JPS59162465A - Tester - Google Patents

Tester

Info

Publication number
JPS59162465A
JPS59162465A JP58036037A JP3603783A JPS59162465A JP S59162465 A JPS59162465 A JP S59162465A JP 58036037 A JP58036037 A JP 58036037A JP 3603783 A JP3603783 A JP 3603783A JP S59162465 A JPS59162465 A JP S59162465A
Authority
JP
Japan
Prior art keywords
low temperature
connector
tank
test
antifreeze liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58036037A
Other languages
Japanese (ja)
Inventor
Akihiro Nakanishi
中西 章弘
Toshio Inoue
井上 敏雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP58036037A priority Critical patent/JPS59162465A/en
Publication of JPS59162465A publication Critical patent/JPS59162465A/en
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To maintain a normal low temperature test environment by storing a non-conductive antifreeze liquid into a low temperature tank. CONSTITUTION:A non-conductive antifreeze liquid 2 never solidifying even under a very low temperature is stored into a low temperature tank 1 and cooled down to a very low temperature with a freezer 3 arranged in parallel therewith. An IC13 to be tested is carried in plurality as inserted into a terminal board 12 and with the door 4 of the low temperature tank 1 left open, the board 12 is inserted into a socket 11 of a connector 9 to connect the IC13 electrically to a specified tester. But as the connector 9 is submerged into the antifreeze liquid 2, there is no dew formation in the socket 11 or the like. Thus, a normal testable condition can be maintained.

Description

【発明の詳細な説明】 [技術分野] 本発明は、低温雰囲気下における動作試験を行うための
試験技術、特に、半導体装置の低温雰囲気下における動
作を試験するのに使用して有効な試験技術に関する。
[Detailed Description of the Invention] [Technical Field] The present invention relates to a test technique for performing an operation test in a low-temperature atmosphere, and in particular, a test technique that is effective when used to test the operation of a semiconductor device in a low-temperature atmosphere. Regarding.

[背景技術〕 たとえば、集積回路(IC)や大規模築積回路(LSI
)等のような半導体装置は、低温雰囲気下においても所
期の動作が発揮されることを確認するため、低温動作試
験を行われることがある。
[Background technology] For example, integrated circuits (IC) and large-scale integrated circuits (LSI)
), etc., are sometimes subjected to low-temperature operation tests to confirm that they perform as expected even in low-temperature atmospheres.

このよなな低温動作試験を行う場合、試験装置が使用さ
れるが、この試験装置としては、槽内雰囲気が冷気状態
になされる低温槽を備え、この低温槽内に半導体装置を
種々の特性試験を実行するテスタに接続するためのコネ
クタを設けられたものが考えられ得る。
When performing such low-temperature operation tests, test equipment is used. It is conceivable that a connector be provided for connection to a tester for carrying out the test.

しかし、このような試験装置においては、−10℃以下
で低温槽の扉を開閉すると、大気中の蒸気が槽内に侵入
しコネクタのプラグやソケット等が露結してしまうため
、正常な試験が行えないという問題点が生ずることが本
発明者によって明らかとされた。
However, in such test equipment, if the door of the cryostat is opened or closed at temperatures below -10°C, steam from the atmosphere will enter the tank and cause condensation on connector plugs and sockets, making it impossible to perform normal tests. The inventor has found that a problem arises in that it is not possible to perform the following steps.

[発明の目的] 本発明の目的は、前記問題点を解決し、常に正常な低温
動作試験を行うことができる試験装置を提供するにある
[Object of the Invention] An object of the present invention is to solve the above-mentioned problems and provide a test device that can always perform normal low-temperature operation tests.

本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述および添付図面から明らかになるであろう
The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[発明の概要コ 本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、次の通りである。
[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

すなわち、低温槽内に非導電性不凍液を貯留することに
より、コネクタ等の露結を防止し、富に正常な試験を確
保するようにしたものである。
That is, by storing a non-conductive antifreeze in a low temperature chamber, dew condensation on connectors, etc. is prevented and a normal test is ensured.

[実施例] 以下、本発明を図面に示す実施例にしたがって説明する
[Example] The present invention will be described below according to an example shown in the drawings.

