JPH02301705A - Method for assembling lens and optical semiconductor assembly - Google Patents

Abstract

PURPOSE:To increase the degree of optical coupling and to obtain stability by moving and adjusting a holder outer cylinder finely in an X-Y direction by using clamping bodies which are fixed to an arm plate across an elastic body. CONSTITUTION:While the edge of the flange 11a of the holder outer cylinder 11 is pressed by a couple of clamping bodies 40 which are fixed to the arm plate 21 across the elastic body 41, an X-Y fine adjusting device 20 is driven to slides the flange 11a on the surface 2a of a base 1. The lower end surface of the flange 11a, therefore, contacts the surface 2a of the base 1 and there is no gap left. In this state, the holder outer cylinder 11 is welded to a top surface plate part 2 with a laser and then a welding defect is prevented from being generated. Consequently, the lens and photoconductor assembly which has the high degree of optical coupling and is stable is obtained.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a method for assembling a lens/optical semiconductor assembly in which an optical semiconductor element such as a light emitting element or a light receiving element is combined with a lens so as to optically couple the lens, the optical semiconductor element, etc. The objective is to provide a stable lens/optical semiconductor assembly with a high degree of optical coupling, in which the relative position of A lens holder consisting of a holder outer cylinder having a threaded hole into which the cylinder is screwed, and a lens holder mounted at a desired position below the top plate of the base on the center line of a through hole that vertically passes through the top plate of the base. The cylindrical part of the holder outer cylinder is loosely inserted into the through hole, and the lens holder is inserted into the lens holder with the lower end surface of the flange of the holder outer cylinder in contact with the surface of the upper plate part. When assembling a lens/optical semiconductor assembly that is fixed to a base so that the optical semiconductor element and the lens are optically coupled, a pair of The position of the lens in the X-Y direction is adjusted by fixing the clamping body and driving the X-Y fine movement device while pressing the edge of the flange of the holder outer cylinder with the tapered surface of the lower end of the clamping body. After adjusting the position of the lens in the Z direction by screwing the holder inner cylinder using an adjustment driver, attach the holder outer cylinder to the upper plate part and the holder inner cylinder to the holder. The configuration is such that each of the outer cylinders is laser welded.

[Industrial Application Field] The present invention relates to a method for assembling a lens/optical semiconductor assembly in which an optical semiconductor element such as a light emitting element or a light receiving element and a lens are combined so as to be optically coupled.

In recent years, a lens/optical semiconductor assembly as shown in FIG. 3 has been provided.

In Fig. 3, 1 is an eave-shaped top plate part 2 on the top of the main body.
This is a base made of stainless steel or the like, which protrudes horizontally, and is provided with a through hole 3 having a desirably large inner diameter and extending vertically through the upper plate part 2 at the center of the upper plate part 2.

Reference numeral 5 denotes optical semiconductor elements such as a light emitting element and a light receiving element mounted on the element mounting board 6. One vertical side of the element mounting board 6 is laser welded to the side wall of the base 1 so that the light emitting surface (or light receiving surface) of the optical semiconductor element 5 substantially coincides with the center line of the through hole 3, and the upper surface plate part It is fixed below 2.

Reference numeral 10 denotes a lens holder made of stainless steel or the like, which is composed of a holder outer cylinder 11 and a holder inner cylinder 12 in which a lens 15 is press-fitted into the lower part of an axial hole 12a.

The holder outer cylinder 11 is a cylinder having a slotted hole passing through the axis, and the outer diameter of the cylinder portion is smaller than the inner diameter of the through hole 3. Further, a flange lla is provided on the upper end surface of the cylindrical portion of the holder outer cylinder 11.

The holder inner cylinder I2, which has threads carved on its outer peripheral surface, is inserted into the axial center of the holder outer cylinder 11 by having its threaded portion screwed into a screw hole of the holder outer cylinder 11.

The lens holder 10 is attached to the base 1 by loosely inserting the cylindrical part of the holder outer cylinder 11 into the through hole 3 of the base 1 and bringing the lower end surface of the flange Ila into contact with the surface 2a of the upper plate part 2. Ru.

