JPH02307080A - Liquid-cooled bt device - Google Patents
Liquid-cooled bt deviceInfo
- Publication number
- JPH02307080A JPH02307080A JP1129153A JP12915389A JPH02307080A JP H02307080 A JPH02307080 A JP H02307080A JP 1129153 A JP1129153 A JP 1129153A JP 12915389 A JP12915389 A JP 12915389A JP H02307080 A JPH02307080 A JP H02307080A
- Authority
- JP
- Japan
- Prior art keywords
- cooling liquid
- printed board
- liquid
- filter
- pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000110 cooling liquid Substances 0.000 claims abstract description 23
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000011109 contamination Methods 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣの信頼性評価用の液冷ＢＴ装置に関し、特
に循環中の冷却用液体のフィルター機能を備えた液冷Ｂ
Ｔ装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a liquid-cooled BT device for evaluating the reliability of ICs, and particularly to a liquid-cooled BT device with a filter function for cooling liquid that is being circulated.
Regarding the T device.
従来、この種の液冷ＢＴ装置は、冷却用液体として炭素
及びフッ素を主成分とする高分子化合物（例えば、３Ｍ
社製、商品名フロリナート）を使用し、約５０〜１５０
°Ｃ内の任意温度に調節されたこの冷却用液体中に、Ｂ
Ｔプリント板に実装したＩＣ等を浸漬してバーンインを
行うようになっている。しかし、冷却用液体の汚染を除
去し、清浄度を回復させることを稼働中に行う手段は設
けられていなかった。Conventionally, this type of liquid-cooled BT device uses a polymer compound mainly composed of carbon and fluorine (for example, 3M
About 50 to 150
In this cooling liquid adjusted to any temperature within °C, B
Burn-in is performed by immersing ICs and the like mounted on a T-printed board. However, no means were provided for decontaminating the cooling liquid and restoring its cleanliness during operation.
上述した従来の液冷ＢＴ装置は、汚れの付着したＩＣや
ＢＴプリント板を投入するなどして、冷却用液体が汚染
された場合、投入中のＩＣへの２次汚染が避けられず、
一度汚染されてしまった冷却用液体の清浄度を回復させ
るには、液冷ＢＴ装置から冷却用液体を回収し、再生作
業を行うしか方法がないという欠点がある。In the conventional liquid-cooled BT device described above, if the cooling liquid becomes contaminated by, for example, inserting a dirty IC or BT printed board, secondary contamination of the IC being introduced cannot be avoided.
There is a drawback in that the only way to restore the cleanliness of the cooling liquid once it has been contaminated is to recover the cooling liquid from the liquid-cooled BT device and perform a regeneration operation.
本発明は、循環する冷却用液体にＩＣを浸漬しバーンイ
ンを行う液冷ＢＴ装置において、前記冷却用液体の循環
経路中に冷却用液体を清浄化するフィルターを取り付け
た液冷ＢＴ装置である。The present invention is a liquid-cooled BT device that performs burn-in by immersing an IC in a circulating cooling liquid, in which a filter for cleaning the cooling liquid is installed in a circulation path of the cooling liquid.
第１図は本発明の第１の実施例の縦断面図である。 FIG. 1 is a longitudinal sectional view of a first embodiment of the invention.
ＩＣが実装されたＢＴプリント板１はエレベータ−２に
取り付けられ、装置本体の頂面に設けられたウィンチ３
により上下に移動できるようになっており、上にある状
態で扉４を開けてＢＴプリント板１の出し入れ作業を行
ない、下にある状態で８７層５に満たされた冷却用液体
中に浸漬し、ＢＴ電源６からケーブル７を介してＢＴプ
リント板１に実装されたＩＣに電源を供給しＢＴを行う
。The BT printed board 1 on which the IC is mounted is attached to the elevator 2, and the winch 3 provided on the top surface of the device body
The BT printed board 1 can be moved up and down when it is in the upper position by opening the door 4 to take in and take out the BT printed board 1, and when it is in the lower position it is immersed in the cooling liquid filled in the 87 layer 5. , BT is performed by supplying power from the BT power supply 6 to the IC mounted on the BT printed board 1 via the cable 7.
