JPH02305458A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To effectively connect an EPROM chip with a microcomputer and to make a data wire unnecessary to be led around by a method wherein a protrudent board is provided to the optional peripheral side of a board, and the EPROM chip is connected to a conductive path formed on the protrudent board. CONSTITUTION:As an EPROM chip 4 is connected to a board 2 extended from the periphery of a case material 8, the mounting position of the EPROM chip 6 can be optionally set to the periphery of the case material 5. By this setup, the EPROM chip 4 and a microcomputer 5 are effectively connected together and the lead wire of a signal wire or a conductive path 3 can be dispensed with, a data wire through which data are transmitted between the EPROM chip 4 and the microcomputer 5 can be made the shortest in length, a mounting density loss caused by leading the data wire around can be restricted to the irreducible minimum, so that a highly dense mounting can be realized. Moreover, as all the elements 6 excluding the EPROM chip 4 are formed chip-like and housed in a sealed space 14 formed of the case material 8 and the board 2, so that a hybrid integrated circuit device of this design can be made small in size.

Description

Detailed Description of the Invention (a) Industrial Application Field The present invention relates to an EPROM chip, which is formed by mounting a chip-type non-volatile memory, such as an EFROM (ultraviolet erasable programmable read-only memory) on an integrated circuit board. The present invention relates to a built-in hybrid integrated circuit device.

(b) Conventional technology An EP having an ultraviolet irradiation window that can erase and rewrite previously written memory information by irradiating it with ultraviolet rays.
ROM elements are favorably used in various electronic devices.

Currently, most of these EPROM elements are mounted on printed wiring boards together with control or driving integrated circuits, and in order to rewrite the information once written, they are usually mounted on easily removable printed wiring boards. has been done. For various electronic devices that require smaller size and lighter weight, a semiconductor integrated circuit (IC) chip is directly mounted on a printed wiring board using a technique called chip-on-board, and after the required wiring is done, this The IC chip including the wiring part is synthesized am
It has been coated with a material that is extremely compact and lightweight.

On the other hand, EPROM chips that require an ultraviolet irradiation window cannot be made smaller and lighter because the irradiation window is a bottleneck and they are still manufactured in a cerdip package and mounted on a printed wiring board.

The mounting structure of such a conventional EPROM element will be explained with reference to FIG. 9. FIG. 9 is a perspective view with a partial cross section of a conventional EPROM element, in which a conductive wiring pattern (41) is formed on the main surface. Through holes (43) in an insulating substrate (42) made of glass, epoxy resin, etc.
) is incorporated in a cerdip type package and is equipped with an EPROM element (44). This EPROM element (4
4) has a header (45) and a cap (46), and the header (45) is bonded to the ceramic base material (47) with an external lead (48) or a low melting point glass material. In addition, this header (45) has an element mounting part (50
) is on the low melting point glass material or ceramic substrate (47)
The EPR is glued on top of the device, and the EPR
The OM chip (51) is mounted with the ultraviolet irradiation surface facing up, and the electrode of this chip (51) and the external lead (4)
8) are connected by a thin metal wire (52). The cap (46) is a storage member, and the EPROM
A window (5) is provided in the part facing the ultraviolet irradiation surface of the chip (51).
3), the cap (46) is connected to the header (45) by a low melting point glass.
The EPROM chip (51) placed in the holder is hermetically sealed. The EPROM element (44) with the EPROM block (51) sealed in this way is attached to the insulating substrate (42).
The external lead (48) is inserted through the through hole (43) and fixed with solder. This through hole (4
3), the conductive wiring pattern (41) conducts the required wiring, and the male connector terminal section <55) provided at the end of the insulating substrate is connected to a female connector (not shown). Ru.