After adjusting the position of the lens 15 so that the lens 15 and the optical semiconductor element 5 are optically coupled, the holder outer cylinder 11 is laser welded to the upper plate part 2 (point M in the figure), and the holder inner cylinder 12 is It is assembled by laser welding (point N in the figure) to the holder outer cylinder 11.

Therefore, when the optical semiconductor element 5 is a light emitting element, the light emitted from the light emitting element is expanded into a substantially conical shape, and is converted into a parallel beam by the lens 15 and travels straight through an optical element (for example, an optical fiber), which is not shown. Nizu- Inject.

In addition, when the optical semiconductor element 5 is a light receiving element, the light beam projected onto the lens 15 from the optical element side (not shown) is
The lens 15 focuses the light onto the light receiving surface of the light receiving element.

To assemble the lens/optical semiconductor assembly as described above, an X-Y fine movement device is used to move and adjust the lens holder 10 on the top plate 2 of the base 1, and the holder inner tube 12 is moved vertically. An adjustment driver is used to adjust the movement.

[Conventional technology]

FIG. 4 is a sectional view showing a conventional assembly method.

In FIG. 4, reference numeral 25 denotes an elongated cylindrical adjustment driver with a screw threaded on its outer circumferential surface, and has a through hole 26 in its axis through which the light beam passes. Then, on the top of the threaded portion 27, so that the adjustment driver 25 can be rotated,
The head is shaped so that it can be easily held by hand.

In addition, the outer diameter of the tip of the threaded portion 27 of the adjustment driver 25 is made small so that it can be inserted into the threaded hole of the holder outer cylinder 11, and a shear provided on the upper end surface of the holder inner cylinder 12 is added to the tip. It is equipped with a single character-shaped cutting edge that engages with the split.

21 is an arm plate connected to the X-Y fine movement device 20, and by driving the x-Y fine movement device 20, the surface parallel to the surface 2a of the base 1 can be moved in the Move minutely in the Y-axis direction.

A screw hole 21a is provided at a desired position on the arm plate 21, a screw portion 27 is screwed into the screw hole 21a, and the adjusting driver 25 is mounted vertically on the arm plate 21 with the cutting edge facing downward.

On the other hand, 31 is a fixed clamping plate whose lower end surface is approximately Z-shaped, and 32 is a movable clamping plate 32 whose lower end surface is approximately Z-shaped.

The fixed clamping plate 31 is fixed to the lower surface of the arm plate 21 so as to protrude perpendicularly thereto.

On the fixed clamping plate 31, parallel to each other and horizontally,
An operation bar 33 and a guide bar 35 are attached.

= 7- On the other hand, the movable clamping plate 32 is located on the opposite side of the fixed clamping plate 31 with the adjustment driver 25 in between, and the guide bar 35 passes freely through the hole, so that the movable clamping plate 32 faces the fixed clamping plate 31 vertically. and is supported.

The operation bar 33 is inserted loosely horizontally into a hole provided in the fixed clamping plate 31, and is connected to the fixed clamping plate 3 by a ring fitted into the head and neck.
1 is mounted on the fixed clamping plate 31.

Then, the threaded portion of the operation bar 33 is screwed into the threaded hole of the movable clamping plate 32.

Therefore, by rotating the operation bar 33, the movable clamping plate 32 is drawn parallel to the fixed clamping plate 31,
Or be separated.

Therefore, by pulling the movable clamping plate 32, the Z-shaped end surfaces of the fixed clamping plate 31 and the movable clamping plate 32 clamp the outer peripheral portion of the flange of the lens holder 10.

To assemble a lens/optical semiconductor assembly using the apparatus configured as described above, first, the cylindrical part of the holder outer cylinder 11 is loosely inserted into the through hole 3 of the base 1, and the flange lla of the holder outer cylinder 11 is inserted. The lens holder 10 is mounted on the base 1 with its lower end surface in contact with the surface 2a of the diagonal plate 2.

