amount of heat required for cooling the data center 1 due to an increase in the data processing amount, it is easier than the above-described existing apparatus. The size of the ice heat storage device 15 can be changed, or another ice heat storage device 15 can be added to increase the output of the cooling system. It is also possible to replace the existing chiller unit used as an auxiliary cooling device in the existing data center cooling system with the ice heat storage device 15 of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Data center, 4 ... Electronic component, 6 ... Chiller unit, 15 ... Ice thermal storage device, 17 ... Tank, 18 ... Thermal insulation layer, 20 ... Thermosiphon type heat pipe, 24 ... Coil type heat exchanger.

Claims (4)

When the operation of a cooler that cools an electronic component that generates heat by being energized stops or the electronic component cannot be sufficiently cooled, the electronic component is cooled by cold energy stored in advance. Data center auxiliary cooling device
A tank for storing a heat medium;
A heat insulating layer that suppresses the tank from being heated by external heat; and
When at least a part is immersed in the heat medium and the other part is exposed to the atmosphere, the temperature of the heat medium is higher than the external temperature, and the external temperature is equal to or lower than a predetermined temperature. An ice heat storage device including a heat pipe having a unidirectional heat transport direction for solidifying and storing the heat medium by passively heat transporting the heat of the heat medium and dissipating it to the outside air;
It is arranged around the heat pipe immersed in the heat medium, and exchanges the cold heat of the heat medium solidified in the ice heat storage device and the heat of the cooling medium by flowing the cooling medium. A data center auxiliary cooling device comprising a hollow heat exchanger. The heat insulating layer includes a hollow vacuum panel whose internal pressure is reduced compared to atmospheric pressure, and a heat insulating material having a porous structure,
The heat pipe encloses a working fluid that transports heat in the form of latent heat by evaporating and condensing inside the sealed container, and the condensed liquid-phase working fluid is refluxed by gravity, thereby transferring heat. Including a thermosiphon heat pipe whose direction is restricted to one direction,
2. The auxiliary cooling apparatus for a data center according to claim 1, wherein the heat exchanger includes a coil-type heat exchanger formed by being wound around the heat pipe in a coil shape. The auxiliary cooling device for a data center according to claim 2, wherein the coil-type heat exchanger includes one of copper, copper alloy, aluminum, aluminum alloy, and synthetic resin material. The auxiliary cooling device for a data center according to any one of claims 1 to 4, wherein the tank is provided in a cold region having a freezing index of 400 ° C · day or more.

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