JPH02297511A - Optical front end device - Google Patents
Optical front end deviceInfo
- Publication number
- JPH02297511A JPH02297511A JP1117462A JP11746289A JPH02297511A JP H02297511 A JPH02297511 A JP H02297511A JP 1117462 A JP1117462 A JP 1117462A JP 11746289 A JP11746289 A JP 11746289A JP H02297511 A JPH02297511 A JP H02297511A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- optical
- hole
- light receiving
- flip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 42
- 239000013307 optical fiber Substances 0.000 claims description 10
- 230000003071 parasitic effect Effects 0.000 abstract description 9
- 230000008878 coupling Effects 0.000 abstract description 8
- 238000010168 coupling process Methods 0.000 abstract description 8
- 238000005859 coupling reaction Methods 0.000 abstract description 8
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000000835 fiber Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229940085805 fiberall Drugs 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
Abstract
Description
【Ｗｔ業上の利用分野１
本発明は光フロントエンド装置、更に詳しくいえば、光
フアイバ通信線路と受光部をもつ回路構成素子を結合し
保持する装置に関する。
【従来の技術］
光フアイバ通信用のフロントエンド装置は、光ファイバ
と光電変換素子（受光素子、フォトダイオード等）を結
合する光結合部品、上記光電変換素子で変換された電気
信号を増幅する前値増呵回路等を含む回路素子、これら
の光電変換素子及び回路素子を搭載する回路基板と保持
部（モジュールパッケージ）で構成される。
従来、光フロントエンド装置で処理される信号の速度が
２ギガビット／秒以下では、同一回路基板上に、光電変
換素子と上記光電変換素子と別に作られた前置増幅を含
むＩＣ（集積回路）を搭載し、これらをワイヤ接続して
いた。
しかしながら、信号の速度が１０ギガビット／秒程度に
なると、光電変換素子と前置増幅回路を含むＩＣ（集積
回路）とを接続するワイヤの寄生インダクタンスが無視
できなくなる。この光電変換素子と前置増幅を含むＩＣ
（集積回路）とを接続するワイヤの寄生インダクタンス
を小さくする技術として、文献（電子情報通信学会光・
量子エレクトロニス研究報告 ＯＱＥ ８８ ６１〜
６８頁）に示すように光電変換素子と前値増幅回路とを
単一のＩＣの中に一体的に構成するもの（以下０ＥＩＣ
という）、光電変換素子の接続端子と前置増幅回路を含
むＩＣの接続端子とをワイアを用いることなく直接接続
したもの（以下フリップチップＩＣという）がある。
しかしながら、従来、０ＥＩＣおよびフリップチップＩ
Ｃ（以下総称してフロントエンドＩＣという）の実装に
おいては、例えば上記文献の第６８頁図１０に示すよう
にフロントエンドＩＣから他の回路基板への接続はボン
ディングワイヤを用いていた。
第２図に従来の光フロントエンド装置の典型的な実装を
示す、これは、フロントエンドＩＣＩを搭載する台１０
．を気出力用ビン７を支持するセラミックス５１球レン
ズ２と光フアイバ支持部品８に固定されたファイバ３、
球レンズ２と支持部品８を固定した光部品保持台９で構
成されている。
０ＥＩＣの場合、受光素子（光電変換素子）１″′がＩ
ＣＩの中に形成され、フリップチップＩＣの場合、受光
素子１″が工Ｃ１に搭載されている。
光ファイバ３からの光信号は球レンズ２で集光され、フ
ロントエンドＩＣＩで電気信号に変換され、ボンディン
グワイヤ６を経てピン７に出力される。
【発明が解決しようとする課題】
上記従来の光フロントエンド装置は、ボンディングワイ
ヤ６の寄生インダクタンスによる波形劣化又は帯域制限
と、フロントエンドＩＣＩを搭載する台１０と光部品保
持台９が異なる材質で構成され、かつフロントエンドＩ
ＣＩに対し反対側（上下）に位置するように装着される
ために、フロントエンドＩＣＩと光結合部品（球レンズ
２とファイバ３）との軸ずれの問題があった。また、光
通信では信号は直流付近からビットレート付近までの広
帯域の周波数成分をもつため、周波数特性の広帯域化が
重要であり、ボンディングワイヤ１２の寄生インダクタ
ンスによるピーキング周波数をビットレート以上の周波
数にする必要がある。
信号のビットレートが１０ギガビット／秒では、ボンデ
ィングワイヤ１２の寄生インダクタンスは０．２ｎＨ程
度以下にしなければならず、これには、高度な技術を必
要とする。また、台１と光部品保持台９が離れているた
め、温度変化に対し軸ずれを起しやすくなっている。
本発明の目的は、フロントエンドＩＣを部品保持台に実
装した光フロントエンド装置において、上記の問題を同
時に解決し、温度変化に対して光結合部品とフロントエ
ユノドＩＣの軸ずれが少なく、フロントエンＩＣからの
引出線による寄生インダクタンスの少ない光フロントエ
ンド装置を実現することである。[Field of Application in Wt Industry 1] The present invention relates to an optical front-end device, and more specifically, to a device for coupling and holding a circuit component having an optical fiber communication line and a light receiving section. [Prior Art] A front-end device for optical fiber communication includes an optical coupling component that couples an optical fiber and a photoelectric conversion element (light receiving element, photodiode, etc.), and a front-end device that connects an optical fiber and a photoelectric conversion element (light receiving element, photodiode, etc.). It consists of circuit elements including value increasing circuits, a circuit board on which these photoelectric conversion elements and circuit elements are mounted, and a holding part (module package). Conventionally, when the speed of signals processed by an optical front-end device is 2 gigabits/second or less, an IC (integrated circuit) that includes a photoelectric conversion element and a preamplifier made separately from the photoelectric conversion element on the same circuit board is used. and these were connected by wires. However, when the signal speed reaches about 10 gigabits/second, the parasitic inductance of the wire connecting the photoelectric conversion element and the IC (integrated circuit) including the preamplifier circuit cannot be ignored. An IC including this photoelectric conversion element and preamplification
