JPH02306554A - Connecting device - Google Patents
Connecting deviceInfo
- Publication number
- JPH02306554A JPH02306554A JP1126904A JP12690489A JPH02306554A JP H02306554 A JPH02306554 A JP H02306554A JP 1126904 A JP1126904 A JP 1126904A JP 12690489 A JP12690489 A JP 12690489A JP H02306554 A JPH02306554 A JP H02306554A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- lead
- conductor
- board
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 6
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、基板上の導体とリード線とを接続する電子部
品実装用の接続装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a connection device for mounting electronic components that connects conductors on a board and lead wires.
従来の技術
従来、この種の接続装置は第２図に示すような構造であ
った。2. Description of the Related Art Conventionally, this type of connection device has had a structure as shown in FIG.
第２図において、２１はリード線、２２はソケットの本
体部、２３は接触片、２４は基板、２５ははんだ、２６
は導体であり、ソケット本体部２２と接触片２３とから
なるソケットを、基板２４上の導体２６にはんだ２５に
て固定し、リード線２１を挿入するという構成である。In FIG. 2, 21 is a lead wire, 22 is a main body of the socket, 23 is a contact piece, 24 is a board, 25 is solder, 26
is a conductor, and has a structure in which a socket consisting of a socket body 22 and a contact piece 23 is fixed to a conductor 26 on a board 24 with solder 25, and a lead wire 21 is inserted.
発明が解決しようとする課題
このようなソケットにおいては、リード線が貫通しない
構造となっているので、１本のリード線に複数の基板を
接続する場合には、ソケットのリード部分を長くして、
他のソケットに挿入していかなければならないという問
題点が生じる。Problems to be Solved by the Invention These sockets have a structure in which the lead wires do not penetrate, so when connecting multiple boards to one lead wire, the lead portion of the socket must be lengthened. ,
The problem arises that it must be inserted into another socket.
本発明は、１本のリード線に複数の基板を容易に接続で
きるようにすることを目的とするものである。An object of the present invention is to enable a plurality of substrates to be easily connected to one lead wire.
課題を解決するための手段
この課題を解決するために本発明は、基板に設けた貫通
孔に取付けられると共に基板上の導体に接続され、かつ
内部にばね性を持つ接触片を備えた導電性のソケットを
有し、そのソケット内のリード線が前記接触片に接触し
、かつソケットを貫通して基板の裏面に突出するように
挿着したものである。Means for Solving the Problems In order to solve the problems, the present invention provides a conductive device which is attached to a through hole provided in a substrate, is connected to a conductor on the substrate, and is provided with a contact piece having a spring property inside. The lead wire in the socket contacts the contact piece, penetrates the socket, and is inserted so as to protrude from the back surface of the board.
作用
この構成により、突出した１本のリード線に複数のプリ
ント基板を容易に接続することができることとなる。Function: With this configuration, a plurality of printed circuit boards can be easily connected to one protruding lead wire.
実施例
以下、本発明の一実施例を示す第１図を用いて説明する
。第１図において、１１はリード線であり、１２は導電
性のソケット本体部であり、１３はこのソケット本体部
１２の内部に設けたばね性を持つ接触片、１４は基板、
１５ははんだ、１６は導体である。ソケット本体部１２
と接触片１３とからなるソケットを、基板１４に−けた
貫通孔に挿入すると共に、基板１４上の導体１６にはん
だ１５にて固定している。リード線１１はソケット本体
部１２に挿着され、その際にリード線１１がソケット本
体部１２を貫通して基板１４の裏面に突出する。この突
出したリード線１１に他のソケットを挿着することによ
り、複数の基板を容易に接続することができる。また、
リード線１１は接触片１３．ソケット本体部１２を介し
て導体１６に接続されることとなる。EXAMPLE Hereinafter, an example of the present invention will be explained using FIG. 1. In FIG. 1, 11 is a lead wire, 12 is a conductive socket body, 13 is a contact piece with spring properties provided inside this socket body 12, 14 is a substrate,
15 is solder, and 16 is a conductor. Socket body part 12
A socket consisting of a contact piece 13 and a contact piece 13 is inserted into a through hole in a substrate 14, and is fixed to a conductor 16 on the substrate 14 with solder 15. The lead wire 11 is inserted into the socket main body 12 , and at that time, the lead wire 11 penetrates through the socket main body 12 and protrudes to the back surface of the board 14 . By inserting another socket into this protruding lead wire 11, a plurality of boards can be easily connected. Also,
The lead wire 11 is connected to the contact piece 13. It will be connected to the conductor 16 via the socket main body 12.
発明の効果
以上のように本発明によれば、基板上の導体に接続され
たソケットをリード線が貫゛通して基板裏面に突出する
ことにより、１本のリード線に複数のプリント基板を容
易に接続することができるという効果が得られる。Effects of the Invention As described above, according to the present invention, the lead wire passes through the socket connected to the conductor on the board and protrudes from the back surface of the board, so that multiple printed boards can be easily attached to one lead wire. The effect is that it can be connected to.
第１図は本発明の一実施例による接続装置の断面図、第
２図は従来の接続装置の断面図である。
１・・・・・・リード線、１２・・・・・・ソケット本
体部、１３・・・・・・接触片、１４・・・・・・基板
、１５・・・・・・はんだ、１６・・・・・・導体。FIG. 1 is a sectional view of a connecting device according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional connecting device. DESCRIPTION OF SYMBOLS 1... Lead wire, 12... Socket body, 13... Contact piece, 14... Board, 15... Solder, 16 ······conductor.
Claims (1)
に接続され、かつ内部にばね性を持つ接触片を備えた導
電性のソケットを有し、そのソケット内のリード線が前
記接触片に接触し、かつソケットを貫通して基板の裏面
に突出するように挿着した接続装置。It has a conductive socket that is attached to a through hole provided in the board, connected to a conductor on the board, and has a contact piece having a spring property inside, and a lead wire in the socket comes into contact with the contact piece. A connection device inserted so as to penetrate the socket and protrude from the back side of the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1126904A JPH02306554A (en) | 1989-05-19 | 1989-05-19 | Connecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1126904A JPH02306554A (en) | 1989-05-19 | 1989-05-19 | Connecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02306554A true JPH02306554A (en) | 1990-12-19 |
Family
ID=14946770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1126904A Pending JPH02306554A (en) | 1989-05-19 | 1989-05-19 | Connecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02306554A (en) |
-
1989
- 1989-05-19 JP JP1126904A patent/JPH02306554A/en active Pending
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