JPH02303833A - Preparation of laminated sheet - Google Patents
Preparation of laminated sheetInfo
- Publication number
- JPH02303833A JPH02303833A JP1125205A JP12520589A JPH02303833A JP H02303833 A JPH02303833 A JP H02303833A JP 1125205 A JP1125205 A JP 1125205A JP 12520589 A JP12520589 A JP 12520589A JP H02303833 A JPH02303833 A JP H02303833A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- polyphenylene oxide
- impregnated
- metal foil
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims abstract description 17
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 15
- 229920006380 polyphenylene oxide Polymers 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 238000000465 moulding Methods 0.000 claims abstract description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 9
- 238000007872 degassing Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 21
- 239000011347 resin Substances 0.000 abstract description 21
- 239000000463 material Substances 0.000 abstract description 8
- 230000037303 wrinkles Effects 0.000 abstract description 6
- 239000000835 fiber Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000001035 drying Methods 0.000 abstract description 3
- 239000004744 fabric Substances 0.000 abstract description 3
- 229920000742 Cotton Polymers 0.000 abstract description 2
- 239000004952 Polyamide Substances 0.000 abstract description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000010425 asbestos Substances 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 239000003999 initiator Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000000178 monomer Substances 0.000 abstract description 2
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- 229920002647 polyamide Polymers 0.000 abstract description 2
- 229920000728 polyester Polymers 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 abstract description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract description 2
- 239000011342 resin composition Substances 0.000 abstract description 2
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 2
- 239000012209 synthetic fiber Substances 0.000 abstract description 2
- 229920002994 synthetic fiber Polymers 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- 239000003365 glass fiber Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000003475 lamination Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
゛本発明は電子機器、電気機器、コンピューター、通信
機器等に用いられる熱硬化ポリフェニレンオキサイド樹
脂積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a thermosetting polyphenylene oxide resin laminate used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来、フェノール樹脂、エポキシ樹脂、不飽和ポリエス
テル樹脂、ポリイミド樹脂等の熱硬化性樹脂やポリエチ
レンテレフタレート樹脂、ボリプ、 チレンテレ７タ
レート樹脂、ポリフェニレンサルファイド樹脂、ポリフ
ェニレンオキサイ）” 樹脂等の熱可塑性樹脂をガラス
布、紙等の基材に含浸した樹脂含浸基材と金属箔とを組
合せた積層体を積層成形するに際してはガス抜きは不要
であった。Conventionally, thermosetting resins such as phenolic resins, epoxy resins, unsaturated polyester resins, and polyimide resins, as well as thermoplastic resins such as polyethylene terephthalate resins, polyethylene terephthalate resins, polyphenylene terephthalate resins, polyphenylene sulfide resins, and polyphenylene oxide resins, have been made into glass. Degassing was not necessary when forming a laminate in which a resin-impregnated base material such as cloth or paper was combined with metal foil.
しかるに熱硬化ポリフェニレンオキサイドｍ 脂を用い
る場合は反応による発生ガス量が多く、金属箔シワ不良
の発生が問題となって−な。However, when thermosetting polyphenylene oxide resin is used, a large amount of gas is generated due to the reaction, and the occurrence of wrinkles in the metal foil becomes a problem.
従来の技術で述べたように熱硬化ポリフェニレンオキサ
イド樹脂積層板においては金属箔シワ不要が多発する。As described in the prior art section, metal foil wrinkles are often unnecessary in thermosetting polyphenylene oxide resin laminates.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは金属箔シワ不良の
な込熱硬化ポリフェニレンオキサイド樹脂積層板の製造
方法を提供することにある。The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a method for producing a heat-cured polyphenylene oxide resin laminate with no metal foil wrinkle defects.
Ｃ問題点を解決するための手段〕
本発明は所要枚数の熱硬化ポリフェニレンオキサイド樹
脂含浸基材の上面及び又は下面に金属箔を配設した積層
体を積層成形するに際し、成形途中でガス抜きをおこな
うことを特徴とする特許の製造方法のため、樹脂から発
生するガスが樹脂含浸基材と金属箔間に滞溜することが
なくなり金属箔シワ不良のな−！ｉｔ層板を得ることが
できたもので、以下本発明の詳細な説明する。Means for Solving Problem C] The present invention provides a method for degassing during the process of laminated molding a laminate in which a required number of thermosetting polyphenylene oxide resin-impregnated substrates are provided with metal foil on the upper and/or lower surfaces. Because of the patented manufacturing method, gas generated from the resin does not accumulate between the resin-impregnated base material and the metal foil, eliminating wrinkles in the metal foil! The present invention will now be described in detail.
