JPH02304903A - Platinum temperature sensor - Google Patents
Platinum temperature sensorInfo
- Publication number
- JPH02304903A JPH02304903A JP12416089A JP12416089A JPH02304903A JP H02304903 A JPH02304903 A JP H02304903A JP 12416089 A JP12416089 A JP 12416089A JP 12416089 A JP12416089 A JP 12416089A JP H02304903 A JPH02304903 A JP H02304903A
- Authority
- JP
- Japan
- Prior art keywords
- platinum
- groove
- films
- temperature sensor
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 4
- 238000001962 electrophoresis Methods 0.000 abstract description 3
- 239000000843 powder Substances 0.000 abstract description 3
- 238000005498 polishing Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 abstract 4
- 239000010409 thin film Substances 0.000 abstract 2
- 238000009966 trimming Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は白金温度センサの技術分野 に関するものである。[Detailed description of the invention] The present invention is in the technical field of platinum temperature sensors. It is related to.
上記技術分野に属するものは、 その
−例としてＪ膜白金温度センサ、 厚膜白金温度センサ
及び春線型白金温度セ
ンサ等がある。Examples of devices belonging to the above technical field include J-film platinum temperature sensors, thick-film platinum temperature sensors, and spring wire type platinum temperature sensors.
この種の白金温度センサでは製造工
程中に治具や素子同士のこすれにより
導電体である白金に塩がつき、 これが性能を低下させ
る原因となることかあ
っ た。In this type of platinum temperature sensor, during the manufacturing process, rubbing between jigs and elements can cause salt to adhere to the platinum, which is a conductor, and this can cause a decline in performance.
本発明は溝に白金膜又は白金線をを 形成し製造中に白金に傷のつかない構 造の電子部品を提供するものである。The present invention uses a platinum film or a platinum wire in the groove. Designed to prevent scratches on platinum during formation and manufacturing. The company provides manufactured electronic components.
従来知られていた白金温度センサの 例は第１図に示すようなものであった。 The previously known platinum temperature sensor An example was as shown in FIG.
すなわち第１図において、 １はアル
ミナまたは石英などからなる円筒型絶
総督、 ２は円筒型１１！！！縁管上の外表面上に形成
した導電性を有する白金３原、
４は上記白金膜とリード線を接続する
Ｉｆ！性キャップ、 ６はこのキャンプに一端を固定し
たリード、 ７は抵抗腹が所望の値を示すように前記白
金１膜２
をレーザー光等によってスパイラル状
にトリミングしたトリミング溝、 ８は速進方法により
形成した絶縁性保護塗
装である。That is, in Fig. 1, 1 is a cylindrical shape made of alumina or quartz, etc., and 2 is a cylindrical shape 11! ! ! Conductive platinum 3 and 4 formed on the outer surface of the edge tube connect the platinum film and the lead wire If! 6 is a lead with one end fixed to this camp; 7 is a trimming groove formed by trimming the platinum film 2 into a spiral shape using a laser beam or the like so that the resistance antinode shows a desired value; 8 is a trimming groove formed by a fast-advance method. This is an insulating protective coating formed.
〔本発明が解決しようとする問題点ゴ
従来の構造では白金庄原が露出した
まま作業する工程すなわち電極相は工
程あるいはリード付は工程あるいはト
リミング工程などで白金膜上に傷のつ
くことがあり、 これが電子部品の機能を低下させる原
因となっていた。[Problems to be solved by the present invention] In the conventional structure, the platinum film may be damaged during the process of working with the platinum layer exposed, that is, the electrode phase process, the lead attachment process, or the trimming process. This caused a decline in the functionality of electronic components.
本発明によれば溝に白金皮胚を形成
し、 ガラスで保護することにより必要な白金庄原に傷
のつかない構造の電子
部品を得ることが出来るものである。According to the present invention, by forming a platinum skin in the groove and protecting it with glass, it is possible to obtain an electronic component with a structure in which the necessary platinum skin is not damaged.
