JP2013059786A - Laser bonding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser bonding apparatus capable of performing stable laser bonding hardly causing bonding defect by reducing gap generated between the laser-incoming side and outgoing side members to surely, closely contact the laminate members.SOLUTION: The laser bonding apparatus 1 is used for bonding the laminate members by irradiating the bonding area 101 of the laminate member 100 comprising a plurality of transparent members 102 and 104 with a laser beam 110 to bond the laminate members. The apparatus is provided with: a placing part 2 for placing the laminate member; a laser beam source unit 5 for emitting the laser beam to the laminate member; a first press member 81 which contacts one surface of the placed laminate member and is positioned in the normal direction of the mating face with respect to a region in which the laser beam and the mating face 103 of at least two transparent members cross each other in the laminate member in laser bonding; and a second press member 80 contacting one surface opposed to the other surface of the placed laminate member. The laminate member is pressed by at least one of the first and second press members.

Description

  The present invention relates to a laser joining apparatus that irradiates a joining region of a laminated member made of laminated transparent members with laser light to join the laminated members.

  Conventionally, as a method of bonding two substances by utilizing the multiphoton absorption phenomenon, there has been a bonding method in which an ultrashort pulse laser is irradiated onto a bonded region such as a laminated silica glass (Patent Document 1). In this joining method, a pressing force is applied to the upper end portions and the lower center portion of the laminated silica glass. Therefore, the overlapped silica glass is sandwiched between the upper plate and the lower fixed plate. A hemispherical protrusion made of silica glass is provided at the center of the lower fixing plate.

International Publication No. 2008/035770

  In this joining method, the hemispherical projection as the lower pressing member and the joining region are far apart in the plane direction of the silica glass. For this reason, a slight gap is generated between the upper silica glass and the lower silica glass in the joining region, and it is not possible to reliably adhere. Therefore, in the internal bonding between transparent members that require very high adhesion, bonding failure tends to occur and stable bonding can not be achieved.

  Moreover, when a laminated member made of silica glass or the like is pressed and brought into close contact, the transparent member may be bent and deformed. And when the press location by a pressing member and the joining area | region are distant from each other, the bending in a joining area | region becomes large. For this reason, the focal point of the laser beam greatly deviates from the bonded portion in the bonded region away from the pressed portion. Thereby, since it cannot contact | adhere reliably, it will become impossible to join stably while it will be easy to produce a joining defect.

  In order to solve the above problems, a laser bonding apparatus according to the present invention is a laser bonding apparatus that irradiates a bonding region of a laminated member composed of a plurality of laminated transparent members with a laser beam and joins the laminated members, A placement part for placing the laminated member, a laser light source unit that emits the laser light to the laminated member on the placement part, and one surface of the laminated member placed on the placement part A first pressing member in contact with the at least two transparent members of the laminated member at the time of laser joining, in a normal direction of the mating surface with respect to a region where the mating surface of the transparent member and the laser beam intersect A first pressing member that is positioned; and a second pressing member that is in contact with the other surface facing the one surface of the laminated member placed on the mounting portion, the first pressing member and the first pressing member At least one of the two presser members , Characterized in that for pressing the laminated member.

  According to the present invention, at the time of laser bonding, the laminated member is formed by the first holding member that is in contact with one surface of the laminated member and the second holding member that is in contact with the other surface facing the one surface of the laminated member. Laser bonding can be performed in a state of being in close contact with each other. And it can laser-join in the state which applied the stress to the joining area | region in the mating surface of the at least 2 transparent member of a laminated member from the normal line direction of this mating surface. Therefore, the gap generated on the mating surface can be reduced in the bonding region irradiated with the laser light. Thereby, since a lamination | stacking member can be closely_contact | adhered reliably, it is hard to generate | occur | produce a joining defect and stable laser joining can be performed.

It is a schematic front view which shows the laser joining apparatus of 1st Embodiment. It is a schematic plan view explaining the laser bonding apparatus of the first embodiment. It is a schematic side view explaining the laser joining apparatus of 2nd Embodiment. It is a schematic plan view explaining the laser joining apparatus of 2nd Embodiment. It is a schematic enlarged view explaining the guide part of the laser joining apparatus of 2nd Embodiment. It is a schematic sectional drawing explaining the guide part of the laser joining apparatus of 2nd Embodiment. It is a schematic sectional drawing which shows the laser joining apparatus of 3rd Embodiment. It is a schematic plan view explaining the laser joining apparatus of 3rd Embodiment. It is a schematic plan view explaining the laser joining apparatus of a modification.