本発明に用いる熱硬化ポリフェニレンオキサイド樹脂含
浸基材は、ポリフェニレンオキサイド、架橋性のポリマ
ーおよび又はモノマーおよび開始剤等からなるポリフェ
ニレンオキサイド樹脂組成物をガラス、アスベスト等の
無機繊維やポリエステル、ポリアミド、ポリビニルアル
コール、ポリアクリル等の有機合成繊維や木綿等の天然
繊維からなる織布、不織布、マット或は紙又はこれらの
組合せ基材に樹脂量が４０〜６０重量チ（以下単に憾と
記す）になるように含浸し必要に応じて乾燥ししたもの
である。金属箔としては銅、アルミニウム、鉄、ステン
レス鋼、ニーＪケル、亜鉛等の単独、合金、複合箔で必
要に応じて片面に接着剤層を設けたものである。成形途
中のガス抜きは好ましくは樹脂含浸基材の樹脂が溶融中
におこなうことが望ましく必要に応じて複数回おこなう
ことができるものである。積層成形としてはプレス法、
多段プレス法、マルチロール法、ダブルベルト法、連続
無圧法等が用いられ任意で特に限定するものではない。The thermosetting polyphenylene oxide resin-impregnated base material used in the present invention is a polyphenylene oxide resin composition consisting of polyphenylene oxide, a crosslinkable polymer and/or a monomer, an initiator, etc., and inorganic fibers such as glass, asbestos, polyester, polyamide, polyvinyl alcohol. , woven fabrics, non-woven fabrics, mats, paper, or combinations thereof made of organic synthetic fibers such as polyacrylic fibers, natural fibers such as cotton, etc., so that the amount of resin is 40 to 60 weight parts (hereinafter simply referred to as "regret"). It is impregnated with water and dried as necessary. The metal foil may be a single, alloy, or composite foil made of copper, aluminum, iron, stainless steel, aluminum, zinc, etc., with an adhesive layer provided on one side if necessary. Degassing during molding is preferably performed while the resin of the resin-impregnated base material is melting, and can be performed multiple times as necessary. For lamination molding, press method,
A multi-stage press method, a multi-roll method, a double belt method, a continuous pressureless method, etc. may be used without any particular limitation.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
ポリフェニレンオキサイド１００重量部（以下単に部と
記す）に対し、スチレンブタジェンコポリマー１００部
、トリアリルイソシアヌレート２００部、バーへキシン
２５部（Ｓ本油脂株式会社８ｉり、 ｌ−シェフ１０
００部を加えた樹脂フェスを厚さ０．２龍のガラス布に
乾燥後樹脂量が５０チになるように含浸、乾燥して得た
樹脂含浸基材７枚の上下面に厚さ０．０３５ｆｌＯ銅箔
を夫々配設した積層体を成形圧力１０Ｋｑ／ｄ、１９５
℃で２０分間積層成形後、ｆｆｘ抜きをおこな−、後再
度ｌＯ職／ｄ 、１９５℃で４０分間積層成形して厚さ
１．６ｆｉの両面銅張積層板を得た。Example 100 parts by weight of polyphenylene oxide (hereinafter simply referred to as "parts"), 100 parts of styrene-butadiene copolymer, 200 parts of triallyl isocyanurate, 25 parts of verhexine (Shon Yushi Co., Ltd. 8i, L-Chef 10)
After drying, a glass cloth with a thickness of 0.2 mm is impregnated with a resin face containing 0.0 parts of resin so that the amount of resin becomes 50 mm after drying, and then dried to a thickness of 0.2 mm on the upper and lower surfaces of 7 resin-impregnated substrates. A laminate with 035flO copper foils placed thereon was molded under a molding pressure of 10 Kq/d, 195
After lamination molding at 195 DEG C. for 20 minutes, ffx extraction was carried out, and then lamination molding was carried out again at 195 DEG C. for 40 minutes to obtain a double-sided copper-clad laminate having a thickness of 1.6 fi.
比較例
実施例と同じ積層体を成形圧力１０に９／ｄ、１９５℃
で６０分間積層成形して厚さ１．６ｆｌの両面銅張積層
板を得たが、途中ガス抜きはしなかった・実施例及び比
較例の積層板の性能は第１表のようである。Comparative Example The same laminate as in Example was molded at a pressure of 9/d at 195°C.
A double-sided copper-clad laminate with a thickness of 1.6 fl was obtained by lamination molding for 60 minutes, but no degassing was performed during the process.The performance of the laminates of Examples and Comparative Examples is shown in Table 1.
本発明は上述した如く構成されてｂる。特許請求の範囲
に記載した構成を有する積層板の製造方法においては金
属箔シワ不良を大巾に低下させる効果がある。The present invention is constructed as described above. The method for manufacturing a laminate having the structure described in the claims has the effect of greatly reducing the occurrence of wrinkle defects in metal foil.
Claims (1)
含浸基材の上面及び又は下面に金属箔を配設した積層体
を積層成形するに際し、成形途中でガス抜きをおこなう
ことを特徴とする積層板の製造方法。(1) Manufacture of a laminate characterized by degassing during the process of laminated molding a laminate having a required number of thermosetting polyphenylene oxide resin-impregnated substrates with metal foil arranged on the upper and/or lower surfaces. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1125205A JPH02303833A (en) | 1989-05-18 | 1989-05-18 | Preparation of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1125205A JPH02303833A (en) | 1989-05-18 | 1989-05-18 | Preparation of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02303833A true JPH02303833A (en) | 1990-12-17 |
Family
ID=14904503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1125205A Pending JPH02303833A (en) | 1989-05-18 | 1989-05-18 | Preparation of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02303833A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6369633A (en) * | 1986-09-11 | 1988-03-29 | 松下電工株式会社 | Electrical laminated board |
| JPS63118239A (en) * | 1986-11-07 | 1988-05-23 | Kanegafuchi Chem Ind Co Ltd | Continuous preparation of laminated sheet for electrical use |
-
1989
- 1989-05-18 JP JP1125205A patent/JPH02303833A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6369633A (en) * | 1986-09-11 | 1988-03-29 | 松下電工株式会社 | Electrical laminated board |
| JPS63118239A (en) * | 1986-11-07 | 1988-05-23 | Kanegafuchi Chem Ind Co Ltd | Continuous preparation of laminated sheet for electrical use |
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