Now, the mounting structure of such a conventional EPROM element is
Compared to the ROM chip (51), the package external shape is extremely large, and not only the surface area is occupied but also three-dimensional, that is, the height is several times the height of the chip, which is extremely disadvantageous for thinning. Furthermore, after the external lead is inserted into the through hole (43), it is necessary to fix it with solder or the like. Another major drawback that should be noted is that EP
This involves assembling some ROM elements into a package. E
Since the PROM element has a window for irradiating ultraviolet rays, its package is assembled into a ceramic-based cerdip type package, but since this package is sealed with low-melting glass, it can be heated at high temperatures (400 to SOO℃). )
If the thin metal wires that serve as a seal and connect the electrodes (aluminum) of the EPROM chip and the external leads are not made of the same material, alloying will occur, resulting in an increase in wiring resistance or disconnection. To avoid such a situation, thin aluminum wire is usually used, but this EPROM
Since the chip needs to have the substrate at ground potential, EP
The ground electrode of the ROM chip is connected by wire to the chip mounting portion formed of gold paste. Here, too, a secondary or multi-component alloy reaction progresses between the gold or metals such as foil in the gold paste and the aluminum, so a small piece of silicon whose head is coated with aluminum, called a ground die, is used. Separately from the EPROM chip, it is fixed to the chip mounting part made of the gold paste, and this ground die head and the EPR
Conventional mounting structures are unsatisfactory in terms of small size, light weight, and low cost, as they involve extremely complicated work of connecting the OM chip to the ground electrode.

In order to solve this problem, the EPROM shown in FIG.
There is an implementation structure.

The EPROM mounting structure shown in FIG. 10 will be explained below.

An insulating substrate (6
0) has a chip mounting area (60c) on which the EPROM chip 1) is placed, and the wiring pattern (60b)
) is routed from near this area on the main surface (60a) and connected to a male connector terminal portion (not shown).

The area (6Qc) has an EPROM chip (61)
is mounted, and the surface electrode of this chip (61) and the wiring pattern (60b) are metal mesh! (62). Of course, one of the thin metal wires (62) is connected to the chip (
In order to connect to the substrate of 61), this chip (
61) is wired with the wiring pattern (60b) mounted thereon. A UV-transparent resin (63) is placed on the UV-irradiated surface (61a) of the EPROM chip (61).
(For example, manufactured by Toshisha Co., Ltd., model name TX-978), an ultraviolet-transparent window material (64) is fixed thereto. This window material (6
4) is a known ultraviolet transparent material such as quartz or transparent alumina. Then, the top surface (64a) of the window material (64)
) is the surface that introduces light to the ultraviolet irradiation surface of the EPROM chip (61), so the remaining window material (64) portion excluding this top surface (64a), the thin metal wire (62), and this metal The connecting portion between the thin wire (62) and the wiring pattern (60b) is made of synthetic wood Jl (65) (for example, manufactured by Nitto Denko Corporation,
It is coated with model name MP-10). If the insulating substrate (60), EPROM chip (61) and window material (64)
If it is necessary to further reduce the total thickness dimension including
The chip mounting area (60c) of the board (60) can be used as a counterbore hole to grip about half the thickness of the board (60).
) is formed and acts effectively against the infiltration of moisture.

The EPROM mounting structure shown in FIGS. 9 and 10 is described in Japanese Patent Laid-Open No. 60-83393 (HO5K 1718).

(c) Problems to be Solved by the Invention In the EPROM mounting structure shown in FIG. 10, since the EFROM chip is die-bonded onto the printed circuit board, it goes without saying that it is miniaturized. However, the miniaturization referred to here is only the miniaturization of the EPROM itself. In other words, although it is not clear from Fig. 10, the microcomputer and its peripheral circuit elements that are fixed around the EFROM are composed of discrete electronic components, so the printed circuit board on which the EFROM is mounted is When looking at the entire system as an integrated circuit, there is a problem in that the size of the printed circuit board increases as before, without any reduction in size, that is, the overall system increases in size.