Then, the lens/optical semiconductor assembly is placed in the X-Y fine movement device 20.

The operation bar 33 is operated to sandwich the outer circumference of the flange lla of the lens holder 10 between the pair of fixed clamping plates 3■ and the movable clamping plate 32.

Further, the adjusting driver 25 is screwed by hand to engage its cutting edge with the holder inner cylinder 12.

On the other hand, when the optical semiconductor element 5 is a light emitting element, the light emitting element is brought into a light emitting state, and the adjustment driver 2
A detector 30 for measuring light output is set above 5.

Then, by driving the X-Y fine movement device 20, the lens holder 10 is slid on the surface 2a, and the X-Y movement of the lens 15 is moved.
Adjust the position in the Y direction.

Further, the position of the lens 15 in the Z direction is adjusted by rotating the adjustment driver 25 by hand to move the holder inner cylinder 12 in the vertical direction.

Then, the lens position where the optical power received by the detector 30 becomes the maximum value is determined, and in this state, the flange 11a is laser welded and fixed to the upper plate portion 2.

Next, adjustment driver 25. That is, the assembly of the lens/optical semiconductor assembly is completed by lifting the arm plate 21 upward and fixing the upper end surface of the holder inner cylinder 12 to the threaded hole of the holder outer cylinder 11 by laser welding.

In addition, when the optical semiconductor element 5 is a light receiving element, a parallel beam of light is projected into the through hole 26 of the adjustment driver 25, and a detector for measuring the photocurrent of the light receiving element is connected to the light receiving element. Then, using the same procedure as for the light emitting element, attach the lens holder 1.
0 to the base 1 and the holder inner cylinder 12 to the boulder outer cylinder 11 by laser welding.

Further, the gap between the optical semiconductor element 5 and the lens 15 after adjustment is as small as about 20 μm.

[Problem to be solved by the invention]

However, in the conventional assembly method described above, the flange lla of the lens holder 10 is held between a pair of fixed holding plates 31 and a movable holding plate 32, and is slid on the surface 2a of the base 1.

Therefore, there is a slight gap between the surface 2a and the lower end surface of the flange lla, and the boulder outer cylinder 11 is laser welded to the base 1 in this state.

Therefore, due to the existence of this gap, welding defects such as welding cracks occur, and the lens boulder 10 is insufficiently fixed, the relative positions of the lenses 15 are shifted, and the degree of optical coupling is reduced. There was a problem.

The present invention was created in view of these points, and an object of the present invention is to provide a stable lens/optical semiconductor assembly in which the relative position between the lens and the optical semiconductor element is secured, the degree of optical coupling is high, and the optical semiconductor element is stable. .

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a holder inner cylinder 12 in which a lens 15 is pushed and inserted into the shaft center hole L2a, and a shaft as illustrated in FIG. A lens holder 1 consisting of a holder outer cylinder 11 having a threaded hole in the center into which a boulder inner cylinder 12 is screwed.
0 and an optical semiconductor element 5 mounted at a desired position below the top plate part 2 on the center line of the through hole 3 vertically penetrating the top plate part 2 of the base 1. The lens holder 10 is loosely inserted into the through hole 3, and the lens holder 10 is fixed to the base 1 with the lower end surface of the flange of the holder outer cylinder 11 in contact with the surface of the upper plate part 2, and the optical semiconductor element 5 and A lens/optical semiconductor assembly configured to be optically coupled with the lens 15,
Assemble as shown below.

A pair of clamping bodies 40 are fixed to the lower surface of the arm plate 21 of the xx-y fine movement device 20 via an elastic body 41.
The flange Il of the holder outer cylinder 11 is connected to the tapered surface of the lower end of the
By driving the X-Y fine movement device 20 while pressing the edge of the lens 15, the position of the lens 15 in the χ-Y direction is adjusted.

In addition, by screwing the holder inner cylinder 12 using the adjustment driver 25 screwed onto the arm plate 21, the Z of the lens 15 can be adjusted.
Adjust the position of the direction.

After that, the holder outer cylinder 11 is attached to the upper plate part 2, and the holder inner cylinder 1 is attached to the top plate part 2.
2 shall be laser welded to the holder outer cylinder 11, respectively.

[Effect]

As described above, the pair of clamping bodies 40 fixed to the arm plate 21 via the elastic body 41 are used to hold the flange ll of the holder outer cylinder 11.
While pressing the edge of a, the X-Y fine movement device 20 is driven to slide the flange lla on the surface 2a of the base 1.

Therefore, the lower end surface of the flange lla is the surface 2 of the base 1.
It is in close contact with a and there is no gap. Since the holder outer cylinder 11 is laser welded to the top plate part 2 in this state, there is no possibility of welding defects occurring.

That is, a stable lens/optical semiconductor assembly with a high degree of optical coupling can be obtained.

〔Example〕

The present invention will be specifically described below with reference to the drawings. Note that the same reference numerals refer to the same objects throughout the plan.

The first part is a sectional view of an embodiment of the method of the present invention, and FIG. 2 is a perspective view of a main part of the embodiment of the method of the present invention.

In FIG. 1, an elongated cylindrical adjusting driver 25 with a screw threaded on its outer peripheral surface is provided with a through hole 26 at its axis through which a light beam passes. Further, the tip of the screw portion 27 of the adjustment driver 25 is provided with a single-letter-shaped cutting edge that engages with a slot provided on the upper end surface of the holder inner cylinder 12 of the lens holder 10 of the lens/optical semiconductor assembly.

By screwing the adjustment driver 25 into a threaded hole in the arm plate 21 connected to the x-y fine movement device 20, it can be mounted vertically on the arm plate 21 with the cutting edge facing downward.

41 is a cylindrical elastic body 4 made of elastic rubber, for example.
1, which is fixed to the lower surface of the arm plate 21 with adhesive so that the adjustment driver 25 passes through the center.

Reference numeral 40 denotes a substantially prismatic holding body constructed by vertically cutting a cylinder made of metal whose plan view is equal to the outer diameter of the elastic body 41, and as shown in FIG. The lower end surface is formed into a tapered surface 40a when viewed from the side.

A pair of clamping bodies 40 configured in this way are connected to the tapered surface 4
0a faces inside and is fixed to the lower end surface of the elastic body 41 using an adhesive, symmetrically with respect to the axis of the elastic body 41.

To assemble a lens/optical semiconductor assembly using the apparatus configured as above J, first, the cylindrical part of the holder outer cylinder 11 is loosely inserted into the through hole 3 of the base 1, and the flange lla of the holder outer cylinder 11 is inserted. The lens holder 10 is mounted on the base 1 with the lower end surface of the lens holder 10 in contact with the surface 2a of the upper plate portion 2.

Then, the lens/optical semiconductor assembly is set in the x-y fine movement device 20.

Next, the arm plate 21 is lowered, and the tapered surfaces 40a of the pair of clamping bodies 40 are used to clamp and press the edge of the flange lla of the holder outer cylinder 11, so that the lower end surface of the flange 1.1a is pressed onto the upper plate portion 2. is brought into elastic contact with the surface 2a.

At this time, the adjustment driver 25 screwed onto the arm plate 21
If the height of the adjustment driver 25 is set in advance so that the cutting edge engages with the slot in the holder inner cylinder 12, subsequent adjustment work will be facilitated.

Then, while observing the degree of optical coupling with the detector 30,
Drive the fine movement device 20 to move the lens holder 10 to the surface 2a.
The upper part is slid to adjust the position of the lens 15 in the X-Y direction, and the axes of the optical semiconductor element 5 and the lens 15 are aligned.

Further, the adjustment driver 25 is rotated by hand to move the holder inner cylinder 12 in the vertical direction within the screw hole of the holder outer cylinder 11 to adjust the position of the lens 15 in the Z direction.
The focal position of the light emitting surface (or light receiving surface) of the optical semiconductor element 5
match.

When the adjustment work is completed, hold the lens holder 10 with the holding body 40.
While pressed, a laser is irradiated to the lower part of the outer peripheral surface of the flange Ila to laser weld and fix the holder outer cylinder 11 to the upper plate part 2.

Next, adjustment driver 25. That is, the arm plate 21 is lifted upward, and the upper end surface of the holder inner cylinder 12 is laser welded and fixed to the threaded hole portion of the holder outer cylinder 11, thereby completing the assembly of the lens/optical semiconductor assembly.

As described above, the x-Y fine movement device 20 is driven while pressing the edges of the flanges ll and lla of the holder outer cylinder 11 with the pair of clamping bodies 40 fixed to the arm plate 21 via the elastic body 41. , the lens holder 10 is placed on the surface 2. of the base 1. Since the IJ2 is slid, the lower end surface of the flange Ila is in elastic contact with the surface 2a of the base 1 and in close contact with it.

Therefore, there is no gap between the lower end surface of the flange lla and the surface 2a of the upper plate portion 2, and there is no possibility of welding defects occurring.

Further, since the elastic body 41 is provided, the force with which the clamping body 40 presses the flange lla is neither too weak nor too strong (and adjustment movement in the X-Y direction is performed smoothly).

Note that the elastic body 41 is not limited to rubber; for example, a plate spring may perform the same function.

〔Effect of the invention〕

As explained above, the present invention is a method for assembling a lens/optical semiconductor assembly in which the holder outer cylinder is finely moved and adjusted in the X-Y direction using a clamping body fixed to an arm plate via an elastic body. Therefore, the resulting lens/optical semiconductor assembly has excellent practical effects in that there is no fear that the relative position between the lens and the optical semiconductor element will shift, and the degree of optical coupling is high and stable.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of an embodiment of the method of the present invention, Fig. 2 is a perspective view of the main part of the embodiment of the method of the present invention, Fig. 3 is a cross-sectional view of a lens/optical semiconductor assembly, and Fig. 4 is a cross-sectional view of an embodiment of the method of the present invention. FIG. 2 is a cross-sectional view showing a conventional method. In the figure, ■ is the base, 2 is the top plate, 3 is the through hole,
5 is an optical semiconductor element, 6 is an element mounting board, 1
0 is a lens holder, 11 is a holder outer cylinder, lla is a flange, 12 is a holder inner cylinder, 12a is an axial hole,
15 is a lens, 20 is an x-y fine movement device, 21 is an arm plate, 25 is an adjustment driver, 26 is a through hole, 30 is a detector, 40 is a clamping body, and 41 is an elastic body. fertilizer d ma -

Claims (1)

[Claims] A holder having a holder inner cylinder (12) in which a lens (15) is pushed and inserted into an axial center hole (12a), and a screw hole in the axial center into which the holder inner cylinder (12) is screwed. On the center line of the lens holder (10) consisting of an outer cylinder (11) and the through hole (3) that vertically passes through the upper plate part (2) of the base (1), below the upper plate part (2). The optical semiconductor element (
5), the cylindrical part of the holder outer cylinder (11) is loosely inserted into the through hole (3), and the lower end surface of the flange of the holder outer cylinder (11) is brought into contact with the surface of the upper plate part (2). While in contact with the lens holder (1
0) on the base (1), and the optical semiconductor element (5)
When assembling the lens/optical semiconductor assembly configured to optically couple the lens (15) and the lens (15), an elastic body (41) is attached to the lower surface of the arm plate (21) of the
A pair of clamping bodies (40) are fixed through the clamping bodies (40).
0) while pressing the edge of the flange of the holder outer cylinder (11) with the tapered surface of the lower end of the X-Y fine movement device (20).
The position of the lens (15) in the X-Y direction is adjusted by driving the holder inner cylinder (12) using the adjustment driver (25).
After adjusting the position of the lens (15) in the Z direction by screwing the (11) A method for assembling a lens/optical semiconductor assembly, which comprises performing laser welding.