冷却用液体はポンプ１３よりフィルター１４に流れ込み
、汚染を除去されたのち吹き出し口８から出て、ＢＴ槽
５を満たした後オーバーフロ一槽９へ流れ込み、ドレイ
ン口１０を通り液温調節用のヒーター１１および冷却器
１２を通り、再びポンプ１３へ入る０本実施例で使用す
るフィルターは、通常、各種液体に使用されているフィ
ルターならば特に差し使えなく使用できる。第２図は本
発明の第２の実施例の縦断面図である。The cooling liquid flows into the filter 14 from the pump 13, and after removing contamination, exits from the outlet 8, fills the BT tank 5, flows into the overflow tank 9, passes through the drain port 10, and is used for temperature adjustment. It passes through the heater 11 and cooler 12 and enters the pump 13 again. The filter used in this embodiment can be any filter that is normally used for various liquids. FIG. 2 is a longitudinal sectional view of a second embodiment of the invention.
ＩＣが実装されたＢＴプリント板１は装置本体の扉４に
取り付けられ、扉４を横方向に開けな状態でＢＴプリン
ト板１の出し入れ作業を行ない、扉４を閉めた状態でＢ
Ｔ電源５からケーブル７を介してＢＴプリント板１に実
装されたＩＣに電源供給しＢＴを行う。The BT printed board 1 on which the IC is mounted is attached to the door 4 of the main body of the device, and the BT printed board 1 is inserted and removed without opening the door 4 laterally, and when the door 4 is closed, the BT printed board 1 is attached to the door 4 of the device body.
BT is performed by supplying power from the T power supply 5 to the IC mounted on the BT printed board 1 via the cable 7.
冷却用液体はポンプ１３よりフィルター１４に流れ込み
、汚染を除去されたのちノズル１５から噴射され、ＩＣ
を冷却したのちドレイン口１０を通り、液温調節用のヒ
ーター１１および冷却器１２を通り、再びポンプ１３へ
入る。この実施例では、噴射式のため、冷却用液体の流
量が少なくてよく、またＩＣに付着した汚れをＢＴ中に
取り去る効果が大きいという利点がある。The cooling liquid flows into the filter 14 from the pump 13, and after removing contamination, it is injected from the nozzle 15 to the IC.
After cooling, the liquid passes through the drain port 10, passes through the heater 11 and cooler 12 for adjusting the liquid temperature, and enters the pump 13 again. In this embodiment, since it is an injection type, the flow rate of the cooling liquid may be small, and there are advantages in that it is highly effective in removing dirt adhering to the IC during BT.
以上説明したように本発明は、ＩＣと接触する冷却用液
体を循環させ、なおかつ循環経路中にフィルターを取り
付けることにより、装置稼働中の冷却用液体を常に清浄
な状態に保つことができ、冷却用液体の汚れによるＩＣ
への２次汚染を防止し、なおかつ投入前のＩＣに付着し
ていた汚れさえも、ＢＴを行うことにより除去すること
が可能であるという効果がある。As explained above, the present invention circulates the cooling liquid that comes into contact with the IC, and by installing a filter in the circulation path, the cooling liquid can be kept clean at all times during the operation of the device. IC due to contamination of liquid
BT has the effect of preventing secondary contamination of the IC, and even removing dirt that had adhered to the IC before it was inserted.
図面の簡単な説明
第１図は本発明の第１の実施例の縦断面図、第２図は本
発明の第２の実施例の縦断面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal sectional view of a first embodiment of the invention, and FIG. 2 is a longitudinal sectional view of a second embodiment of the invention.
１・・・ＢＴプリント板、２・・・エレベータ−１３・
・・ウィンチ、４・・・扉、５・・・ＢＴ槽、６・・・
ＢＴ電源、７・・・ケーブル、８・・・吹き出し口、９
・・・オーバーフロ一槽、１０・・・ドレイン口、１１
・・・ヒーター、１２・・・冷却器、１３・・・ポンプ
、１４・・・フィルター、１５・・・ノズル。1...BT printed board, 2...Elevator-13.
...Winch, 4...Door, 5...BT tank, 6...
BT power supply, 7... cable, 8... air outlet, 9
...Overflow tank, 10...Drain port, 11
... Heater, 12 ... Cooler, 13 ... Pump, 14 ... Filter, 15 ... Nozzle.
