JP3429837B2 - Manufacturing method of chip-shaped solid electrolytic capacitor - Google Patents
Manufacturing method of chip-shaped solid electrolytic capacitorInfo
- Publication number
- JP3429837B2 JP3429837B2 JP04705094A JP4705094A JP3429837B2 JP 3429837 B2 JP3429837 B2 JP 3429837B2 JP 04705094 A JP04705094 A JP 04705094A JP 4705094 A JP4705094 A JP 4705094A JP 3429837 B2 JP3429837 B2 JP 3429837B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cathode
- chip
- solid electrolytic
- electrolytic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Description
【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明はチップ状固体電解コンデ
ンサの製造方法に関するものである。
【０００２】
【従来の技術】従来のチップ状固体電解コンデンサは、
特開平５−９００９１号公報の例のように、銀粉体等を
主成分とした陰極導電材料をコンデンサ素子の陰極層上
に分厚く形成し、外装樹脂層に切り込み部を設け、この
切り込み部で外装樹脂層を折り取ることで前記陰極導電
材料を表出し、その後、陽極金属層と陰極金属層を形成
していた。
【０００３】
【発明が解決しようとする課題】しかしながら、前記の
従来のチップ状固体電解コンデンサは、コンデンサ素子
の陰極層上に分厚い陰極導電材料を形成させる為、この
陰極導電材料の厚み分がコンデンサ素子の大きさを制約
する、即ちチップ状固体電解コンデンサの体積有効活用
率を制約し、収納容量の拡大を阻害するという問題を持
っていた。
【０００４】又、陰極導電材料には、銀粉体等を主成分
とする導電性材料を使用する為、高価なチップ状固体電
解コンデンサになるという問題を持っていた。
【０００５】さらに、前記陰極導電材料は、コンデンサ
素子に密着し、かつ、ある程度の硬度を有する為、外装
樹脂を被覆した後、切り込み部を設ける場合や、この切
り込み部で折り取り作業を行う場合、陰極導電材料を介
して、コンデンサ素子にストレスが加わり、チップ状固
体電解コンデンサの漏れ電流、tanδ値を増大させると
いう問題を有していた。
【０００６】本発明は、上記従来の問題点を解決するも
ので、小型で大容量を収納する体積有効活用率が優れた
チップ状固体電解コンデンサを安価に、かつ漏れ電流、
tanδ値の電気特性を劣化させることなく生産すること
のできる製造方法を提供することを目的とするものであ
る。
【０００７】
【課題を解決するための手段】上記目的を達成する為、
本発明のチップ状固体電解コンデンサは、陽極導出線を
具備した弁作用金属からなる陽極体の表面に誘電体酸化
被膜、電解質層、第一のカ−ボン層、陰極層を順次形成
してコンデンサ素子を構成した後、外装樹脂を被覆する
場合、予め、コンデンサの陰極取出し部分に第二のカ−
ボン層を形成しておき、さらに外装樹脂に樹脂層の厚み
が薄い脆弱な部分を設けることで選択的に外装樹指を除
去し、前記第二のカ−ボン層を表出させ、陰極金属層と
陽極金属層を形成したものである。
【０００８】
【作用】上記構成によれば、コンデンサ素子の陰極取出
し部分に第二のカ−ボン層を形成して選択的に外装樹脂
を除去する為、第二のカ−ボン層内又は、第二のカ−ボ
ン層とコンデンサ素子又は外装樹脂との界面で陰極導出
が可能となり、分厚い陰極導電材料を形成する必要が無
く、安価で体積有効活用率の優れたチップ状固体電解コ
ンデンサを得ることが出来る。
【０００９】その上、コンデンサの陰極導出を行う場
合、折り取りなどでのストレスが第二のカ−ボン層で吸
収され、コンデンサ素子への影響がなくなるので、漏れ
電流、tanδの電気特性が劣化することなくチップ状固
体電解コンデンサを生産することができる。
【００１０】
【実施例１】以下に、本発明の一実施例について添付図
面を参照しつつ説明する。
【００１１】図１は、本発明の一実施例におけるチップ
状固体電解コンデンサの断面図を示し、図２は、図１の
製造途中の断面図、図３は、図２の斜視図を示したもの
である。
【００１２】この図２において、コンデンサ素子１は、
陽極導出線２を具備した弁作用金属からなる陽極体の表
面に誘電体酸化被膜、電解質層、第一のカ−ボン層、陰
極層を順次形成したものである。
【００１３】前記コンデンサ素子１を外装するにあた
り、予め、コンデンサ素子１の陽極導出線２が接合する
面の対向面、即ち陰極取出し予定部分に薄い第二のカ−
ボン層３を形成しておき、陽極導出線２が片側に引き出
されるように、トランスファ−モ−ルド方式により、エ
ポキシ樹脂で外装樹脂層４を形成し、かつ、この外装樹
脂４の陰極取り出し部に外装樹脂層厚みの薄い脆弱な部
分５を設けるとともに、この脆弱な部分と接続した分厚
い樹脂余剰部６を設け外装した。
【００１４】次に、前記樹脂余剰部６に力を加え、前記
外装樹脂の脆弱な部分５を境にして選択的に外装樹脂を
除去して、第二のカ−ボン層３を表出させた後、導電性
塗料を用い、前記コンデンサ素子１の露出面と接続する
陰極下地層８ａを構成し、一方、陽極導出線２をサンド
ブラスト等により粗面化して、これと接続する陽極下地
層８ｂを形成した。
【００１５】引き続き、前記陰極下地層８ａと陽極下地
層８ｂ上にメッキ層を形成して、それぞれ陰極金属層９
ａ、陽極金属層９ｂを形成し、チップ状固体電解コンデ
ンサを製作した。
【００１６】尚、上記本発明の一実施例において、樹脂
余剰部６に力を加え、外装樹脂の脆弱な部分５を境にし
て選択的に外装樹脂を除去する場合、第二のカ−ボン層
３がコンデンサ素子１の陰極層上に薄く残るが、純水、
温純水や溶剤洗浄、超音波洗浄を行う、または、これら
の組み合わせにより洗浄することにより第二のカ−ボン
層を除去してもよい。
【００１７】
【発明の効果】以上のように本発明のチップ状固体電解
コンデンサは、外装樹脂層４を被覆した後、陰極取り出
しを行う場合、コンデンサ素子１の陰極取り出し部分に