As a technology to reduce the parasitic inductance of wires connecting (integrated circuits)
Quantum electronics research report OQE 88 61~
As shown in page 68), a photoelectric conversion element and a prior value amplification circuit are integrated into a single IC (hereinafter referred to as 0EIC).
There is a flip-chip IC (hereinafter referred to as a flip-chip IC) in which the connection terminal of a photoelectric conversion element and the connection terminal of an IC including a preamplifier circuit are directly connected without using wires. However, conventionally, 0EIC and flip chip I
In mounting C (hereinafter collectively referred to as front-end IC), bonding wires were used to connect the front-end IC to other circuit boards, as shown in FIG. 10 on page 68 of the above-mentioned document, for example. FIG. 2 shows a typical implementation of a conventional optical front-end device.
．． A ceramic 51 supporting the air output bottle 7, a ball lens 2 and a fiber 3 fixed to the optical fiber support part 8,
It consists of an optical component holding stand 9 on which a ball lens 2 and a supporting component 8 are fixed. In the case of 0EIC, the light receiving element (photoelectric conversion element) 1''' is I
In the case of a flip-chip IC, a light receiving element 1'' is mounted on the IC.The optical signal from the optical fiber 3 is focused by the ball lens 2, and converted into an electrical signal by the front end ICI. The conventional optical front-end device described above suffers from waveform deterioration or band limitation due to the parasitic inductance of the bonding wire 6 and front-end ICI. The mounting stand 10 and the optical component holding stand 9 are made of different materials, and the front end I
Since the front end ICI is mounted on the opposite side (up and down) to the CI, there is a problem of axis misalignment between the front end ICI and the optical coupling parts (ball lens 2 and fiber 3). In addition, in optical communications, signals have wide-band frequency components from around DC to around the bit rate, so it is important to widen the frequency characteristics, so the peak frequency due to the parasitic inductance of the bonding wire 12 is set to a frequency higher than the bit rate. There is a need. If the signal bit rate is 10 gigabits/second, the parasitic inductance of the bonding wire 12 must be about 0.2 nH or less, which requires advanced technology. Furthermore, since the stand 1 and the optical component holding stand 9 are separated from each other, the axis tends to shift due to temperature changes. An object of the present invention is to simultaneously solve the above-mentioned problems in an optical front-end device in which a front-end IC is mounted on a component holding stand, to reduce axis misalignment between the optical coupling component and the front-end IC due to temperature changes, and to provide a An object of the present invention is to realize an optical front-end device with less parasitic inductance due to lead wires from the .