Also, in the mounting structure shown in FIG. 9, as in FIG. 10, the peripheral circuits of the EFROM, that is, the circuit elements such as the microcomputer and its peripheral LSIs and ICs, are composed of discrete electronic components. However, there is a major problem in that the size of the printed circuit board, that is, the size of the entire system, makes it impossible to provide integrated circuits equipped with EFROM that are light, thin, short, and small as required by users.

Furthermore, in the EPROM mounting structure shown in FIGS. 9 and 10, the entire system becomes larger as described above, and the conductive patterns that connect the EFROM and its surrounding circuit elements are exposed, which reduces reliability. There is a problem of deterioration.

Furthermore, in the EPROM mounting structure shown in FIGS. 9 and 10, the EPROM and surrounding circuit elements such as a microcomputer, IC, and LSI are completely exposed.
There is a problem that unevenness occurs on the upper surface of the substrate, making it difficult to handle and reducing workability.

B) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes mounting an EPROM chip on a substrate and
The microcomputer and its peripheral circuit elements connected to the M chip are mounted on each substrate, and the microcomputer and all its peripheral circuit elements are hermetically sealed in the sealed space formed by the case material and the substrate. Stopped EPRO
It is characterized in that only the M chip is provided on a substrate that protrudes from a predetermined position around the case material.

Therefore, a hybrid integrated circuit equipped with an EPROM chip can be made extremely compact.

(*) Function As described above, according to the present invention, since the EPROM chip is connected on one of the substrates extending around the periphery of the case material,
Since the mounting position of the ROM chip can be set arbitrarily around the case material, considering the electrical connection with the built-in microcomputer, it is possible to efficiently connect the EPROM and the microcomputer, and the signal line, i.e. It is possible to eliminate the need for a lead line for a conductive path.

Furthermore, the most closely related microcomputer can be placed around the substrate adjacent to the EPROM chip, and the data line for exchanging data between the EPROM chip and the microcomputer can be realized at the shortest or minimum distance. The loss in packaging density is minimized, allowing high-density packaging.

Furthermore, the present invention provides a hybrid integrated circuit device that is compact and easy to handle because all elements other than the EPROM chip are in the form of chips and are housed in a sealed space formed by the case material and the substrate. I can do it.

(F) Embodiments Below, the hybrid integrated circuit device of the present invention will be explained in detail based on the embodiments shown in FIGS. 1 to 8.

1 and 2 show a hybrid integrated circuit device (1) according to an embodiment of the present invention. This hybrid integrated circuit device (1) is used as an independent electronic component and is used as an integrated circuit having independent functions in a wide range of fields such as computers.

As shown in FIGS. 1 and 2, this hybrid integrated circuit device (1) includes an integrated circuit board (2), a conductive path (3) of a desired shape formed on the integrated circuit board (2), Case material (8
) A resin-molded nonvolatile memory chip connected to the conductive path (3) on the protruding substrate (2a)
4), a microcomputer (5) and its peripheral circuit elements (6) which are supplied with data from the memory chip (4) and are connected to the conductive path 3) on the substrate (2), and the substrate (2). It is composed of a case material (8) that is integrated with the projecting substrate (2a) and exposes the protruding substrate (2a).

The integrated circuit board (2) is a hard substrate made of ceramics, glass epoxy, metal, or the like, and in this embodiment, a metal substrate with excellent heat dissipation and mechanical strength is used.

As the metal substrate, for example, an aluminum substrate with a thickness of 0.5 to 1.0 m is used. As shown in Figure 3, the surface of the substrate (2) is coated with an aluminum oxide film (
9) (alumite layer) is formed, and 10
An insulating resin layer (10) of epoxy or polyimide or the like with a thickness of ~70μ is pasted. Further, on the insulating resin layer (10), a copper foil (11) with a thickness of 10 to 70 μ is placed on the insulating resin layer (10).
At the same time, it is attached using a roller or hot press.