薄い第二のカ−ボン層３を形成し、かつ、外装樹脂層４
の陰極取出部分に外装樹脂の脆弱な部分５を設けた結
果、陰極取出し時の取り出し作業時のストレスが第二の
カ−ボン層３に吸収されるので、コンデンサ素子１が損
傷することなく容易に陰極取出しすることが可能とな
り、漏れ電流、tanδなどの電気特性を劣化させずにチ
ップ状固体電解コンデンサを製造することができる。
【００１８】その上、従来のように銀粉体等を主成分と
する陰極導電材料７を分厚く形成する必要がなくなるの
で、安価でかつ、体積有効活用率の優れたチップ状固体
電解コンデンサを得ることができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-shaped solid electrolytic capacitor. [0002] A conventional chip-shaped solid electrolytic capacitor is
As in the example of JP-A-5-90091, a cathode conductive material mainly composed of silver powder or the like is formed thick on the cathode layer of the capacitor element, and a cut portion is provided in the exterior resin layer. The cathode conductive material was exposed by breaking off the exterior resin layer, and thereafter, an anode metal layer and a cathode metal layer were formed. However, in the above-mentioned conventional chip-shaped solid electrolytic capacitor, a thick cathode conductive material is formed on the cathode layer of the capacitor element. There is a problem that the size of the element is restricted, that is, the effective volume utilization rate of the chip-shaped solid electrolytic capacitor is restricted, and the expansion of the storage capacity is hindered. In addition, since a conductive material containing silver powder or the like as a main component is used as a cathode conductive material, there is a problem that an expensive chip-shaped solid electrolytic capacitor is formed. Further, since the cathode conductive material is in close contact with the capacitor element and has a certain degree of hardness, it is necessary to provide a notch after coating the exterior resin, or to perform a cutting operation at this notch. In addition, stress is applied to the capacitor element via the cathode conductive material, which causes a problem that the leakage current and the tan δ value of the chip-shaped solid electrolytic capacitor are increased. SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and provides a chip-shaped solid electrolytic capacitor which is small in size, accommodates a large capacity, and has an excellent volume effective utilization rate, at low cost, with low leakage current,
It is an object of the present invention to provide a manufacturing method capable of producing without deteriorating the electrical characteristics of the tan δ value. [0007] In order to achieve the above object,
The chip-shaped solid electrolytic capacitor of the present invention comprises a capacitor formed by sequentially forming a dielectric oxide film, an electrolyte layer, a first carbon layer, and a cathode layer on a surface of an anode body made of a valve metal having an anode lead wire. When the exterior resin is coated after the element has been constructed, a second color is previously placed on the cathode extraction portion of the capacitor.