本発明は、第２図に示すように絶鐵 性基体上にあらかじめレーザー光等に より作成しようとするスパイラル状の パターンを一定の深さの溝に形成し。 The present invention, as shown in FIG. Apply laser light, etc. to the surface of the substrate in advance. Try to create more spiral-shaped The pattern is formed into grooves of a certain depth.
この基体表面に白金４、膜、 白金厚膜。On the surface of this substrate is platinum 4, a film, and a thick platinum film.
あるいは白金線を速進方法により被着
する。 この素子の表面に絶ａ ｇｌ、ｎ塗装を形成後
、 研磨機等で第２図１１に示す部分を削り落とすこと
により絶縁保
護された白金温度センサを得るもので
あ る。Alternatively, a platinum wire is deposited by a rapid advance method. After forming a coating on the surface of this element, the portion shown in FIG. 2 is scraped off using a polisher or the like to obtain a platinum temperature sensor with insulation protection.
実施例 １ 本発明の実施例をズ１に基づいて以 下に説明する。 Example 1 The embodiments of the present invention are explained below based on the first example. Explained below.
第２〜４図は本発明の一実施例につ いて説明するものである。Figures 2 to 4 show an embodiment of the present invention. This is explained below.
９６％アルミナ焼結体よりなる長さ
５０ｍｍ直径３．１ ｍ ｍの棒１にレーザー光により
＠１００μｍ深さ７０μｍ
のスパイラル状の溝９を第２図のよう
に形成した絶ｒ基体表面上に白金３膜
２を蒸着した後電気泳動法を用いてガ
ラス粉末を被着溶融固化しガラス層１
０を第３図に示すように形成する。A spiral groove 9 of 100 μm and 70 μm in depth was formed using a laser beam on a rod 1 made of a 96% alumina sintered body with a length of 50 mm and a diameter of 3.1 mm as shown in FIG. After depositing the platinum 3 film 2, a glass powder is deposited and melted and solidified using electrophoresis to form a glass layer 10 as shown in FIG.
この素子をセンタレス研磨にて１１
に示す部分を研磨し太さ３ｍｍにした
後、 長さ１０ｍｍに切断する。 この素子の端面に導
電性ペーストを用いてリ
ード線を固着し白金薄ＥＩＬ温度センサを得 た。This element was polished by centerless polishing at the portion shown in 11 to a thickness of 3 mm, and then cut to a length of 10 mm. Lead wires were fixed to the end face of this element using conductive paste to obtain a platinum thin EIL temperature sensor.
実施例 ２ 第５図は春線型白金温度センサの実 施例について説明するものである。Example 2 Figure 5 shows the actual spring wire type platinum temperature sensor. An example will be explained.
実施例１と同様に９６％アルミナ焼
結体よりなる長さ５０ｍｍ直径３．１ｍｍの棒にレーザ
ー光により＠１００μ
ｍ深さ７０μｍのスパイラル状のｍ９
を第２図のように形成した。As in Example 1, a spiral m9 of @100 μm and depth of 70 μm was formed on a rod of 96% alumina sintered body with a length of 50 mm and a diameter of 3.1 mm using a laser beam as shown in FIG.
このスパイラル状の溝に直径４０μ
ｍの白金線３を巻き付ける。 この後電気泳動法を用い
てガラス粉末を被着、
溶融固化しガラスＦ！１０を第３図に示すように形成す
る。A platinum wire 3 with a diameter of 40 μm is wound around this spiral groove. After this, glass powder is deposited using electrophoresis, melted and solidified, and Glass F! 10 is formed as shown in FIG.
この素子をセンタレス研磨にて１１
に示す部分を研磨し直径３ｍｍにした
後、 長さ１０ｍｍに切断する。 この端面に導電性ペ
ーストを用いてリード、線を１着し白金巻線温度センサ
を得た。This element was centerless polished to a diameter of 3 mm at the portion shown in 11, and then cut to a length of 10 mm. A lead and a wire were attached to this end face using conductive paste to obtain a platinum-wound temperature sensor.
本発明は必要とする白金膜又あるい
は白金線を溝の中に形成するため、 白金膜あるいは白
金線同士のこすれまた
はビンセット等による作業で、傷のつ
かない構造になっている。In order to form the required platinum film or platinum wire in the groove, the present invention has a structure in which the platinum film or platinum wires are not damaged by rubbing against each other or by using a bottle set.