On the surface of the copper foil (11) provided on the -main surface of the substrate (2), a conductive path of a desired shape is exposed by screen printing and masked with a resist, and a precious metal (gold, silver, platinum) plating layer is formed. The surface of the copper foil (11) is plated. After that, the resist was removed and copper foil (1
Etching step 1) is performed to form a desired conductive path (3). Here, the thinness of the conductive path (3) by screen printing is limited to 0.51 mm, so when an ultra-fine wiring pattern is required, the ultra-fine conductive path (3) up to about 2 μm can be formed using well-known photo-etching technology. Formation becomes possible.

A nonvolatile memory chip (4) is mounted at a predetermined position on the conductive path (3) of the protruding substrate (2a), and data is supplied from the memory chip (4) near the memory chip (4). A microcomputer (5) and peripheral circuit elements (6) are mounted and connected to a conductive path (3). The conductive path (3) is formed to extend over substantially the entire surface of the substrate (2), and a lead fixing pad is formed at the tip of the conductive path (3) extending to the peripheral edge of the substrate (2). An external lead terminal (12) is fixed to the. The external lead (12) is bent at a substantially right angle for attachment to the board.

EPROM (Er
asable Programmable Read 0
(hereinafter, the nonvolatile memory chip (4) will be referred to as an EPROM chip).As is well known, this EPROM chip (4) is stored in a bloating gate formed in the pellet of the EPROM chip (4). It is an element that can be used by irradiating light to excite the electrons (program data) stored in the memory, returning them to the pellet in an unmemorized state, and rewriting it. EPROM chips (4
) are commercially available, and their explanation will be omitted in this example.

The ICs, transistors, chip resistors, chip capacitors, etc. of the microcomputer (5) and its peripheral circuit elements (6), which are supplied by selecting the program data of the EPROM chip (4), are connected to desired conductive paths (3) in a chip state. ) by soldering or a brazing material such as Ag paste, and the microcomputer (5) and circuit element (6) are bonded to the nearby conductive path (3). Furthermore, a carbon resistor by screen printing and a nickel-plated resistor by nickel plating are formed as resistance elements between the conductive paths (3), respectively.

On the other hand, the case material (8) is made of a thermoplastic resin as an insulating member, and is formed into a box shape so that a space is formed when it is fixed to the substrate (2). The box-shaped case material (
The peripheral end portion of 8) is disposed substantially at the peripheral end portion of the substrate (2) and is firmly fixed and integrated with the substrate (2) using an adhesive sealant (J sheet: trade name). As a result, the substrate (2
) and the case member (8), a predetermined sealed space (14) is formed between the case and the case member (8). Furthermore, the case material (8) of this example
A protruding substrate (2a) is exposed from the protruding substrate (2a).
is formed to a size that allows the EPROM chip (4) to be placed thereon. Note that this protruding board (2a) is the 4th part of the board (2).
It can be provided at any position on the side, and its position is determined in relation to the microcomputer (5).

E is placed on the protruding substrate (2a) exposed from the case material (8).
A plurality of conductive paths (
3) is formed, and E is formed at the tip of the conductive path (3).
PROM chip (4) is fixed. The other end of the conductive path (3) to which the EPROM chip (4) is fixed is efficiently routed near the microcomputer (5) and electrically connected to the chip-shaped microcomputer (5) by a bonding wire.

Here, the positional relationship between the EPROM chip (4) and the microcomputer (5) will be described. Since the EPROM chip (4) and the chip-shaped microcomputer (5) can be connected via a large number of conductive paths (3), in order to shorten the length of the conductive paths (3), the EPROM chip (
4) and the microcomputer (5) are arranged adjacent to each other or as close as possible to each other. Therefore, the electrically conductive path (3) between the EPROM chip (4) and the microcomputer (5) can be formed in the shortest distance, and the mounting area on the board can be used effectively. E
A PROM chip (4) and a chip-shaped microcomputer (5) placed near or adjacent to it are connected by wires and the tip of a conductive path (3) that extends near the microcomputer (5). It is bonded and electrically connected to the EPROM chip (4).

