JPH02298281A - Method for etching fine pattern - Google Patents

Abstract

PURPOSE:To accurately etch a fine pattern by spraying an etchant on a material such as a metal sheet and intermittently blowing gas to temporarily remove the etchant from the surface of the material. CONSTITUTION:An etchant such as a soln. of iron chloride or copper chloride is fed through an etchant transporting pipe 2 and sprayed from spray nozzles 3 on a sheet 5 of a metal such as iron or copper conveyed by a belt conveyor 6 in housing 1. At the same time, gas such as air is intermittently blown from slits 4 on the metal sheet 5 and wet etching is carried out while temporarily removing the etchant from the surface of the sheet 5. Etching factor is considerably increased and the etching of a fine pattern is enabled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a wet etching method using an etchant such as iron chloride or copper chloride, and particularly to a spray etching method.

[Prior Art] Conventionally, precision processing of lead frames, FPCs, tape carriers, etc. has been carried out using an etching method called photo-etching, in which a pattern is formed on the surface of the workpiece using a photoresist (photosensitive coating). A widely used processing method is to obtain a desired pattern shape by selectively removing exposed portions of the surface.

In this photo-etching method, a widely used method for selectively removing the exposed portion is a spray etching method in which an etchant is used and sprayed in the form of a mist from a spray nozzle, and the etching process is performed by spraying the etchant onto the surface of the workpiece. ing.

[Problem to be solved by the invention] However, m-near sort frames, FPCs, tape carriers, etc.)! J): A fine weight is always required for a-cho, and the current situation is that it is impossible to meet that quality standard.

In order to accurately etch fine patterns, it is necessary to improve the etching factor. It is possible to improve the etching factor to some extent by increasing the ejection force of the etching liquid from the spray nozzle and etching with fresh etchant, but the spray pressure cannot be increased to an extreme level because it will damage the 7 otolith by 1n, and it is at its own limit. . Also, the constant use of fresh etching solution poses a problem in terms of acquisition costs.

[Means for Solving the Problems] The present invention provides the above-mentioned spray etching method! The purpose of the present invention is to solve these two problems, greatly improve the etching factor, and provide a method for etching fine patterns with high precision. The method is to temporarily remove the etching solution from the surface by spraying it onto the surface.

Air is generally used as the gas to be injected, or
v! Gases other than air, such as raw gas, l&acid scum, and argon gas, may be used.

[Example 1 FIG. 1 is a schematic explanatory diagram showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the gas injection slit of the present invention, in which 1 is a housing, 2 is an etchant transport pipe, 3 is a spray nozzle, and 4 is a cross-sectional view of a gas injection slit of the present invention. 5 is a metal plate, and 6 is a belt conveyor.

The present invention will be explained in detail based on FIG. 11'J and FIG.

Width of 2m house sink 1, Erachan 1-Wheel J Vibe 2
It is equipped with a spray nozzle of 3 or 15 cm.
A total of 12 pieces are placed at intervals. spray nozzle 3
used a uniform fan shape with a spray angle of 90 mm, and a metal plate of 5
The distance was 35 cm. The gas injection slit 4 is the third
The cross-sectional shape shown in 1A is made of PvC with a kneading thickness of 3 mm, and the 1゛ method is a pentagon with a base of 18 mm and a top of '++ (
The distance from the top to the bottom is 50 mm, the slit width is 1 mm, and the distance to the metal plate 5 is 20 mm.

The metal plate 5 used as the material is etched by being exposed to an etchant and intermittently sprayed with gas while moving on a belt conveyor 6.

Using the Eutink method, experiments were conducted with and without injecting air as a gas. The experimental samples were metal plates of 4270mm (0.2n scratch thickness) and copper plates (0.2mm thick). The engineering and engineering factors were measured and compared.
The experimental results are shown in the table, and the gas injection pressure in the example was 0.5k.
g/rry'.

As is clear from Table 1, the examples show better etching factors than the comparative examples.

[Effects of the Invention] Since the present invention is configured as described above, it produces the effects as described below.

During spray etching, a gas such as air is intermittently sprayed onto the surface of the workpiece to temporarily remove the etching solution from the surface, which significantly reduces the etching factor as shown in the experimental results. Therefore, it greatly contributes to the establishment of fine pattern elaboration and work.

4 Brief description of the drawings No. 1171 is a schematic explanatory diagram showing an embodiment of undeveloped IJ, I, No. 2124 is a cross-sectional view showing an example of -1 of the present invention, No. 312! FIG. 3 is a cross-sectional view of the jetting jet.

l...Housing 2... Etchant transport vibe 3...Spray nozzle 4...Gas injection slit 5...Metal plate 6...belt conveyor

Claims (1)

[Claims] In a method of performing wet etching by spraying an etchant, the etchant is sprayed onto the material to be etched, such as a metal plate, and a gas such as air is intermittently sprayed to temporarily apply the etchant to the metal plate. A fine pattern etching method characterized by performing etching while removing from the surface of the material.