JPH0230837Y2 - - Google Patents

Info

Publication number
JPH0230837Y2
JPH0230837Y2 JP1984018238U JP1823884U JPH0230837Y2 JP H0230837 Y2 JPH0230837 Y2 JP H0230837Y2 JP 1984018238 U JP1984018238 U JP 1984018238U JP 1823884 U JP1823884 U JP 1823884U JP H0230837 Y2 JPH0230837 Y2 JP H0230837Y2
Authority
JP
Japan
Prior art keywords
substrate
stirring
protrusion
solder member
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984018238U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60130640U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1823884U priority Critical patent/JPS60130640U/ja
Publication of JPS60130640U publication Critical patent/JPS60130640U/ja
Application granted granted Critical
Publication of JPH0230837Y2 publication Critical patent/JPH0230837Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1823884U 1984-02-09 1984-02-09 半導体装置の製造装置 Granted JPS60130640U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1823884U JPS60130640U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1823884U JPS60130640U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPS60130640U JPS60130640U (ja) 1985-09-02
JPH0230837Y2 true JPH0230837Y2 (cs) 1990-08-20

Family

ID=30506682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1823884U Granted JPS60130640U (ja) 1984-02-09 1984-02-09 半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPS60130640U (cs)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127644U (ja) * 1982-02-23 1983-08-30 日本電気ホームエレクトロニクス株式会社 半導体製造装置

Also Published As

Publication number Publication date
JPS60130640U (ja) 1985-09-02

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