As is clear from FIGS. 1 and 2, the EPROM chip is mounted on a protruding substrate (2a) that protrudes from the case material (8). On the protruding substrate (2a), an EPROM chip (4) and a wire line (7) connecting the EPROM chip (4) and a nearby conductive path (3) are surrounded.

Furthermore, one or more layers of resin are coated on the protruding substrate (2a), and the EPROM chip (4) and wire lines are completely covered with the resin layer. The first layer of resin is coated directly onto the EPROM chip (4).
Since it is necessary to transmit ultraviolet rays when erasing the data in step 4), an ultraviolet-transparent resin (21a) is used. The ultraviolet-transparent resin (21a) is not limited as long as it is non-aromatic, and for example, methyl-based silicone rubber or silicone gel may be used.

In this embodiment, the second resin layer (21b) is filled on the first resin layer (21a). Unlike the first layer, the second resin layer uses an ultraviolet opaque resin (21b) that blocks ultraviolet rays to prevent erroneous erasing of the EPROM chip (4). This resin layer (21b) is not limited to any resin as long as it contains an aromatic ring (benzene ring).
For example, epoxy or polyimide resin is used.

Therefore, only the EPROM chip (4) protrudes from the board (2a).
Another microcomputer (5) and other circuit elements (6) are mounted on the top and covered with two layers of resin, and the other microcomputer (5) and other circuit elements (6) are placed in a sealed space (1) formed by the substrate (2) and the case material (8).
4) will be placed within.

As mentioned above, the microcomputer (5) and its peripheral circuit elements (6) are connected to the EPROM chip (4).
) is set so as to be placed in a sealed space (14) formed by the substrate (2) and the case material (8).

That is, all elements, including chip-shaped electronic components and resistance elements such as printed resistors and plated resistors, are provided within the sealed space (14).

In this embodiment, when data is to be erased from the EPROM chip (4), the ultraviolet opaque resin (21b) is peeled off and ultraviolet rays are irradiated, and when data is to be rewritten, the EPROM chip (
4) Peel off the upper UV-transparent resin (21a) and bring a terminal such as a probe into contact with the nearby conductive path (3) that is bonded, and write data from the writing device. At this time, the UV-transparent resin (21a) When removing 21a), remove the resin (
21a) does not have a very strong adhesive force, so the wire will not break.

A specific example of a hybrid integrated circuit device for a modem using the present invention will be shown below.

What is a modem? A modem exists for data communication in which digitized data handled by a data terminal such as a personal computer is sent and received at a distance using a telephone line. The function of a modem is to modulate digitized data using the frequency that can be used on the telephone line, convert it into an analog signal, and send it on the telephone line, and to send an analog signal that is modulated with the data sent from the other party. It has the ability to demodulate and return to digitized data.

The modem will be briefly explained based on the block diagram shown in FIG.

FIG. 4 is a block diagram when the modem is mounted on the integrated circuit board (2).

The modem has a DTE interface (21) that stores data sent from the computer in its built-in memory and outputs the data, and a DTE interface (21).
A microcomputer (5) that outputs a predetermined output signal based on data output from the microcomputer (5), and an EFR that contains data addressed by the microcomputer (5).
The output signals from the OM (4) and the microcomputer (5) are modulated and demodulated to the NCU (NETWORK C0NTR).
0L UNIT) and a microcomputer (5).
A DTMF generator (24) generates a desired DTMF signal (tone signal) according to an output signal from the DTMF generator (24).

The DTE interface consists of an IC such as 5TC9610 (Seiko Epson), and as shown in Figure 5, it has a transmitting memory that supplies the output signal of the personal computer, stores the output signal in the built-in memory, and outputs it to the microcomputer (5). Part (25) and microcomputer (5)
a receiving memory part (26) that accumulates the signal supplied with the output signal from the built-in memory and outputs it to the personal computer;
Part of transmitting memory (25) and part of receiving memory (26)
A control unit (2) that switches each signal input and output via
7), and has a predetermined function for connecting the personal computer (28) and the microcomputer (5).

The microcomputer (5) is, for example, 5TC9620 (
It consists of IC such as Safe Ebson), as shown in Figure 6.
A command recognition section that recognizes the output signal output from the DTE interface (21), a command decoding section that decodes the output signal recognized by the command recognition section, and a part of memory that decodes the signal decoded by the command decoding section. The DTE interface (21 ) and a response code generation unit that outputs an output signal to the output signal.

The modulation/demodulation circuit (28) converts the digital signal sent from the microcomputer (5) into an analog signal and sends it to the NC
Send to U department. On the other hand, it converts the analog signal sent from the NCU section into a digital signal and sends it to the microcomputer (5), and includes low-speed and medium-speed circuits. First modulation/demodulation circuit (22
) is a 300 bps low speed modulation/demodulation circuit, and the second modulation/demodulation circuit (23) is a 1200 bp8 medium speed modulation/demodulation circuit. Respective first and second modulation/demodulation circuits (22) (23
), one of the modulation and demodulation circuits is selected by the microcomputer (5).

DTMF generator (24) is a microcomputer (5)
The data output from the command execution part of COL, RO
A predetermined DTMF signal is generated by inputting it to each input terminal of W, and is output to the transmitting A M P (29a) to supply the signal to the telephone line.

Program data for setting various modes of the modem is stored in the EFROM (4) and is supplied to the microcomputer (5) based on the address of the microcomputer (5).

Next, the operation of the modem will be briefly explained.

First, to start communication with a personal computer, the control switch (29d) operates based on a read signal from the microcomputer (5), and predetermined address data is read from the EPRO.
EPRO supplied to M(4) and based on its address
The program data of M (4) is supplied to the microcomputer (5), and the communication standard (BELL/CCITT standard) and communication speed (300/1
200bpS), data format matching, and various modes such as depth switch mode switching are checked.

Assuming the various modes match, enter the answering modem's phone number into your computer.

The phone number is the DT for interfacing with the computer.
E-interface (21) and forwarded to the microcomputer (5) for decoding the telephone number.

Send the decoded result to the DTMF generator (24),
A DTMF signal is transmitted from a DTMF generator (24) and transferred to a general telephone line via a transmitting A M P (29a) and a line transformer (29c).

The transferred DTMF signal sends a paging signal to the modem on the responding side, and the modem on the responding side receives the paging signal and automatically receives the call. Then, the modem on the responding side sends an answer tone for the connection procedure to the modem on the calling side.

In the modem on the calling side, the answer tone passes through a line transformer (29c) and a receiving amplifier (29b), and is sent to the low-speed modulation/demodulation circuit (22) as a predetermined answer to the modem on the calling side.
Detect whether it is a tone or not. If it is a predetermined answer tone, the communication state is entered.

When the communication state is established, parallel data from the PC is input to the DTE interface (21) based on predetermined key manual signals from the keyboard of the calling party's PC,
The data is transferred to the microcomputer (5).

Here, parallel data is converted to serial data. The digital signal converted into serial data is sent to a low-speed modulation/demodulation circuit (22). Here, the digital signal is converted to an analog signal, subjected to frequency modulation FSX based on the corresponding communication standard, and transmitted to the responding modem via the transmission AMP (29) and line transformer (32).

On the other hand, the frequency-modulated analog signal sent by the key input signal of the answering side Basofun is sent to the modem of the calling side, and is sent to the line transformer (29c) and the receiving A M P (2
9b) to the low-speed modulation/demodulation circuit (22).

Here, the analog signal is converted into a digital signal and inputted to the DTE interface (21), and the serial digital signal is converted into a parallel digital signal and inputted to the calling side bus service. As a result, full-duplex communication between the calling side computer and the responding side computer becomes possible, and personal computer communication is realized.