  Hereinafter, exemplary embodiments for carrying out the present invention will be described in detail with reference to the drawings. However, dimensions, materials, shapes, relative positions of components, and the like described in the following embodiments are arbitrary and can be changed according to the configuration of the apparatus to which the present invention is applied or various conditions. Further, unless otherwise specified, the scope of the present invention is not limited to the form specifically described in the embodiments described below.

[First Embodiment]
As shown in FIGS. 1 and 2, the laser bonding apparatus 1 according to the first embodiment irradiates a bonding region 101 of a laminated member 100 including a plurality of laminated transparent members 102 and 104 with a laser beam 110, and performs lamination. The member 100 is joined. Further, the laser bonding apparatus 1 includes a placement unit 2 for placing the laminated member 100 and a laser light source unit 5 that emits a laser beam 110 to the laminated member 100 on the placement unit 2. In the description of the present embodiment, the side on which the laser light 110 is incident on the laminated member 100, that is, the condenser lens 51 side of the laser light source unit 5 is referred to as the incident side. The side on which the laser beam 110 is emitted from the laminated member 100, that is, the side opposite to the condenser lens 51 with respect to the laminated member 100 is referred to as an emission side.

  As shown in FIG. 1, the laminated member 100 includes a first transparent member 102 (hereinafter referred to as an incident side member) positioned on the incident side of the laser beam 110 and a second transparent member positioned on the output side of the laser beam 110. 104 (hereinafter referred to as an “outgoing side member”). That is, the exit side member 104 is a member located on the opposite side of the entrance side member 102 with respect to the mating surface 103 of the entrance side member 102 and the exit side member 104. Here, the transparent member is a member formed of, for example, glass or sapphire, and is a member that is transparent with respect to the wavelength of the laser light and has a large band gap.

  The laser light source unit 5 emits a laser beam 110 such as an ultrashort pulse laser (such as a femtosecond laser, a picosecond laser, or a nanosecond laser) or a carbon dioxide gas laser. The laser beam 110 is preferably a femtosecond laser having a pulse width of 30 ps or less, more preferably a femtosecond laser having a pulse width of 20 ps or less, and a femtosecond laser having a pulse width of 10 fs or more and 20 ps or less. More preferably. If such a femtosecond laser is used, the influence of the heat which the laser beam 110 gives to the emission side pressing member 81 which will be described later can be suppressed. The laser light source unit 5 includes a laser light source that emits laser light and a condenser lens 51 that condenses the laser light emitted from the laser light source. This laser light source can be disposed in the vicinity of the condensing lens 51 or can be disposed at a position away from the condensing lens 51. The laser light source unit 5 is controlled by a control device (not shown) of the laser bonding apparatus 1 so as to emit the laser light 110 at a desired timing. The laser beam 110 is applied to the bonding region 101 on the mating surface 103 between the incident side member 102 and the emission side member 104. Thereby, a multiphoton absorption phenomenon is generated in the joining region 101, and at least one of the incident side member 102 and the emission side member 104 can be melted to weld both members.

  In addition, the laminated member 100 is transported by the mounting unit 2 in the transport direction A indicated by the arrow A while the laser light 110 is irradiated from the laser light source unit 5. As a result, the laser light source unit 5 moves relative to the laminated member 100. Thereby, the laser beam 110 can relatively scan the joining region 101 of the laminated member 100 to join a desired region of the laminated member 100.

  The laser bonding apparatus 1 is placed on the placement unit 2 and the first pressing member 81 that contacts one surface of the laminated member 100 placed on the placement unit 2 (the emission side surface of the emission-side member 104). And a second pressing member 80 in contact with the other surface (incident side surface of the incident side member 102) facing one surface of the laminated member 100. The first pressing member 81 (hereinafter referred to as an emission-side pressing member 81) is positioned on the laser beam 110 emission side with respect to the bonding region 101 and presses the laminated member 100 from the laser beam 110 emission side. The second pressing member 80 (hereinafter referred to as the incident side pressing member 80) is located on the incident side of the laser beam 110 with respect to the bonding region 101 and presses the laminated member 100 from the incident side of the laser beam 110. Further, the incident side pressing member 80 is located on the condensing lens 51 side, and the emission side pressing member 81 is located on the opposite side to the condensing lens 51 side.