Claims (1)
冷ＢＴ装置において、前記冷却用液体の循環経路中に冷
却用液体を清浄化するフィルターを取り付けたことを特
徴とする液冷ＢＴ装置。A liquid-cooled BT device in which an IC is immersed in a circulating cooling liquid to perform burn-in, characterized in that a filter for cleaning the cooling liquid is installed in a circulation path of the cooling liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129153A JPH02307080A (en) | 1989-05-22 | 1989-05-22 | Liquid-cooled bt device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1129153A JPH02307080A (en) | 1989-05-22 | 1989-05-22 | Liquid-cooled bt device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02307080A true JPH02307080A (en) | 1990-12-20 |
Family
ID=15002455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1129153A Pending JPH02307080A (en) | 1989-05-22 | 1989-05-22 | Liquid-cooled bt device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02307080A (en) |
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8208115B2 (en) * | 2007-11-16 | 2012-06-26 | Manufacturing Resources International, Inc. | Fluid cooled display |
| US9797588B2 (en) | 2008-03-03 | 2017-10-24 | Manufacturing Resources International, Inc. | Expanded heat sink for electronic displays |
| US9801305B2 (en) | 2008-03-03 | 2017-10-24 | Manufacturing Resources International, Inc. | Heat exchanger for an electronic display |
| US9835893B2 (en) | 2008-03-03 | 2017-12-05 | Manufacturing Resources International, Inc. | Heat exchanger for back to back electronics displays |
| US9894800B2 (en) | 2008-03-03 | 2018-02-13 | Manufacturing Resources International, Inc. | Constricted convection cooling system for an electronic display |
| US10080316B2 (en) | 2009-11-13 | 2018-09-18 | Manufacturing Resources International, Inc. | Electronic display assembly having thermal cooling plate and optional convective air cooling loop |
| US10088702B2 (en) | 2013-07-08 | 2018-10-02 | Manufacturing Resources International, Inc. | Figure eight closed loop cooling system for electronic display |
| US10194564B2 (en) | 2014-04-30 | 2019-01-29 | Manufacturing Resources International, Inc. | Back to back electronic display assembly |
| US10212845B2 (en) | 2014-03-11 | 2019-02-19 | Manufacturing Resources International, Inc. | Hybrid rear cover and mounting bracket for electronic display |
| US10278311B2 (en) | 2015-02-17 | 2019-04-30 | Manufacturing Resources International, Inc. | Perimeter ventilation system |
| US10314212B2 (en) | 2008-12-18 | 2019-06-04 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
| US10398066B2 (en) | 2017-04-27 | 2019-08-27 | Manufacturing Resources International, Inc. | System and method for preventing display bowing |
| US10420257B2 (en) | 2008-03-26 | 2019-09-17 | Manufacturing Resources International, Inc. | System and method for maintaining a consistent temperature gradient across an electronic display |
| US10485113B2 (en) | 2017-04-27 | 2019-11-19 | Manufacturing Resources International, Inc. | Field serviceable and replaceable display |
| US10524397B2 (en) | 2013-03-15 | 2019-12-31 | Manufacturing Resources International, Inc. | Heat exchanger assembly for an electronic display |
| US10524384B2 (en) | 2013-03-15 | 2019-12-31 | Manufacturing Resources International, Inc. | Cooling assembly for an electronic display |
| US10559965B2 (en) | 2017-09-21 | 2020-02-11 | Manufacturing Resources International, Inc. | Display assembly having multiple charging ports |
| US10660245B2 (en) | 2012-10-16 | 2020-05-19 | Manufacturing Resources International, Inc. | Back pan cooling assembly for electronic display |
| US10795413B1 (en) | 2019-04-03 | 2020-10-06 | Manufacturing Resources International, Inc. | Electronic display assembly with a channel for ambient air in an access panel |
| US10820445B2 (en) | 2016-03-04 | 2020-10-27 | Manufacturing Resources International, Inc. | Cooling system for double sided display assembly |
| US10827656B2 (en) | 2008-12-18 | 2020-11-03 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
| US11019735B2 (en) | 2018-07-30 | 2021-05-25 | Manufacturing Resources International, Inc. | Housing assembly for an integrated display unit |
| US11096317B2 (en) | 2019-02-26 | 2021-08-17 | Manufacturing Resources International, Inc. | Display assembly with loopback cooling |
| US11470749B2 (en) | 2020-10-23 | 2022-10-11 | Manufacturing Resources International, Inc. | Forced air cooling for display assemblies using centrifugal fans |
| US11477923B2 (en) | 2020-10-02 | 2022-10-18 | Manufacturing Resources International, Inc. | Field customizable airflow system for a communications box |
| US11744054B2 (en) | 2021-08-23 | 2023-08-29 | Manufacturing Resources International, Inc. | Fan unit for providing improved airflow within display assemblies |
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| US11778757B2 (en) | 2020-10-23 | 2023-10-03 | Manufacturing Resources International, Inc. | Display assemblies incorporating electric vehicle charging equipment |