本実施例１により作成されたガラス
コート前の素子の外観を検査した結果、溝中の金属皮膜
に傷はなく本発明の効
果は明らかである。As a result of inspecting the appearance of the element produced according to Example 1 before glass coating, there were no scratches on the metal film in the grooves, and the effect of the present invention is clear.
第１図は、 従来の円筒形感温形セン
サの構造図を示す断面図であり第２図、第３ Ｉｌ、
第４図及び第５図は、本発明を示す断面図である。FIG. 1 is a sectional view showing the structure of a conventional cylindrical temperature-sensitive sensor;
4 and 5 are cross-sectional views showing the present invention.
各図中を通じて各符号は、 それぞ九 下記のものを示す。Throughout each figure, each symbol is The following are shown.
１ ｍ気絶縁性基体
２： 金属抵抗膜
３： 金属巻線
４： 導電性キャップ
５： 導電性ペースト
６ ： リ − ド
ア： ト リ ミ ン グ 溝８： 絶
縁性保護塗装
９： スパイラル溝
１０： ガラス層
１１： 切削部分
１１１ｆｆｌ １丁″′第５図1 m insulating substrate 2: Metal resistive film 3: Metal winding 4: Conductive cap 5: Conductive paste 6: Lead door: Trimming groove 8: Insulating protective coating 9: Spiral groove 10: Glass layer 11: Cutting portion 111ffl 1 piece'''Figure 5
Claims (2)
金膜を披着形成し、かつこの白金膜が溝内にのみ存在す
ることを特徴とした白金温度センサ。1. A platinum temperature sensor characterized in that a groove is formed on the surface of an electrically insulating substrate, a platinum film is deposited in the groove, and the platinum film exists only within the groove.
金線を巻き付け、かつこの白金線が溝内にのみ存在する
ことを特徴とした白金温度センサ。2. A platinum temperature sensor characterized in that a groove is formed on the surface of an electrically insulating substrate, a platinum wire is wound around the groove, and the platinum wire exists only within the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12416089A JPH02304903A (en) | 1989-05-19 | 1989-05-19 | Platinum temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12416089A JPH02304903A (en) | 1989-05-19 | 1989-05-19 | Platinum temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02304903A true JPH02304903A (en) | 1990-12-18 |
Family
ID=14878427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12416089A Pending JPH02304903A (en) | 1989-05-19 | 1989-05-19 | Platinum temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02304903A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0716129U (en) * | 1993-08-24 | 1995-03-17 | 三菱重工業株式会社 | Resistance temperature detector element |
| WO2005050745A1 (en) * | 2003-11-20 | 2005-06-02 | Ideal Star Inc. | Columnar electric device and its manufacturing method |
-
1989
- 1989-05-19 JP JP12416089A patent/JPH02304903A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0716129U (en) * | 1993-08-24 | 1995-03-17 | 三菱重工業株式会社 | Resistance temperature detector element |
| WO2005050745A1 (en) * | 2003-11-20 | 2005-06-02 | Ideal Star Inc. | Columnar electric device and its manufacturing method |
| US7495307B2 (en) | 2003-11-20 | 2009-02-24 | Ideal Star Inc. | Columnar electric device |
| JP2009099979A (en) * | 2003-11-20 | 2009-05-07 | Ideal Star Inc | Columnar electric device, and its manufacturing method |
| US7763912B2 (en) | 2003-11-20 | 2010-07-27 | Ideal Star Inc. | Columnar electric device and production method thereof |
| JP2013093585A (en) * | 2003-11-20 | 2013-05-16 | Ideal Star Inc | Columnar electric element and manufacturing method therefor |
| JP2014170948A (en) * | 2003-11-20 | 2014-09-18 | Ideal Star Inc | Structure, and method of manufacturing the same |
| JP2016139815A (en) * | 2003-11-20 | 2016-08-04 | 株式会社イデアルスター | Structure and method of manufacturing the same |
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