  In the first embodiment, the incident side pressing member 80 and the emission side pressing member 81 are rotating bodies. More specifically, the incident side pressing member 80 and the emission side pressing member 81 are ball rollers. The incident-side pressing member 80 is in contact with the incident-side member 102, and the emission-side pressing member 81 is in contact with the emission-side member 104. Therefore, when the laminated member 100 moves, the incident side pressing member 80 rotates due to the frictional force with the incident side member 102, and the emission side pressing member 81 rotates due to the frictional force with the emission side member 104. Thereby, even if it is a weak pressing force, it can move in the state which contact | adhered the lamination | stacking member 100, and laser joining can be performed. Such incident side pressing member 80 and emission side pressing member 81 can be formed of a soft material having high wear resistance, for example, a resin such as polyacetal. By forming from such a soft material, it is possible to prevent the laminated member 100 from being damaged and to secure a necessary adhesion range with a weak pressing force.

  The emission side pressing member 81 is fixed to the emission side arm 72 located on the emission side of the laser beam 110. Further, the emission side pressing member 81 is movable in a direction parallel to the optical axis 120 (hereinafter referred to as an optical axis direction). The emission-side pressing member 81 is pressed by the pressing means 83 and presses the laminated member 100 in the pressing direction indicated by the arrow B. The pressing means 83 of the first embodiment is an air cylinder, and presses the emission side arm 72 to which the emission side pressing member 81 is attached by supplying a predetermined air pressure. Accordingly, the emission side pressing member 81 is pressed in the pressing direction B via the emission side arm 72. The pressing means 83 is not limited to an air cylinder, and an urging member such as a coil spring or rubber can also be used.

  On the other hand, the incident side pressing member 80 is fixed to the incident side arm 71 located on the incident side of the laser beam 110. Further, the laser light source unit 5 is fixed to the incident side arm 71, and the relative position of the condenser lens 51 of the laser light source unit 5 with respect to the incident side arm 71 is fixed. That is, the relative position between the incident side pressing member 80 and the condenser lens 51 is fixed.

  When the bonding region 101 is positioned with respect to the condenser lens 51 with the laminated member 100 sandwiched between the incident side holding member 80 and the outgoing side holding portion 81, the outgoing side holding member 81 holds the laminated member 100. The pressing is performed in the pressing direction B. That is, the output side pressing member 81 moves in the optical axis direction and presses the laminated member 100 with reference to the incident side pressing member 80 whose relative position is fixed to the condenser lens 51.

  Therefore, even if a slight undulation occurs in the mounting portion 2 on which the laminated member 100 is mounted, the relative position of the condenser lens 51 and the focusing lens 51 is not affected by the undulation of the mounting portion 2. The joining region 101 can be positioned with reference to the incident side pressing member 80 that is fixed. That is, according to such a configuration, it is possible to suppress a positional shift in the optical axis direction between the focal point of the laser beam 110 and the bonding region 101.

  Further, the emission side pressing member 81, the incident side pressing member 80, and the laser light source unit 5 are integrally held via the connection portion 7 positioned between the incident side arm 71 and the emission side arm 72. . Therefore, when the stacking member 100 is moved in the transport direction A by the mounting portion 2, the incident side pressing member 80, the laser light source unit 5, and the emission side pressing member 81 are moved relative to the stacking member 100. Therefore, even when the laminated member 100 moves relative to the laser light source unit 5, the laser bonding apparatus 1 can always closely contact the portion where the laser light 110 is collected on the mating surface 103 of the laminated member 100. . Therefore, even when the laminated member 100 is large, the joining region 101 that is continuous with high accuracy can be formed in the peripheral portion of the laminated member 100.