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| US11968813B2 (en) | 2021-11-23 | 2024-04-23 | Manufacturing Resources International, Inc. | Display assembly with divided interior space |
| US11966263B2 (en) | 2021-07-28 | 2024-04-23 | Manufacturing Resources International, Inc. | Display assemblies for providing compressive forces at electronic display layers |
| US12010813B2 (en) | 2022-07-22 | 2024-06-11 | Manufacturing Resources International, Inc. | Self-contained electronic display assembly, mounting structure and methods for the same |
| US12035486B1 (en) | 2022-07-25 | 2024-07-09 | Manufacturing Resources International, Inc. | Electronic display assembly with fabric panel communications box |
| US12072561B2 (en) | 2022-07-22 | 2024-08-27 | Manufacturing Resources International, Inc. | Self-contained electronic display assembly, mounting structure and methods for the same |
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|---|---|---|---|---|
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| JPS62277734A (en) * | 1986-05-26 | 1987-12-02 | Nec Corp | Washing method for semiconductor substrate |
| JPS63305906A (en) * | 1987-06-05 | 1988-12-13 | Matsushita Electric Works Ltd | Circulation filter of hot water |
-
1989
- 1989-05-22 JP JP1129153A patent/JPH02307080A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59162465A (en) * | 1983-03-07 | 1984-09-13 | Hitachi Micro Comput Eng Ltd | Tester |
| JPS62277734A (en) * | 1986-05-26 | 1987-12-02 | Nec Corp | Washing method for semiconductor substrate |
| JPS63305906A (en) * | 1987-06-05 | 1988-12-13 | Matsushita Electric Works Ltd | Circulation filter of hot water |
Cited By (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8208115B2 (en) * | 2007-11-16 | 2012-06-26 | Manufacturing Resources International, Inc. | Fluid cooled display |
| US9797588B2 (en) | 2008-03-03 | 2017-10-24 | Manufacturing Resources International, Inc. | Expanded heat sink for electronic displays |
| US9801305B2 (en) | 2008-03-03 | 2017-10-24 | Manufacturing Resources International, Inc. | Heat exchanger for an electronic display |
| US9835893B2 (en) | 2008-03-03 | 2017-12-05 | Manufacturing Resources International, Inc. | Heat exchanger for back to back electronics displays |
| US9894800B2 (en) | 2008-03-03 | 2018-02-13 | Manufacturing Resources International, Inc. | Constricted convection cooling system for an electronic display |
| US10721836B2 (en) | 2008-03-03 | 2020-07-21 | Manufacturing Resources International, Inc. | Electronic display with cooling |
| US10506740B2 (en) | 2008-03-03 | 2019-12-10 | Manufacturing Resources International, Inc. | Electronic display with cooling |
| US12108562B2 (en) | 2008-03-03 | 2024-10-01 | Manufacturing Resources International, Inc. | Electronic display with cooling |
| US10506738B2 (en) | 2008-03-03 | 2019-12-10 | Manufacturing Resources International, Inc. | Constricted convection cooling for an electronic display |
| US11540418B2 (en) | 2008-03-03 | 2022-12-27 | Manufacturing Resources International, Inc. | Electronic display with cooling |
| US11013142B2 (en) | 2008-03-03 | 2021-05-18 | Manufacturing Resources International, Inc. | Electronic display with cooling |
| US10420257B2 (en) | 2008-03-26 | 2019-09-17 | Manufacturing Resources International, Inc. | System and method for maintaining a consistent temperature gradient across an electronic display |
| US10314212B2 (en) | 2008-12-18 | 2019-06-04 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
| US11191193B2 (en) | 2008-12-18 | 2021-11-30 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
| US10827656B2 (en) | 2008-12-18 | 2020-11-03 | Manufacturing Resources International, Inc. | System for cooling an electronic image assembly with circulating gas and ambient gas |
| US10736245B2 (en) | 2009-11-13 | 2020-08-04 | Manufacturing Resources International, Inc. | Electronic display assembly with combined conductive and convective cooling |
| US10080316B2 (en) | 2009-11-13 | 2018-09-18 | Manufacturing Resources International, Inc. | Electronic display assembly having thermal cooling plate and optional convective air cooling loop |
| US10660245B2 (en) | 2012-10-16 | 2020-05-19 | Manufacturing Resources International, Inc. | Back pan cooling assembly for electronic display |
| US10524397B2 (en) | 2013-03-15 | 2019-12-31 | Manufacturing Resources International, Inc. | Heat exchanger assembly for an electronic display |
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| US10359659B2 (en) | 2013-07-08 | 2019-07-23 | Manufactruing Resources Internatonal, Inc. | Cooling system for electronic display |
| US10088702B2 (en) | 2013-07-08 | 2018-10-02 | Manufacturing Resources International, Inc. | Figure eight closed loop cooling system for electronic display |
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