JPH01261238A - Cutting device for plate to be processed - Google Patents
Cutting device for plate to be processedInfo
- Publication number
- JPH01261238A JPH01261238A JP8985388A JP8985388A JPH01261238A JP H01261238 A JPH01261238 A JP H01261238A JP 8985388 A JP8985388 A JP 8985388A JP 8985388 A JP8985388 A JP 8985388A JP H01261238 A JPH01261238 A JP H01261238A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- glass substrate
- crack
- plate
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 29
- 239000011521 glass Substances 0.000 abstract description 24
- 239000000758 substrate Substances 0.000 abstract description 24
- 238000000034 method Methods 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はガラス基板などの被加工板を割断する被加工板
の割断装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a workpiece cutting device for cutting workpieces such as glass substrates.
従来の技術
近年、板ガラスは各種の基板材料として用いられ、その
使用量の増加にともない加工装置に対しても生産性の高
いものが要求されている。BACKGROUND OF THE INVENTION In recent years, sheet glass has been used as a material for various substrates, and as the amount of sheet glass used has increased, processing equipment with high productivity has been required.
以下第2図、第3図を参照しながら従来の割断方法につ
いて説明する。第2図において、1はガラス基板、2は
ピン、3はガラス基板1にクラックを発生させるスクラ
イプホイールでビン2のまわりを回転する。4はハウジ
ングで、ビン2を保持している。第3図において、12
はテーブル、13は弾性体、14はガラス基板1を前記
クラックに沿って割断する割断治具である。The conventional cutting method will be explained below with reference to FIGS. 2 and 3. In FIG. 2, 1 is a glass substrate, 2 is a pin, and 3 is a scribe wheel that generates cracks in the glass substrate 1 and rotates around the bottle 2. A housing 4 holds the bottle 2. In Figure 3, 12
1 is a table, 13 is an elastic body, and 14 is a cutting jig for cutting the glass substrate 1 along the cracks.
以上のように構成された割断方法について説明する。ま
ず矢印入方向に所定の荷重を加えながら、紙面に垂直な
方向にハウジング4を移動させると、これにともないホ
イール3がピン2を中心として回転、しながら、ガラス
基板1に微少なりラックを発生させていく。次に第3図
のようにテーブル12の上に弾性体13をひき、その上
に微少なりラックを発生させた面を下にしてガラス基板
1を置き、クラックの上をたたくように割断治具14を
矢印B方向に移動させる。これによシガラス基板1は矢
印C方向の力を受けて割れる。The cutting method configured as above will be explained. First, when the housing 4 is moved in a direction perpendicular to the plane of the paper while applying a predetermined load in the direction of the arrow, the wheel 3 rotates around the pin 2 and generates a slight rack on the glass substrate 1. I'll let you do it. Next, as shown in Fig. 3, place the elastic body 13 on the table 12, place the glass substrate 1 on top of it with the surface on which a slight rack has occurred facing down, and use a cutting jig to strike the cracks. 14 in the direction of arrow B. As a result, the glass substrate 1 receives a force in the direction of arrow C and breaks.
発明が解決しようとする課題
しかしながら上記のような構成ではスクライプと割断に
別々な機械が必要であり、移載など生産性も悪いという
問題点を有していた。Problems to be Solved by the Invention However, the above configuration requires separate machines for scribing and cutting, and has the problem of poor productivity such as transfer.
本発明は上記問題点に鑑み、1台の機械でスクライブと
割断を可能とし、生産性を大幅に向上させた割断装置を
提供するものである。In view of the above-mentioned problems, the present invention provides a cutting device that enables scribing and cutting with one machine and greatly improves productivity.
課題を解決するだめの手段
上記問題点を解決するために本発明の割断装置は、被加
工板の割断部にクラックを形成するクラック形成手段と
、被加工板の外周及び割断部を支承すると共に割断部に
沿って割断される各割断片を吸着してこれら割断部に変
形を生じさせるテーブルとを備えたことを特徴とする。Means for Solving the Problems In order to solve the above-mentioned problems, the cutting device of the present invention includes a crack forming means for forming a crack in the cut portion of the work plate, supporting the outer periphery of the work plate and the cut portion, and The present invention is characterized by comprising a table that adsorbs each split piece cut along the cut portion and causes deformation of the cut portion.
作 用
本発明は上記した構成によって、被加工板の割断部に対
するスクライブを行った後、スクライブにより発生した
クラックの両側部位を吸着して夫々に変形を生じさせる
ことにより、前記クラックを割断線として前記部位を割
断片に分割することができる。According to the above-described structure, the present invention scribes the cut portion of the workpiece plate, and then adsorbs both sides of the crack generated by the scribing to cause deformation, thereby converting the crack into a cut line. The site can be divided into split pieces.
実施例
以下本発明の実施例の割断装置について第1図を参照し
ながら説明する。第1図において、21はガラス基板、
22はガラス基板21が載置され、またこのガラス基板
21を真空吸着するテーブル、26はスクライブホイー
ル、29はスクライブホイールを回転可能に保持するハ
ウジング、24はハウジング29を図の左右方向に移動
させるネジ軸、23はネジ軸24を回転させるモータ、
28はモータ23が取付けられたコラム、27はコラム
28を図の前後方向に移動させるネジ軸、28はネジ軸
27を回転させるモータである。EXAMPLE Hereinafter, a cutting device according to an example of the present invention will be explained with reference to FIG. In FIG. 1, 21 is a glass substrate;
22 is a table on which the glass substrate 21 is placed and vacuum-suctions the glass substrate 21; 26 is a scribe wheel; 29 is a housing that rotatably holds the scribe wheel; and 24 is a table for moving the housing 29 in the left-right direction in the figure. a screw shaft; 23 is a motor that rotates the screw shaft 24;
28 is a column to which the motor 23 is attached; 27 is a screw shaft that moves the column 28 in the front-back direction in the figure; and 28 is a motor that rotates the screw shaft 27.