  As shown in FIG. 2, the laminated member 100 is placed on the placement unit 2, and the end of the laminated member 100 protrudes from the edge of the placement unit 2. Then, the laser light source unit 5 irradiates the joining region 101 in the protruding portion of the laminated member 100 with the laser light 110. In addition, a part of the peripheral surface of the incident side pressing member 80 is in contact with the incident side member 102, and is shown as a contact portion 80A in the drawing. A part of the peripheral surface of the emission side pressing member 81 is in contact with the emission side member 104, which is shown as an abutting portion 81A in the drawing. In the first embodiment, the size of the entrance side pressing member 80 is substantially the same as the size of the exit side pressing member 81. However, the size of the incident side pressing member 80 can be made larger than the size of the emission side pressing member 81.

  The emission-side pressing member 81 and the contact portion 81A are formed on the mating surface 103 with respect to the joining region 101 where the mating surface 103 of the two transparent members 102 and 104 of the laminated member 100 and the laser beam 110 intersect at the time of laser joining. Located in the normal direction. In the first embodiment, the laser beam 110 is incident perpendicular to the mating surface 103. Therefore, the normal direction coincides with the optical axis direction of the laser beam 110. That is, the emission side pressing member 81 and the contact portion 81A are positioned on the optical axis 120 of the laser beam 110 during laser bonding. The incident-side pressing member 80 has at least two pressing members positioned so as to sandwich the optical axis 120 of the laser beam 110 during laser joining. That is, the incident side pressing member 80 and the contact portion 80A are positioned so as to open the optical path of the laser light 110. Therefore, laser joining can be performed in a state where the laminated member 100 is in close contact with the emission-side pressing member 81 positioned on the optical axis 120 and the incident-side pressing member 80 positioned so as to open the optical path. Therefore, a gap generated between the incident side member 102 and the emission side member 104 can be reduced in the bonding region 101 irradiated with the laser beam 110. Thereby, since the lamination | stacking member 100 can be adhere | attached reliably, it is hard to generate | occur | produce a joining defect and can be joined stably.

  The incident side pressing member 80 has two pressing members, but may have three or more pressing members. Further, the pressing members of the incident-side pressing member 80 are all arranged in a position parallel to the transport direction A and overlapping the joining region 101. However, the pressing member of the incident side pressing member 80 can be arranged at a position that does not overlap with the bonding region 101. For example, the incident-side pressing member 80 may have two pressing members that are arranged in a direction orthogonal to or intersecting the transport direction A of the laminated member 100.

  Here, laser bonding by the laser bonding apparatus 1 will be briefly described. The placement unit 2 transports the laminated member 100 along the transport direction A to the joining position where the laser beam 110 is irradiated. Further, the control device of the laser bonding apparatus 1 calculates in advance the distance from the mating surface 103 to the condenser lens 51 in the bonding region 101 of the laminated member 100 located at the bonding position. Then, the control device moves the condensing lens 51 so as to coincide with the calculated distance in the bonding region 101, and irradiates the laser beam 110 in this state. The controller sequentially performs the calculation of the distance while performing the bonding with the continuously irradiated laser, and simultaneously calculates the distance in the planned bonding area before the laser irradiation. In this manner, the bonding region 101 of the laminated member 100 is laser bonded.

  The control device includes a CPU, a memory unit, and the like, and the CPU controls the entire laser bonding apparatus 1 based on a program stored in the memory unit. The memory unit also includes a RAM that is a system work memory for the CPU to operate, a ROM that stores the above-described programs, system software, and the like, a hard disk drive, and the like. The CPU can execute various processing operations such as calculation, control, and determination according to a control program stored in the ROM or the hard disk drive. Further, the control device displays various displays including an input operation unit including a keyboard or various switches for inputting predetermined commands or data, and the input / setting state of the laser bonding apparatus 1 and various measurement results. The display unit to be connected is connected.

  According to the first embodiment described above, the laminated member 100 is in close contact with the output-side holding member 81 in contact with one surface of the laminated member 100 and the incident-side holding member 80 in contact with the other surface of the laminated member 100. Laser bonding can be performed in such a state. The exit-side pressing member 81 is located in the normal direction of the mating surface 103 between the incident-side member 102 and the exit-side member 104 with respect to the bonding region 101 irradiated with the laser beam 110. Accordingly, in the configuration in which the emission side pressing member 81 presses the emission side member 104, a pressing force can be applied to the bonding region 101 from the emission side member 104 side in the normal direction. In the configuration in which the incident-side pressing member 80 presses the incident-side member 102, a reaction force can be applied to the bonding region 101 from the emission-side member 104 side in the normal direction.