FIG. 7 is a plan view of the modem circuit shown in FIG. 4 mounted on the substrate (2) used in this embodiment, and the mounted circuit elements are given the same reference numerals. The connection between the EPROM chip (4) and the microcomputer (5) is shown by a pass line; however, conductive paths connecting a plurality of circuit elements are omitted because they are complicated.

As shown in FIG. 7, a plurality of fixing pads (3a) to which external lead terminals (12) are fixed are provided at opposing peripheral ends of the substrate (2). A plurality of circuit elements are fixed in the sealed space (14) above the conductive path (3) extending from the fixed pad (3a), and an EPROM chip (4) is fixed on the protruding substrate (2a). EPR is on the refusal board (2)
A plurality of circuit elements including a micro-fitter (5) other than the OM chip (4) are fixed, and (21) is a DT
E interface, (22) (23) are the first and second modulation/demodulation circuits, (TMF generation circuit from April 24th, (23)
9a) is a control switch that controls the EPROM chip (4), (5) is a microcomputer, and (6) is a chip component such as a capacitor.

As shown in FIG. 7, an EPROM chip (4) is fixed to a protruding substrate (2a) exposed from the case material (8) near or adjacent to the micro-fitter (5). By fixing the EPROM chip (4) near or adjacent to the microcomputer (5), the signal line between the microcomputer (5) and the EPROM chip (4), that is, the routing line of the conductive path (3), can be The wiring can be routed at the shortest possible distance, other mounting patterns can be used effectively, and high-density mounting can be achieved. At this time, the socket (15) is exposed from the case material (8) and provided on a protruding board (2a) provided at an arbitrary peripheral end of the board (2).

In addition, the area surrounded by the dashed line is covered with an adhesive sheet for the case material (
8) indicates the area to be fixed.

Figure 8 shows a case material (8) placed on the board (2) shown in Figure 7.
It is a plan view of the completed product of the hybrid integrated circuit device for a modem when the casing material (8) is fixed, and the protruding substrate (
2a) The EPROM chip (4) is coated with resin. That is, all the other elements other than the EPROM chip (4) are sealed within the sealing space (14) formed by the case material (8) and the substrate (2).

According to the present invention, the protruding substrate (2a) is provided at a desired position on the substrate (2), and the conductive path (3) on the protruding substrate (2a) is provided.
), and the microcomputer (5) and other circuit elements (6) are fixed in the sealed space (14) formed by the substrate (2) and the case material (8). Accordingly, a device in which a hybrid integrated circuit and an EFROM are integrated can be provided in an extremely miniaturized manner.

(G) Effects of the Invention As detailed above, according to the present invention, firstly, the substrate (2
), a protruding substrate (2a) is provided on any peripheral edge of the protruding substrate (2a), and an EPROM chip (4) is provided on the conductive path (3) on the protruding substrate (2a).
), it has the advantage that it can be arbitrarily selected around the mounting position of the EPROM chip (4). Therefore, in consideration of the electrical connection with the built-in microcomputer, the EPROM chip (4) and the microcomputer (5) can be read directly with high efficiency, making it unnecessary to route data lines. More specifically, the microcomputer (5) most closely related to the position adjacent to the EPROM chip (4)
As a result, the data lines for exchanging data between the EPROM chip (4) and the microcomputer (5) can be realized with the shortest distance or the easiest layout, reducing loss in packaging density due to data line routing. Can be minimized.

Second, since the EPROM chip (4) is arranged on the protruding substrate (2a) provided at the peripheral end of the substrate (2), it has the advantage that it can be handled as a small-sized hybrid integrated circuit device. Furthermore, by improving the mounting density of the microcomputer and its peripheral circuit elements on the integrated circuit board (2), it is possible to eliminate the conventionally required printed circuit board.

Thirdly, by using a metal substrate as the image integrated circuit board (2), its heat dissipation effect can be greatly improved compared to that of a printed circuit board, which can further contribute to an improvement in packaging density. In addition, by using copper foil (11) as the conductive path (3), the resistance value of the conductive path (3) can be significantly reduced compared to conductive paste.
The mounted circuit can be expanded to the same level or more than a printed circuit board.

Fourth, the microcomputer (5) and its peripheral circuit elements (6) connected to the EPROM chip (4) are placed in a sealed space (14) formed by the case material (8) and the integrated circuit board (2). Since it is assembled in the form of a die or chip, it occupies an extremely small area compared to a conventional printed circuit board molded with resin, and has the advantage of greatly improving packaging density.

Fifth, by substantially matching the peripheral edges of the case material (8) and the integrated circuit board (2), almost the entire surface of the integrated circuit board (2) can be used as a sealed space (14), which reduces the packaging density. Combined with this improvement, an extremely compact hybrid integrated circuit device can be realized.

Sixthly, by providing the EPROM chip (4) on the protruding substrate (2a), the EPROM chip (4) can be freely attached and detached, and the EPROM chip (4) can be freely replaced, erased, and rewritten. have

Seventh, the external leads (12) can be led out from the negative side or the opposite side of the integrated circuit board (2), which has the advantage of realizing a hybrid integrated circuit device with an extremely large number of pins.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing this embodiment, and Fig. 2 is an I-
3 is a sectional view of the board used in this example, FIG. 4 is a block diagram showing the modem used in this example, and 5 is a sectional view of the modem used in this example.
Figure 6 is a block diagram showing the DTE interface of the modem shown in Figure 4, Figure 6 is a block diagram showing the microcomputer of the modem shown in Figure 4, and Figure 7 is the block diagram shown in Figure 4. FIG. 8 is a plan view when the case material is fixed on the substrate shown in FIG. 7; FIGS. 9 and 10 are cross-sectional views showing the conventional EFROM mounting structure. It is. (1)...Hybrid integrated circuit device, (2)...Integrated circuit board, (2a)...Protruding substrate, (3)...Conducting path, (4)...EFROM, (5)... ...Microcomputer, (6) ...Circuit element, (8)
...Case material, (21a)...UV-transparent resin, (21b)...UV-impermeable resin.

Claims (8)

[Claims] (1) An integrated circuit board, a conductive path having a desired pattern formed on the substrate, a non-volatile memory chip connected to the conductive path, and a conductive path on the substrate that is supplied with data from the memory. a microcomputer and its peripheral circuit elements connected to a path, and a case material integrated with the substrate, and the nonvolatile memory chip is fixed to the conductive path on the periphery of the substrate exposed from the case material. The electrodes of the nonvolatile memory chip and the desired conductive path are connected with a bonding wire, the nonvolatile memory chip and the bonding wire are sealed with a resin, and a sealed space is formed by the substrate and the case material. A hybrid integrated circuit device, characterized in that the microcomputer and its peripheral circuit elements are disposed in the microcomputer and its peripheral circuit elements. (2) The hybrid integrated circuit device according to claim 1, wherein a metal substrate whose surface is insulated is used as the integrated circuit board. (3) The hybrid integrated circuit device according to claim 1, wherein copper foil is used as the conductive path. (4) The hybrid integrated circuit device according to claim 1, wherein a resin that transmits ultraviolet rays is used as the resin covering the nonvolatile memory. (5) The hybrid integrated circuit device according to claim 4, further comprising a sealing resin layer that blocks ultraviolet rays provided on the sealing resin layer. (6) The hybrid integrated circuit device according to claim 1, wherein the microcomputer is incorporated in the form of a die on the conductive surface. (7) The hybrid integrated circuit device according to claim 1, wherein a chip resistor or a chip capacitor is used as the peripheral circuit element. (8) The hybrid integrated circuit device according to claim 1, wherein the external lead is led out from a side different from the side where the nonvolatile memory is provided.