本発明は上記目的を達成するために、光フロントエンド
装置の構成素子として、光ビームを通す孔を有する回路
基板に、受光部を持つフロントエンド素子を上記受光部
が上記回路基板の孔に対向するようにフリップチップ接
続して構成し、上記回路基板を光結合部品（球レンズ等
）保持台に、保持台に設けられた光ビームを通す孔と上
記回路基板が有する光ビームを通す孔とが一致するよう
に固定し、フロントエンド素子からの電気信号の引出し
を上記回路基板の配線を介して行うようにフロントエン
ド装置を構成した。上記回路基板及び光部品保持台の光
ビームを通す孔は中空でも光を通す物質でもよい。また
、上記２つの孔の大きさは一致する必要はない。上記フ
ロントエンド素子としては、０ＥＩＣやフリップチップ
ＩＣのような集積回路のほかに、端なる配線及び受動素
子から成るサブマウントに集積回路をフリップチップ接
続したものでもよい。In order to achieve the above object, the present invention, as a component of an optical front-end device, includes a front-end element having a light receiving section on a circuit board having a hole through which a light beam passes, with the light receiving section facing the hole in the circuit board. The above-mentioned circuit board is connected to a flip-chip connection so that the optical coupling component (ball lens, etc.) is connected to a holder, and a hole provided in the holder for passing a light beam and a hole for passing a light beam provided in the above-mentioned circuit board are connected to the holder. The front-end device was configured such that the front-end elements were fixed so that they coincided with each other, and electrical signals were extracted from the front-end elements via the wiring of the circuit board. The holes in the circuit board and the optical component holder through which the light beam passes may be hollow or may be made of a material that allows light to pass through. Further, the sizes of the two holes do not need to be the same. In addition to an integrated circuit such as an 0EIC or a flip-chip IC, the front-end element may be one in which an integrated circuit is flip-chip connected to a submount consisting of end wiring and passive elements.
本発明による光フロントエンド装置では、フロントエン
ド素子からの電気信号の引出しが回路基板の布線を介し
て光部品保持台に設けられた出力ピンに接続され、上記
フロントエンド素子と回路基板とはフリップチップ接続
されるため布線によるインダクタンスは無視でき、上記
布線と出力ピンとの接続ワイヤは短くできるので、寄生
インダクタンスを小さくすることができる。同時に、回
路基板を搭載する台と光結合部品保持台を一体化するこ
とにより軸ずれをほとんど無くすことができる。
［実施例１
以下、本発明による光フロントエンド装置の一実施例を
第１図により説明する。
第１図は本実施例の断面図を示す１図示のごとく、フロ
ントエンド素子としてのフロントエンドＩＣＩ、光ビー
ムを通す孔１３を有し、配線パターンが形成されたセラ
ミック回路基板４、回路基板４から外部に信号を取り出
す高周波信号出力ピン７と誘電体５、球レンズ２、ファ
イバ支持部品８に固定されたファイバ３、回路基板４１
球レンズ２、ファイバ支持部８を固定する光部品保持台
１１およびふた］２で構成される。フロントエンドＩＣ
Ｉは受光素子１′と電子回路素子１″′構成され、受光
素子１′は金／すず混晶により電子回路素子３． ＩＩ
７ とフリップチップ接続されている。
フロントエンドＩＣＩは電子回路素子１″′の取り出し
パッド上に形成した半田バンプ１４により、受光素子１
′が回路基板４の孔１３に入る様に回路基板４にフリッ
プチップ接続される。本実施例では、受光素子１′とし
てＩ ｎＧａＡｓ系のＰＩＮフォトダイオード、電子回
路素子１″′とじてＧａＡｓ ＩＣを用いでいる。
光ファイバー３からの光信号は、球レンズ２で受光素子
１′に集光される。受光素子１″と電子回路素子１″′
で光信号が電気信号に変換され、半田バンプ１４を介し
て回路基板４の配線に出力する６回路基板４上の配線は
高周波ピン７を介して外部と接続される。また、図示さ
れていないが、受光素子１′及び電子回路素子１″′へ
の電源は前述の信号とは逆の経路で外部より供給される
。
以上本発明の一実施例について説明したが、本発明は上
記実施例に限定されるものではない。上記実施例では光
部品保持台１１に球レンズを固定したがファイバ保持部
品８にレンズを固定してもよく、要は光ファイバからの
光ビームをフロントエンドＩＣの受光部に導けばよい０
本実施例ノ電子回路素子１″′の代わりに単なる配線及
び必要ならば受動素子のみからなるサブマウントを用い
てもよい、上記サブマウントとしては第３図に示すよう
に、配線が中心導体１５Ｃとアース導体１５Ｅとが絶縁
基板１６の同一平面上に形成される、いわゆるコープレ
ー配線にすると回路基板４や受光素子１′とのフリップ
チップ接続容易と成る。
また、フロントエンドＩＣは受光素子１′及び電子回路