  Therefore, at the time of laser bonding, a force for bringing the incident-side member 102 and the emission-side member 104 into close contact can be applied to at least a portion where the focal point of the laser beam 110 is formed in the bonding region 101 of the laminated member 100. As a result, the gap generated on the mating surface 103 can be reduced, so that poor bonding is unlikely to occur and stable laser bonding can be performed. In this way, in order to apply stress to the bonding region 101 from the normal direction of the mating surface 103, the emission side pressing member 81 in contact with one surface of the laminated member 100 is positioned in the normal direction of the mating surface 103. It is important that the incident side pressing member 80 is in contact with the other surface of the laminated member 100. Then, at least one of the exit-side pressing member 81 and the incident-side pressing member 80 presses the laminated member 100, thereby applying stress (pressing force or reaction force) from the exit-side pressing member 81 to the joining region 101. it can.

  Further, in the first embodiment, the emission side pressing member 81 is disposed on the optical axis 120 of the laser beam 110. And the incident side pressing member 80 is arrange | positioned at at least two places so that the optical axis 120 of the laser beam 110 may be pinched | interposed. Therefore, the laser beam 110 is incident from the normal direction of the mating surface 103, and the normal direction coincides with the pressing direction B. As a result, stress can be more accurately applied to the bonding region 101 where the focal point of the laser beam 110 is formed. For this reason, bonding failure is less likely to occur and stable laser bonding can be performed.

  In the first embodiment, the laser beam 110 is incident on the mating surface 103 of the laminated member 100 from the vertical direction. However, if the focal point can be formed in the bonding region 101, it can be incident on the mating surface 103 from an oblique direction. Even in this case, the emission-side pressing member 81 in contact with one surface of the laminated member 100 is in the normal direction of the mating surface 103 with respect to the bonding region 101 where the optical axis 120 of the laser beam 110 and the mating surface 103 intersect. To position. The incident side pressing member 80 is in contact with the other surface of the laminated member 100.

  Further, the emission side pressing member 81 may be movable relative to the laminated member 100. Therefore, instead of moving the laminated member 100, the emission side pressing member 81 and the laser light source unit 5 may be moved with respect to the laminated member 100. Further, as long as the laminated member 100 can slide, the emission side pressing member 81 or the incident side pressing member 80 may not be a rotating body. For example, the exit side pressing member 81 or the incident side pressing member 80 may be a non-rotating body formed of a resin having self-lubricating properties. In this case, since it is not necessary to rotate the exit side pressing member 81 or the incident side pressing member 80, members such as a rotating shaft can be omitted. Thereby, the manufacturing cost of a laser joining apparatus can be reduced and it can reduce in size. Further, if the emission side pressing member 81 is located in the normal direction of the mating surface 103 (on the optical axis 120) with respect to the joining region 101, the contact portion 81 </ b> A may be located away from the optical axis 120. .

[Second Embodiment]
Hereinafter, the second embodiment will be described with reference to FIGS. In addition, about the structure described in 1st Embodiment, the same referential mark is attached | subjected and the description is abbreviate | omitted.

  In the second embodiment, unlike the first embodiment, the exit side pressing member 281 is a disc-shaped or annular roller. The emission side pressing member 281 is supported to be rotatable with respect to the rotation shaft 284. Furthermore, in the second embodiment, a guide portion 211 that restricts the emission-side pressing member 281 from being inclined with respect to the optical axis 120 of the laser beam 110 is provided. Specifically, the emission side pressing member 281 is attached to the connection member 285 via the rotation shaft 284. As will be described later, the sliding member 214 to which the connecting member 285 is fixed is slidably engaged with the guide portion 211. Thereby, it is possible to restrict the emission side pressing member 281 from being inclined with respect to the optical axis 120.

  As shown in FIG. 3, the emission side pressing member 281 of the second embodiment is pressed in the pressing direction B by a coil spring as the pressing means 283 via the connecting member 285. One end of the coil spring is in contact with the surface so as to urge the protruding portion of the connecting member 285. The other end of the coil spring is inserted into a groove provided in a part of the emission side arm 72. Further, the emission side pressing member 281 and the connection member 285 are attached to the emission side arm 72 so as to be movable. That is, the connection member 285 to which the emission side pressing member 281 is fixed is fixed to the sliding member 214. And the rail which is the guide part 211 is being fixed to the output side arm 72, and is extended in the optical axis direction. The sliding member 214 is slidably attached to the guide portion 211 and can be translated in the direction of the optical axis 120. Therefore, the emission side pressing member 281, the rotation shaft 284, and the connection member 285 are integrally moved in the optical axis direction toward the laminated member 100 by being pressed by the pressing means 283. Thereby, since it is not necessary to provide means for supplying air, the laser bonding apparatus 1 can be reduced in size.

  A part of the peripheral surface of the emission side pressing member 281 is in contact with the emission side member 104 and is shown as an abutting portion 281A in FIG. Therefore, when the laminated member 100 moves, the emission side pressing member 281 rotates around the rotation shaft 284 by a frictional force with the emission side member 104. Further, the incident side pressing member 80 has a smaller size than the emission side pressing member 281. Thus, since the size of the incident side pressing member 80 is small, the incident side pressing member 80 can be disposed closer to the laser light source unit 5. Therefore, the laser bonding apparatus 1 can be reduced in size.

  Further, when the distance from the incident side pressing member 80 to the emission side pressing member 281 is increased, the bending moment acting on the laminated member 100 is increased. And when a bending moment becomes large, big bending will generate | occur | produce in the laminated member 100. FIG. On the other hand, if the size of the incident side pressing member 80 is small, the incident side pressing member 80 can be disposed closer to the emission side pressing member 281. Therefore, the bending which generate | occur | produces in the laminated member 100 can be suppressed.

  FIG. 6 is a schematic cross-sectional view showing a VI-VI cross section in FIG. As shown in FIG. 6, the laser bonding apparatus 1 according to the second embodiment includes guide portions 211 provided on both sides with respect to the rotation shaft 284. The guide portion 211 restricts the emission side pressing member 281 from being inclined with respect to the optical axis 120 of the laser light 110. More specifically, the rotation shaft 284 of the emission side pressing member 281 is fixed to the connection member 285. The connecting member 285 is fixed to a linear guide that is the sliding member 214. The sliding member 214 has a rail groove, and the rail groove is engaged with a rail that is a guide portion 211. Therefore, the sliding member 214 restricts the emission side pressing member 281 from being inclined with respect to the optical axis 120 of the laser beam 110 by engaging with the guide portion 211.

  As described above, the guide portion 211 restricts the rotational movement of the connection member 285 around the rotation shaft 284. That is, the guide part 211 restricts the movement of the connecting member 285 in the rotational direction indicated by the arrow C in FIG. Thereby, it is possible to prevent the emission side pressing member 281 from falling so as to be inclined in the transport direction A with respect to the optical axis 120. Therefore, it is possible to prevent the contact portion 281A of the emission side pressing member 281 from being separated from the optical axis 120. Accordingly, the contact portion 281A always presses the laminated member 100 at a position where it overlaps with the joining region 101. Thereby, the load which acts on the joining area | region 101 does not fluctuate, but the laminated member 100 can always be pressed with a fixed load.

  According to the second embodiment described above, since the size of the incident side pressing member 80 is small, the laser bonding apparatus 1 can be reduced in size and the bending of the laminated member 100 can be suppressed. Further, since a coil spring is employed as the pressing means 283, there is no need to provide means for supplying air, and the laser bonding apparatus 1 can be reduced in size. Further, the guide portion 211 can prevent the emission side pressing member 281 from falling so as to be inclined with respect to the optical axis 120. Therefore, the load acting on the joining region 101 does not fluctuate, and the laminated member 100 can always be pressed with a constant load. Thereby, since a lamination | stacking member can be closely_contact | adhered reliably, it is hard to generate | occur | produce a joining defect and can perform stable laser joining.

[Third Embodiment]
Hereinafter, the third embodiment will be described with reference to FIGS. In addition, about the structure described in 1st Embodiment, the same referential mark is attached | subjected and the description is abbreviate | omitted.

  FIG. 7 is a schematic sectional view showing a VII-VII section in FIG. 8. As shown in FIG. 7, the laser bonding apparatus 1 according to the third embodiment includes a hollow placement portion 302 unlike the first embodiment. That is, the mounting portion 302 has an opening 322 that faces the laminated member 100. In addition, the incident-side pressing member 380 according to the third embodiment is a fixing member that is detachably attached to the placement unit 302 and abuts against the laminated member 100 to fix the laminated member 100 to the placement unit 302. Further, in the third embodiment, the emission side pressing member 381 is movable within the opening 322. The laser light source unit 5, the incident side pressing member 380, and the emission side pressing member 381 are independent from each other. Further, the laser light source unit 5, the incident side pressing member 380, and the emission side pressing member 381 are configured to move in synchronization. The emission side pressing member 381 moves so as to be positioned on the optical axis 120 of the laser beam 110 when the laser light source unit 5 moves.

  The incident-side pressing member 380 of the third embodiment may be provided with an elastic member such as rubber at a portion that contacts the laminated member 100. In this case, the laminated member 100 can be prevented from being damaged by the incident side pressing member 380. As shown in FIG. 8, the incident side pressing member 380 is a rectangular frame having an opening, and can be attached to be fixed to the mounting portion 302. Therefore, the laminated member 100 can be fixed in a state of being sandwiched between the incident-side pressing member 380 and the placement portion 2. Further, the incident side pressing member 380 can be attached to and detached from the placement unit 302, and can be separated from the placement unit 302 when the laminated member 100 is placed. That is, the incident side pressing member 380 and the mounting portion 302 each have an engaging portion (not shown). The incident-side pressing member 380 can be fixed to the mounting portion 302 by engaging the engaging portion of the incident-side pressing member 380 with the engaging portion of the mounting portion 302. Further, by releasing the engagement between the engaging portion of the incident-side pressing member 380 and the engaging portion of the mounting portion 302, the incident-side pressing member 380 can be separated from the mounting portion 302.

  On the other hand, the emission side pressing member 381 of the third embodiment is a rotating body as in the first embodiment. Further, the emission side pressing member 381 is pressed in the pressing direction B toward the laminated member 100 by the pressing means 383. Here, the pressing means 383 can be constituted by an air cylinder, a coil spring or the like. The emission side pressing member 381 and the pressing means 383 are connected to a moving means (not shown). When the laser light source unit 5 moves, the emission side pressing member 381 is moved by the moving means so as to be positioned on the optical axis 120.

  As shown in FIG. 8, the incident-side pressing member 380 and the mounting portion 302 of the third embodiment sandwich their end portions over the entire circumference of the laminated member 100. The emission-side pressing member 381 can be moved to a desired position in the opening 322 of the mounting portion 302 in synchronization with the movement of the laser light source unit 5. Thereby, it is also possible to laser-join a portion other than the end portion of the laminated member 100. For example, FIG. 8 shows a state where the central portion of the laminated member 100 is laser-bonded.

  According to the third embodiment described above, the emission side pressing member 381 can be moved to a desired position in the opening 322 of the mounting portion 302 in synchronization with the movement of the laser light source unit 5. Therefore, desired portions of the laminated member 100 can be easily joined. That is, in the first embodiment, only the region protruding from the placement portion 2 is laser-bonded. On the other hand, in the third embodiment, since the laser light source unit 5 and the emission side pressing member 381 are independent, the degree of freedom of movement is high. As a result, the laser bonding apparatus 1 can easily laser bond a desired portion other than the end portion of the laminated member 100. The laser bonding apparatus 1 according to the third embodiment can be suitably applied to a case where a member that is not easily bent, particularly a small laminated member or a member having high rigidity is bonded.

  In addition, the incident side pressing member 380 and the mounting portion 302 of the third embodiment can be configured to sandwich only a part of the end portion of the laminated member 100. For example, the incident side pressing member 380 and the mounting portion 302 may be configured to sandwich only the long side end or the short side end of the laminated member 100. In this case, the incident side pressing member 380 does not have a frame shape, but includes a pair of pressing members separated from each other so as to sandwich the long side end or the short side end.