Forming a carbon layer, and further providing a fragile portion having a thin resin layer in the exterior resin to selectively remove the exterior tree finger, to expose the second carbon layer, and to form a cathode metal. Layer and an anode metal layer. According to the above structure, the second carbon layer is formed at the cathode extraction portion of the capacitor element to selectively remove the exterior resin, so that the second carbon layer is formed in the second carbon layer or The cathode can be led out at the interface between the second carbon layer and the capacitor element or the exterior resin, and there is no need to form a thick cathode conductive material. I can do it. In addition, when the capacitor is led out of the cathode, the stress due to breakage or the like is absorbed by the second carbon layer, and the influence on the capacitor element is eliminated, so that the electrical characteristics of the leakage current and tan δ deteriorate. A chip-shaped solid electrolytic capacitor can be produced without performing. Embodiment 1 An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a cross-sectional view of a solid electrolytic capacitor chip according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of FIG. 1 in the course of manufacturing. FIG. 3 is a perspective view of FIG. Things. In FIG. 2, the capacitor element 1 is
A dielectric oxide film, an electrolyte layer, a first carbon layer, and a cathode layer are sequentially formed on the surface of an anode body made of a valve metal having an anode lead wire 2. When the capacitor element 1 is packaged, a thin second car is previously placed on the surface of the capacitor element 1 opposite to the surface to which the anode lead-out wire 2 is joined, ie, the portion where the cathode is to be taken out.
A resin layer 4 is formed of an epoxy resin by a transfer mold method so that the anode lead wire 2 is drawn out to one side, and a cathode extraction portion of the external resin 4 is formed. In addition, a fragile portion 5 having a thin exterior resin layer was provided, and a thick resin surplus portion 6 connected to the fragile portion was provided for exterior. Next, a force is applied to the resin surplus portion 6 to selectively remove the exterior resin with the brittle portion 5 of the exterior resin as a boundary, thereby exposing the second carbon layer 3. After that, the cathode underlayer 8a connected to the exposed surface of the capacitor element 1 is formed using a conductive paint, while the anode lead wire 2 is roughened by sandblasting or the like, and the anode underlayer 8b connected thereto is formed. Was formed. Subsequently, a plating layer is formed on the cathode underlayer 8a and the anode underlayer 8b,
a, the anode metal layer 9b was formed to produce a chip-shaped solid electrolytic capacitor. In the embodiment of the present invention, when a force is applied to the resin surplus portion 6 to selectively remove the exterior resin at the brittle portion 5 of the exterior resin, the second carbon is used. Layer 3 remains thin on the cathode layer of capacitor element 1, but pure water,
The second carbon layer may be removed by washing with hot pure water, a solvent, or ultrasonic washing, or washing with a combination thereof. As described above, in the chip-shaped solid electrolytic capacitor of the present invention, when the cathode is taken out after coating the exterior resin layer 4, a thin second capacitor is provided on the cathode taking-out portion of the capacitor element 1. Forming the bon layer 3 and the exterior resin layer 4
As a result of providing the fragile portion 5 of the exterior resin at the cathode extraction portion, the stress at the time of the extraction operation at the time of cathode extraction is absorbed by the second carbon layer 3, so that the capacitor element 1 is easily damaged without being damaged. Thus, a chip-shaped solid electrolytic capacitor can be manufactured without deteriorating electrical characteristics such as leakage current and tan δ. In addition, since it is not necessary to form the cathode conductive material 7 mainly composed of silver powder or the like as in the prior art, it is possible to obtain a chip-shaped solid electrolytic capacitor which is inexpensive and has an excellent volume effective utilization rate. be able to.