前記テーブル22は、ガラス基板21の割断部で区画さ
れる部位に対応して凹設され、真空吸着される前記部位
を湾曲変形させるように構成されている。なお、テーブ
ル22のガラス基板21の外周及び割断部に対応する部
位は、平らな支承面に形成されている。The table 22 is recessed to correspond to a portion of the glass substrate 21 divided by the cut portion, and is configured to curve and deform the portion that is vacuum-adsorbed. Note that the portion of the table 22 corresponding to the outer periphery of the glass substrate 21 and the cutting portion is formed into a flat support surface.
以上のように構成された割断装置について、以下第1図
を用いてその動作を説明する。The operation of the cutting device configured as described above will be described below with reference to FIG.
テーブル22の上に割断部とテーブルの支承面が一致す
るようにガラス基板21を置き、ガラス基板21がスク
ライブ中に移動しない程度の真空度でチャックする。モ
ータ23によりネジ軸24を回転してスクライプホイー
ル26を割断位置に合わせ、任意の圧力でガラス基板2
1に押しつけなから割断部に沿って移動させる。この移
動はモータ26の回転をネジ軸27に伝え、コラム28
を移動させることにより行う。この加工を各割断部に行
うことにより割断部にクラックを発生させる。The glass substrate 21 is placed on the table 22 so that the cutting part and the support surface of the table coincide with each other, and the glass substrate 21 is chucked at a degree of vacuum such that the glass substrate 21 does not move during scribing. The screw shaft 24 is rotated by the motor 23 to align the scribe wheel 26 to the cutting position, and the glass substrate 2 is cut with an arbitrary pressure.
Do not press it against 1, but move it along the cut part. This movement transmits the rotation of the motor 26 to the screw shaft 27, and the column 28
This is done by moving the . By performing this processing on each cut portion, cracks are generated in the cut portion.
次に各クラックの両側でガラス基板21の変形がほぼ等
しくなり、かつガラス基板21が割断可能な湾曲変形を
するように、真空チャックの圧力P1.P2を調整して
ガラス基板21を割断することができる。なお、実施例
においてはスクライプホイールルを用いているが、シン
グルポイントのガラス切りを用いてもよい。Next, the vacuum chuck pressure P1. The glass substrate 21 can be cut by adjusting P2. Although a scribe wheel is used in the embodiment, a single point glass cutter may also be used.
発明の効果
以上のように本発明は、1台の機械で生産性良く被加工
板の割断加工をすることができる。Effects of the Invention As described above, according to the present invention, a workpiece plate can be cut with high productivity using one machine.
第1図は本発明の実施例の正面図、第2図及び第3図は
従来例を示し、第2図はスクライブ工程を示す要部の正
面図、第3図は割断工程を示す要部の正面図である。
21・川・・ガラス基板、22・・・・・・テーブル、
26・・・・・・スクライブホイール。Fig. 1 is a front view of an embodiment of the present invention, Figs. 2 and 3 show a conventional example, Fig. 2 is a front view of a main part showing a scribing process, and Fig. 3 is a front view of a main part showing a cutting process. FIG. 21・River...Glass substrate, 22...Table,
26...Scribe wheel.
Claims (1)
段と、被加工板の外周及び割断部を支承すると共に割断
部に沿って割断される各割断片を吸着してこれら割断辺
に変形を生じさせるテーブルとを備えたことを特徴とす
る被加工板の割断装置。A crack forming means for forming a crack in the cut part of the work plate, and a crack forming means that supports the outer periphery and the cut part of the work plate and adsorbs each split piece cut along the cut part to cause deformation on these cut sides. A cutting device for a workpiece plate, characterized in that it is equipped with a table for cutting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8985388A JPH01261238A (en) | 1988-04-12 | 1988-04-12 | Cutting device for plate to be processed |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8985388A JPH01261238A (en) | 1988-04-12 | 1988-04-12 | Cutting device for plate to be processed |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01261238A true JPH01261238A (en) | 1989-10-18 |
Family
ID=13982340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8985388A Pending JPH01261238A (en) | 1988-04-12 | 1988-04-12 | Cutting device for plate to be processed |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01261238A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100065599A1 (en) * | 2005-05-30 | 2010-03-18 | Mitsuboshi Diamond Industrial Co., Ltd. | Device and method for cutting off substrate of fragile material |
CN103274589A (en) * | 2013-05-25 | 2013-09-04 | 吴军红 | Cutting tool bit for glass cutting apparatus |
-
1988
- 1988-04-12 JP JP8985388A patent/JPH01261238A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100065599A1 (en) * | 2005-05-30 | 2010-03-18 | Mitsuboshi Diamond Industrial Co., Ltd. | Device and method for cutting off substrate of fragile material |
US8276796B2 (en) * | 2005-05-30 | 2012-10-02 | Mitsuboshi Diamond Industrial Co., Ltd. | Device and method for cutting off substrate of fragile material |
CN103274589A (en) * | 2013-05-25 | 2013-09-04 | 吴军红 | Cutting tool bit for glass cutting apparatus |
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