図は本発明による試験装置の一実施例を示す一部切断正
面図である。
The figure is a partially cutaway front view showing an embodiment of the testing device according to the present invention.

本実施例において、この低温動作試験装置は低温槽1を
備えており、この槽1内には、極低温(たとえば、−6
0℃程度)でも凝固しないもので、かつ導電性がない非
導電性不凍液(たとえば、フロンを主成分とする液体)
2が貯留されている。
In this embodiment, this low temperature operation test device is equipped with a low temperature chamber 1, in which a cryogenic temperature (for example, -6
Non-conductive antifreeze that does not solidify even at temperatures around 0℃ and is not electrically conductive (e.g., liquids whose main component is fluorocarbons)
2 are stored.

低温槽1内はこれに並設された冷凍機3 (内部構造等
の詳細は省略する。)により極低温に冷却し得るように
構成されており、また、低温槽1は断熱構造(図示省略
)に構成されている。
The inside of the cryostat 1 is configured to be cooled to an extremely low temperature by a refrigerator 3 (details of the internal structure etc. are omitted) installed in parallel thereto, and the cryostat 1 has an adiabatic structure (not shown). ) is configured.

低温槽1の上面には扉4が開閉自在に被蓋されており、
この扉4はクランパ5により高度の密閉状態を維持し得
るように構成されている。低温槽1内には多孔板6が槽
内を左右に仕切るように設けられており、槽内の一方の
仕切室には、攪拌部材としての攪拌羽根7が不凍液2中
に没するように設けられ、この羽根7は槽外に設置され
たモータ8により回転駆動されるように構成されている
The top surface of the cryostat 1 is covered with a door 4 that can be opened and closed freely.
This door 4 is constructed so that a highly sealed state can be maintained by a clamper 5. A perforated plate 6 is installed in the low-temperature tank 1 to partition the inside of the tank into left and right sides, and a stirring blade 7 as a stirring member is installed in one partition in the tank so as to be submerged in the antifreeze liquid 2. The blades 7 are configured to be rotationally driven by a motor 8 installed outside the tank.

槽1内の他方の仕切室の底部には複数(1個のみ図示)
のコネクタ9が不凍液2中に沈降させて設置されており
、このコネクタ9は導線10により槽外に設備された各
種の特性テスタ(不図示)に接続されている。また、コ
ネクタ9には複数のソケット11が配設され、ソケット
11はターミナルボード12を挿入されて電気的に接続
し得るように構成−されている。ターミナルボード12
は、被試験体としての半導体装置(以下、ICという。
At the bottom of the other partition in tank 1, there are multiple (only one is shown)
A connector 9 is installed submerged in the antifreeze liquid 2, and this connector 9 is connected by a conductive wire 10 to various characteristic testers (not shown) installed outside the tank. Further, the connector 9 is provided with a plurality of sockets 11, and the sockets 11 are configured so that a terminal board 12 can be inserted thereinto for electrical connection. Terminal board 12
is a semiconductor device (hereinafter referred to as IC) as a test object.

)13を複数個挿入されるように構成されている。) 13 are inserted.

次に使用方法および作用を説明する。Next, the method of use and effect will be explained.

試験しようとするICl3はターミナルボード12に複
数個挿入されて搭載される。
A plurality of ICl3s to be tested are inserted and mounted on the terminal board 12.

低温槽1の扉4が開放され、rcを搭載されたターミナ
ルボード12がコネクタ9のソケット11に挿入され、
この挿入により、各ICl3はボード12、ソケット1
1、コネクタ9導線10を介して所定のテスタに電気的
に接続される。
The door 4 of the cryostat 1 is opened, and the terminal board 12 loaded with the RC is inserted into the socket 11 of the connector 9.
With this insertion, each ICl3 has board 12, socket 1
1. Connector 9 is electrically connected to a predetermined tester via conductor 10.

ところで、低温槽内部が気相であると、扉4が開放され
た際に槽内に大気が侵入し、大気中の水蒸気が冷却され
てコネクタのソケット等に露結することがある。この露
結により、コネクタのソケット等の電気的絶縁が損なわ
れる等して各種のテスタによる電気的な特性テストに誤
差が生じ、正常な試験が行われなくなる。
By the way, if the inside of the cryogenic chamber is in a gas phase, the atmosphere may enter the chamber when the door 4 is opened, and the water vapor in the atmosphere may be cooled and condense on connector sockets and the like. This dew condensation damages the electrical insulation of connector sockets and the like, causing errors in electrical characteristic tests performed by various testers, making it impossible to conduct normal tests.

しかし、前記構成にかかる試験装置において、低温槽1
には非導電性不凍液2が貯留され、コネクタ9はこの液
中に没しているので、ソケット等に露結現象が発生する
ことは全くない。したがって、常に正常な試験可能状態
が維持されることになる。
However, in the test apparatus according to the above configuration, the cryostat 1
Since a non-conductive antifreeze liquid 2 is stored in and the connector 9 is immersed in this liquid, there is no possibility of dew condensation occurring on the socket or the like. Therefore, a normal testable state is always maintained.

コネクタ9へのターミナルボード12の装着が完了する
と、扉4がクランパ5により密閉され、槽1内は冷凍機
3により所定の試験温度に維持される。
When the attachment of the terminal board 12 to the connector 9 is completed, the door 4 is sealed by the clamper 5, and the inside of the tank 1 is maintained at a predetermined test temperature by the refrigerator 3.

このとき、攪拌羽根7により非導電性不凍液2が攪拌さ
れ、不凍液2の温度分布が槽内金体に渡って均一化に維
持される。したがって、槽1内の全てのICl3は等し
、い低温の雰囲気下に置かれる。
At this time, the non-conductive antifreeze liquid 2 is stirred by the stirring blade 7, and the temperature distribution of the antifreeze liquid 2 is maintained uniform over the metal bodies in the tank. Therefore, all ICl3 in tank 1 is placed under an equal and low temperature atmosphere.

多孔板6は攪拌羽根7の攪拌力が直接ICl3等に波及
することを防止する役目を果たす。
The perforated plate 6 serves to prevent the stirring force of the stirring blade 7 from directly affecting the ICl 3 and the like.

このような所定の低温雰囲気下において、各IC1,3
に対してテスタによる所定の動作試験がコネクタ9ミボ
ード12等を介して実施される。
Under such a predetermined low temperature atmosphere, each IC1, 3
A predetermined operation test by a tester is performed on the connector 9 through the board 12 and the like.

し効果] (1)、低温槽に非導電−性不凍液を貯留することによ
り、外気が槽内に侵入することを′防止することができ
、露結現象によるコネクタ等の導通不良が未然に回避で
き、常に正常な低温試験環境を維持することができる。
Effects] (1) By storing non-conductive antifreeze in a low temperature tank, it is possible to prevent outside air from entering the tank, and to avoid conduction failures in connectors, etc. due to dew condensation. and can always maintain a normal low-temperature test environment.

(2)、低温槽に非導電性不凍液を貯留することによリ
、扉と開放した際における内外気の入れ替わりが回避で
きるので、扉開放時の冷温逃散によるエネルギの損失を
抑制することができる。
(2) By storing non-conductive antifreeze in the cryostat, it is possible to avoid the exchange of inside and outside air when the door is opened, so it is possible to suppress energy loss due to cold and hot dissipation when the door is opened. .

(3)、非導電性不凍液を攪拌することにより、温度分
布を均一化することができ、槽内金体に渡って等しい低
温試験雰囲気を作り出すことができる。
(3) By stirring the non-conductive antifreeze liquid, the temperature distribution can be made uniform, and an equal low-temperature test atmosphere can be created throughout the metal body in the tank.

゛以上本発明者によってなされた発明を実施例にもとづ
き具体的に説明したが、本発明は前記実施例に限定され
るものではな(、その要旨を逸脱しない範囲一で種々変
更可能であることはいうまでもない。
゛Although the invention made by the present inventor has been specifically explained based on examples, the present invention is not limited to the above-mentioned examples (and may be modified in various ways without departing from the gist thereof). Needless to say.

たとえば、多孔板および攪拌羽根は1組に限らないし、
また省略することも可能である。さらに、低温槽、コネ
クタ等の構造、数量にも特に限定はない。
For example, the number of perforated plates and stirring blades is not limited to one set;
It is also possible to omit it. Furthermore, there are no particular limitations on the structure or quantity of the cryostat, connectors, etc.

[利用分野] 以上9説明では主として本発明者によってなされた発明
をその背景となった利用分野である半導体装置の低温動
作試験装置に適用した場合に・ついて説明したが、それ
に限定されるものではなく、たとえば、他の電気部品の
低温動作試験装置等にも適用可能である。
[Field of Application] In the above nine explanations, the invention made by the present inventor has mainly been explained in the case where it is applied to the field of application which is the background of the invention, which is a low-temperature operation test equipment for semiconductor devices, but the present invention is not limited thereto. For example, it can also be applied to low-temperature operation test equipment for other electrical components.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明の一実施例を示す一部切断正面図である。 l・・・低温槽、2・・・非導電性不凍液、3・・・冷
凍機、4・・・扉、6・・・多孔板、7・・・攪拌部材
、9・・・コネクタ、10・・・導線、11・・・ソケ
ット、12・・・ターミナルボード、I3・・・IC(
被試験体)。
The figure is a partially cutaway front view showing one embodiment of the present invention. 1... Low temperature tank, 2... Non-conductive antifreeze, 3... Freezer, 4... Door, 6... Perforated plate, 7... Stirring member, 9... Connector, 10 ...Conductor, 11...Socket, 12...Terminal board, I3...IC (
test object).

Claims (1)

【特許請求の範囲】 ■、低温槽内に被試験体を入れて低温雰囲気下における
試験を行う試験装置において、前記低温槽内に非導電性
不凍液を貯留したことを特徴とする試験装置。 2、低温槽が、非導電性不凍液を攪拌して温度分布を均
一化する攪拌部材を、有することを特徴とする特許請求
の範囲第1項記載の試験装置。
[Scope of Claims] (1) A test device for carrying out a test in a low temperature atmosphere by placing a test object in a low temperature chamber, characterized in that a non-conductive antifreeze liquid is stored in the low temperature chamber. 2. The test device according to claim 1, wherein the low temperature bath has a stirring member that stirs the non-conductive antifreeze to make the temperature distribution uniform.
JP58036037A 1983-03-07 1983-03-07 Tester Pending JPS59162465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58036037A JPS59162465A (en) 1983-03-07 1983-03-07 Tester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58036037A JPS59162465A (en) 1983-03-07 1983-03-07 Tester

Publications (1)

Publication Number Publication Date
JPS59162465A true JPS59162465A (en) 1984-09-13

Family

ID=12458511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58036037A Pending JPS59162465A (en) 1983-03-07 1983-03-07 Tester

Country Status (1)

Country Link
JP (1) JPS59162465A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168238A (en) * 1985-01-21 1986-07-29 Fujitsu Ltd Inspecting apparatus of semiconductor device
JPS62248232A (en) * 1986-04-22 1987-10-29 Nec Corp Inspection device for semiconductor wafer
JPH01187472A (en) * 1988-01-21 1989-07-26 Hitachi Ltd Burn-in device
JPH02307080A (en) * 1989-05-22 1990-12-20 Nec Corp Liquid-cooled bt device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5151355A (en) * 1974-10-30 1976-05-06 Hitachi Ltd Buhinno koonkensasochi
JPS589385A (en) * 1981-07-08 1983-01-19 Nec Corp Manufacture of semiconductor laser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5151355A (en) * 1974-10-30 1976-05-06 Hitachi Ltd Buhinno koonkensasochi
JPS589385A (en) * 1981-07-08 1983-01-19 Nec Corp Manufacture of semiconductor laser

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168238A (en) * 1985-01-21 1986-07-29 Fujitsu Ltd Inspecting apparatus of semiconductor device
JPS62248232A (en) * 1986-04-22 1987-10-29 Nec Corp Inspection device for semiconductor wafer
JPH01187472A (en) * 1988-01-21 1989-07-26 Hitachi Ltd Burn-in device
JPH02307080A (en) * 1989-05-22 1990-12-20 Nec Corp Liquid-cooled bt device

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