  In the third embodiment, the placement unit 302 has a rectangular opening 322. However, the shape of the opening of the mounting portion is not limited to a rectangle. For example, as shown in FIG. 9, an opening 422 having an annular shape may be used. In this case, the placement portion includes an end portion 402 where the end portion of the laminated member 100 is placed, and a central portion 403 where the central portion of the laminated member 100 is placed. The annular opening 422 has a narrow area in which the emission side pressing member 381 can be moved as compared with the rectangular opening. However, the laminated member 100 can be supported by the end portion 402 and the central portion 403 of the placement portion. Therefore, bending due to the weight of the laminated member 100 can be suppressed.

  Although the present invention has been described above with reference to the embodiments, the present invention is not limited to the above embodiments. Inventions modified within the scope not departing from the present invention and inventions equivalent to the present invention are also included in the present invention. Moreover, each above-mentioned embodiment and modification can be combined suitably in the range which is not contrary to this invention.

  For example, in the above embodiment, the emission side pressing member 81 is pressed toward the laminated member 100. However, both the emission side pressing member 81 and the incident side pressing member 80 or only the incident side pressing member 80 can be pressed toward the laminated member 100. In this case, a pressing means for applying a pressing force to the incident side pressing member 80 can be provided. Further, by fixing the emission side pressing member 81 and the incident side pressing member 80 to the electromagnet, the electromagnet can be pressed by using a force attracting each other.

  Further, in the above-described embodiment, the example in which the two transparent members 102 and 104 are laser-joined has been described. However, the present invention can also be used when laser joining three or more transparent members.

1: laser bonding apparatus, 2: mounting unit, 5: laser light source unit, 7: connection unit, 51: condenser lens, 71: incident side arm, 72: emission side arm, 80: incident side pressing member, 80A: Abutting portion, 81: exit side pressing member, 81A: abutting portion, 83: pressing means, 100: laminated member, 101: joining region, 102: entrance side member, 103: mating surface, 104: exit side member, 110 : Laser beam, 120: optical axis, 202: mounting portion, 211: guide portion, 214: sliding member, 281: exit side pressing member, 281A: abutting portion, 283: pressing means, 284: rotating shaft, 285 : Connection member, 302: Placement part, 322: Opening, 380: Incident side pressing member, 381: Output side pressing member, 381A: Abutting part, 383: Output side pressing member, 402: End part, 403: Center part 422: Opening

Claims (10)

A laser joining apparatus that irradiates a joining region of a laminated member composed of a plurality of laminated transparent members with laser light and joins the laminated member,
A mounting portion for mounting the laminated member;
A laser light source unit that emits the laser light to the laminated member on the placement unit;
A first pressing member in contact with one surface of the laminated member placed on the placement unit, wherein at the time of laser joining, the mating surface of at least two transparent members of the laminated member and the laser beam A first presser member positioned in a normal direction of the mating surface with respect to a region where
A second presser member in contact with the other surface facing the one surface of the laminated member placed on the placing portion,
At least one of the first pressing member and the second pressing member presses the laminated member.   2. The laser bonding apparatus according to claim 1, wherein the first pressing member is positioned on an optical axis of the laser beam during the laser bonding.   The laser bonding apparatus according to claim 1, wherein the first pressing member is movable relative to the laminated member.   The said 2nd pressing member has at least 2 pressing member located so that the optical axis of the said laser beam may be pinched | interposed at the time of the said laser joining, The any one of Claim 1 thru | or 3 characterized by the above-mentioned. The laser joining apparatus described. The first pressing member is movable in the optical axis direction of the laser beam;
5. The laser joining apparatus according to claim 1, wherein the second pressing member is configured to be immovable in an optical axis direction of the laser light.   The laser joining apparatus according to any one of claims 1 to 5, wherein the first pressing member is a rotating body. A guide part,
The laser bonding apparatus according to claim 6, wherein the guide part restricts the first pressing member from being inclined with respect to an optical axis of the laser light.   The laser bonding apparatus according to claim 1, wherein the second pressing member is a rotating body.   The laser joining apparatus according to claim 1, wherein the second pressing member is detachable from the mounting portion. The mounting portion has an opening facing the laminated member,
10. The laser bonding apparatus according to claim 1, wherein the first pressing member is movable in the opening. 11.

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