【図面の簡単な説明】
【図１】本発明法による一実施例を示すチップ状固体電
解コンデンサの断面図。
【図２】本発明法による一実施例を示す製造途中のチッ
プ状固体電解コンデンサの断面図。
【図３】本発明法による一実施例を示す製造途中のチッ
プ状固体電解コンデンサの斜視図。
【図４】従来法によるチップ状固体電解コンデンサの断
面図である。
【符号の説明】
１ コンデンサ素子
２ 陽極導出線
３ 第二のカ−ボン層
４ 外装樹脂層
５ 外装樹脂の脆弱な部分
６ 樹脂余剰部
７ 陰極導電材料
８ａ 陰極下地層
８ｂ 陽極下地層
９ａ 陰極金属層
９ｂ 陽極金属層BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a chip-shaped solid electrolytic capacitor showing one embodiment according to the method of the present invention. FIG. 2 is a cross-sectional view of a chip-shaped solid electrolytic capacitor in the course of manufacture, showing one embodiment according to the method of the present invention. FIG. 3 is a perspective view of a chip-shaped solid electrolytic capacitor in the course of manufacture, showing one embodiment according to the method of the present invention. FIG. 4 is a cross-sectional view of a conventional chip solid electrolytic capacitor. [Description of Signs] 1 Capacitor element 2 Anode lead-out line 3 Second carbon layer 4 Outer resin layer 5 Outer resin fragile portion 6 Resin surplus part 7 Cathode conductive material 8a Cathode underlayer 8b Anode underlayer 9a Cathode metal Layer 9b Anode metal layer
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H01G 9/00 H01G 9/012 H01G 9/04 H01G 9/08 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01G 9/00 H01G 9/012 H01G 9/04 H01G 9/08
Claims (1)
る陽極体の表面に誘電体酸化皮膜、電解質層、第一のカ
−ボン層、陰極層を順次形成してコンデンサ素子を構成
した後、前記コンデンサ素子の陰極取り出し部分に第二
のカ−ボン層を形成しておき、さらに外装樹脂に脆弱な
部分を設けることで選択的に外装樹脂を除去して、前記
第二のカ−ボン層を表出させた後、陽極金属層及び陰極
金属層を形成することを特徴とするチップ状固体電解コ
ンデンサの製造方法。(57) [Claims 1] A dielectric oxide film, an electrolyte layer, a first carbon layer, and a cathode layer are sequentially formed on the surface of an anode body made of a valve metal having an anode lead wire. After forming and forming a capacitor element, a second carbon layer is formed on the cathode take-out portion of the capacitor element, and the exterior resin is selectively removed by providing a fragile portion on the exterior resin. And forming an anode metal layer and a cathode metal layer after exposing the second carbon layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04705094A JP3429837B2 (en) | 1994-03-17 | 1994-03-17 | Manufacturing method of chip-shaped solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04705094A JP3429837B2 (en) | 1994-03-17 | 1994-03-17 | Manufacturing method of chip-shaped solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07263283A JPH07263283A (en) | 1995-10-13 |
| JP3429837B2 true JP3429837B2 (en) | 2003-07-28 |
Family
ID=12764345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04705094A Expired - Fee Related JP3429837B2 (en) | 1994-03-17 | 1994-03-17 | Manufacturing method of chip-shaped solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3429837B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101009850B1 (en) * | 2008-06-17 | 2011-01-19 | 삼성전기주식회사 | Solid electrolytic capacitor and method for preparing the same |
-
1994
- 1994-03-17 JP JP04705094A patent/JP3429837B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07263283A (en) | 1995-10-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3047024B2 (en) | Solid electrolytic capacitors | |
| JP3429837B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JP2003332178A (en) | Capacitor element, its manufacturing method, and capacitor | |
| JP3306202B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JP3396902B2 (en) | Solid electrolytic capacitor and method of manufacturing the same | |
| JP3306200B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JP3503970B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JPH0590094A (en) | Chip type solid electrolytic capacitor | |
| JP3294361B2 (en) | Structure of solid electrolytic capacitor and method of manufacturing solid electrolytic capacitor | |
| JP2778441B2 (en) | Chip type solid electrolytic capacitor and method of manufacturing the same | |
| JPH10233346A (en) | Manufacture of solid electrolytic chip capacitor | |
| JP3429845B2 (en) | Manufacturing method of chip-shaped solid electrolytic capacitor | |
| JPS6222250B2 (en) | ||
| JP3191715B2 (en) | Solid electrolytic capacitor and manufacturing method thereof | |
| JP3175379B2 (en) | Manufacturing method of chip-shaped tantalum solid electrolytic capacitor | |
| JPH06140291A (en) | Solid-state electrolytic capacitor | |
| JPH07135125A (en) | Solid-state electrolytic chip capacitor and its manufacture | |
| JPH07106205A (en) | Solid electrolytic capacitor and manufacture thereof | |
| JPH05226198A (en) | Solid-state chip electrolytic capacitor | |
| JPS6057917A (en) | Method of producing chip type solid electrolytic condenser | |
| JPS59225512A (en) | Chip type solid electrolytic condenser and method of producing same | |
| JPS59115518A (en) | Chip type electronic part and method of producing same | |
| JPH0345524B2 (en) | ||
| JPS6120312A (en) | Method of producing chip type solid electrolytic condenser | |
| JPH10163069A (en) | Manufacture of chip solid electrolytic capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090516 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100516 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110516 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110516 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120516 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120516 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130516 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130516 Year of fee payment: 10 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130516 Year of fee payment: 10 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130516 Year of fee payment: 10 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130516 Year of fee payment: 10 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |