JPH02299792A - Laser beam machining method and laser beam machine - Google Patents

Abstract

PURPOSE:To simultaneously perform precise laser beam machining to plural pieces of plates by irradiating plural plates superposed and allowed to adhere closely on a work table with a laser light through a laser beam machining head. CONSTITUTION:Plural pieces of plates W are superposed and placed on a work table 7. Subsequently, in a laser beam machining part of the table 7, plural pieces of superposed plates W are allowed to adhere closely to each other by a plate adherence means 27. Next, a laser beam machining head 17 of a laser beam machine 1 provided on the upper position of the table 7 is moved in the X axis, Y axis and Z axis directions relatively against the plate W supported by the table 7. Simultaneously, plural pieces of superposed plates W are irradiated with a laser light through the laser beam machining head 17. In such a way, laser beam machining can be performed simultaneously to plural pieces of superposed plates W.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing method and a laser processing machine that can simultaneously perform laser processing on a plurality of stacked plate materials.

(Prior Art) In conventional laser processing, only one plate is supported in a plane on a work table, and laser processing is performed on each plate one by one. That is, a plurality of stacked plate materials were not supported on a work table and laser processing was not performed on the plurality of plate materials at the same time. this is,
This is because gaps tend to occur between the stacked plate materials, and precise laser processing cannot be performed in a state where gaps occur.

(Problem to be solved by the invention) However, when performing the same processing on a large number of plates, it is necessary to support the plates one by one on a work table and process them one by one using a laser processing head. I had to. Therefore, when the laser processing work is troublesome, there is a problem that the laser processing time becomes long.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, it is an object of the present invention to provide a laser processing method and a laser processing machine that can perform laser processing on a plurality of plate materials at the same time.

In order to solve the above-mentioned conventional problems, in the present invention, a plurality of stacked plates are supported on a work table, and in the laser processing section on the work table,
A plurality of stacked plates are brought into close contact with each other, and the laser processing head is moved relative to the X-axis and y-axis with respect to the plurality of stacked plates.
While moving in the axial and biaxial directions, the laser beam is irradiated onto multiple stacked plate materials via the laser processing head,
Laser processing is performed on multiple stacked plates at the same time.

In addition, a work table that supports a plurality of stacked plates is provided, and a laser processing head that irradiates laser light is placed above the work table relative to the X-axis and the stack of plates. In addition to being movable in the y-axis and Z-axis directions, the laser processing section of the work table is provided with plate material adhesion means for closely adhering a plurality of stacked plate materials.

(Function) In the above configuration, first, a plurality of stacked plates are supported on the work table. Next, in the laser processing section of the work table, the plurality of stacked plates are brought into close contact with each other by the plate material adhesion means. Then, the laser processing head installed above the work table is moved along the X-axis, Y-axis, and Z-axis relative to the plate material supported by the work table.
While moving in the axial direction, a plurality of stacked plate materials are irradiated with laser light via the laser processing head. This makes it possible to perform laser processing on a plurality of stacked plate materials at the same time.

(Example) Hereinafter, an example of the present invention will be described based on the drawings.

Referring to FIGS. 1, 2, and 3, the laser processing machine 1
is the front-rear direction (left-right direction in Figures 1 and 3, second
In other words, the base frame 3 extending in the y-axis direction
It is provided with a gate-shaped frame 5 erected on the rear side.

The base frame 3 is provided with a work table 7 for supporting the plate material W, and the work table 7 is provided with a large number of free bearings 9. therefore,
The plate material W can be supported on the pass line via a large number of free bearings 9.

In order to move and position the plate material W in the y-axis direction, the work table 7 is provided with a moving positioning device 11.

More specifically, the y-axis moving body 13 of the movable positioning device 11 is mounted on the work table 7 in the left-right direction (in FIG. 1, the front and back directions toward the page, in FIG. 2, the left-right direction, and in FIG. 3, the y-axis moving body 13 direction), in other words, it is provided extending in the X-axis direction.

The y-axis moving body 13 includes a y-axis guide (not shown), a y-axis ball screw (not shown), and a y-axis drive motor (not shown).
It can be moved appropriately in the y-axis direction via the y-axis drive motor. Further, the y-axis moving body 13 is provided with a clamp device 15 for gripping the plate material W, the position of which can be adjusted in the left-right direction.

With the above configuration, the plate material W on the work table 7 is gripped by the clamp device 15. and a y-axis ball screw,
Operate the y-axis drive motor appropriately to move the y-axis moving body 13 to y.
It can be moved in the axial direction and the clamping device 15
It is possible to move the plate material W gripped by the y-axis direction.

A processing head 17 for irradiating laser light is provided on the gate-shaped frame 5 so as to be movable in the X-axis direction and two-axis directions (up and down in this embodiment).

More specifically, an X-axis guide 19 extending in the y-axis direction is provided on the horizontal portion 5a of the gate-shaped frame 5, and the y-axis guide 19 is provided with an X-axis guide 19 that is movable in the X-axis direction via a sliding member 21. An X-axis moving body 23 is provided. The X-axis moving body 23 includes an X-axis ball screw (not shown), an x-axis drive motor (
(not shown) in the X-axis direction. The X-axis moving body 23 is provided with a laser processing head 17 movable in two axial directions. Note that as the plate material W gripped by the clamp device 15 moves in the y-axis direction,
The laser processing head 17 is capable of moving in the y-axis direction relative to the plate material W.

Note that a dust collector 25 is provided at the processing position of the laser processing section in the base frame 3.

As understood from the above configuration, the laser processing head 1
7 is moved in the y-axis direction relative to the plate material W gripped by the clamp device 15, and moved in the It is capable of laser processing.

At a position below the laser processing head 17 on the work table 7, in other words, in the laser processing section of the work table 7, a plate material adhesion means 27 for bringing a plurality of stacked plate materials W into close contact is provided.

Specifically, the base frame 3 is rotatably provided with a plurality of drive rotors 29 that constitute a part of the plate material adhesion means 27 extending in the X-axis direction, and are rotatably provided on the base frame 3. In this case, a driven rotary body 33 is rotatably provided vertically facing the driving rotary body 29. The drive rotor 29 is operatively connected to a drive motor (not shown), and the top of the side surface of the drive rotor 29 is located at approximately the same height as the pass line. Drive rotary body 29, driven rotary body 33
is a rotating body such as a roll, and may be a rotating body other than a roll.

The drive rotor 29 is provided with springs 35 at appropriate positions as shown in FIG. 2 in order to bring the plurality of stacked plates W that have entered the gap between the driven rotor 33 and the driven rotor 33 into close contact with each other. It is biased downward. Therefore, a plurality of stacked plate materials W are connected to the driving rotary body 21 and the driven rotary body 35.
When the driven rotor 33 enters between the spring 35 and
The plurality of stacked plates W are pressed by the driving rotor 29 and the driven rotor 33, and the plurality of stacked plates W are brought into close contact with each other.

Note that instead of pressing the plurality of stacked plates W through the urging force of the spring 35, the driven rotary body 33 is moved up and down by a fluid pressure cylinder (not shown) to press the plurality of stacked plates W. There is no harm in letting it happen.

Next, the outline of this embodiment will be explained including its operation.

A plurality of stacked plate materials W are supported on a work table 7, and the plurality of stacked plate materials W are positioned at predetermined positions on the work table 7.

Then, the clamp device 15 is appropriately operated to grip the ends of the plurality of stacked plate materials W.

By appropriately operating the y-axis drive motor, the plate material W gripped by the y-axis moving body 13 and the clamping device 15 is appropriately moved in the y-axis direction, and a plurality of stacked plate materials W are placed on the work table 7. Move to the laser processing department.

As a result, several stacked plate materials W enter the gap between the drive rotor 29 and the driven rotor 33, which are rotationally driven by the drive motor, against the biasing force of the spring 35, and the intruded plate materials W includes a driving rotary body 29 and a driven rotary body 3.
3 through the urging force of a spring 35.

Therefore, a plurality of stacked plates W can be brought into close contact with each other, and gaps between the plates W can be eliminated.

Then, the laser processing head 17 is moved in the y-axis direction relative to the plurality of stacked plate materials W held by the clamp device 15, and is moved in the Irradiate with laser light.

This makes it possible to perform laser processing on a plurality of stacked plate materials W at the same time.

As described above, according to the present embodiment, by appropriately operating the plate material adhesion means 27, the plate material W can be brought into close contact with a plurality of stacked sheets in the laser processing section of the work table 7. It is possible to eliminate gaps between the respective plate materials W overlapped in the section. Therefore, precise laser processing can be performed on a plurality of plate materials W at the same time.

Note that the present invention is not limited to the explanation of the above-mentioned embodiments,
It can be implemented in various other ways by making appropriate changes.

[Effects of the Invention] As understood from the description of the embodiments above, according to the present embodiment, a plurality of stacked plate materials can be brought into close contact with each other in the laser processing section of the work table. It is possible to eliminate gaps between stacked boards. Therefore, precise laser processing can be performed on a plurality of plate materials at the same time.

[Brief explanation of the drawing]

, the drawings illustrate embodiments of the invention,
FIG. 1 is a view taken along line I-1 in FIG. 3. FIG. 2 is a view taken along the line ■-■ in FIG. 3. Third
The figure is a schematic plan view of a laser processing machine. 1... Laser processing machine 7... Work table 27
...Plate material adhesion means

Claims (2)

[Claims] (1) A work table supports a plurality of stacked plates, and in the laser processing section on the work table,
A plurality of stacked plates are brought into close contact, and the laser processing head is moved relative to the x-axis and y-axis with respect to the plurality of stacked plates.
It is characterized by moving in the axial and z-axis directions and irradiating a plurality of stacked plate materials with laser light via a laser processing head, thereby performing laser processing on the plurality of stacked plate materials at the same time. Laser processing method. (2) A work table that supports a plurality of stacked plates is provided, and a laser processing head that irradiates laser light is placed above the work table relative to the x-axis of the stacked plates. A laser processing machine, which is movable in the y-axis and z-axis directions, and further includes a plate adhering means for adhering a plurality of stacked plates to the laser processing section of the work table.