素子１”′を一体化した○ＥＩＣでもよい８In the optical front-end device according to the present invention, the electrical signal output from the front-end element is connected to the output pin provided on the optical component holder via the wiring of the circuit board, and the front-end element and the circuit board are connected to each other. Since flip-chip connection is performed, inductance due to wiring can be ignored, and the connecting wire between the wiring and the output pin can be shortened, so parasitic inductance can be reduced. At the same time, by integrating the circuit board mounting stand and the optical coupling component holding stand, axis misalignment can be almost eliminated. [Embodiment 1] Hereinafter, an embodiment of the optical front-end device according to the present invention will be described with reference to FIG. FIG. 1 shows a cross-sectional view of this embodiment.As shown in FIG. A high frequency signal output pin 7 for extracting a signal to the outside, a dielectric 5, a ball lens 2, a fiber 3 fixed to a fiber support component 8, and a circuit board 41.
It is composed of a ball lens 2, an optical component holder 11 for fixing a fiber support 8, and a lid]2. front end IC
I is composed of a light receiving element 1' and an electronic circuit element 1"', and the light receiving element 1' is an electronic circuit element 3" made of gold/tin mixed crystal.II
7 and is flip-chip connected. The front end ICI connects the light receiving element 1 with the solder bump 14 formed on the extraction pad of the electronic circuit element 1''.
' is flip-chip connected to the circuit board 4 so that it enters the hole 13 of the circuit board 4. In this embodiment, an InGaAs PIN photodiode is used as the light receiving element 1', and a GaAs IC is used as the electronic circuit element 1''. The optical signal from the optical fiber 3 is transmitted to the light receiving element 1' by a ball lens 2. The light is focused.The light receiving element 1'' and the electronic circuit element 1'''
The optical signal is converted into an electrical signal and output to the wiring on the circuit board 4 via the solder bumps 14.The wiring on the circuit board 4 is connected to the outside via the high frequency pin 7. Further, although not shown, power to the light receiving element 1' and the electronic circuit element 1'' is supplied from the outside through a route opposite to that of the above-mentioned signals.One embodiment of the present invention has been described above. The present invention is not limited to the above embodiment. In the above embodiment, the ball lens was fixed to the optical component holder 11, but the lens may also be fixed to the fiber holder 8. In short, the light from the optical fiber All you have to do is guide the beam to the light receiving part of the front end IC0
In place of the electronic circuit element 1'' in this embodiment, a submount consisting of mere wiring and, if necessary, only passive elements may be used.As shown in FIG. If the so-called Co-lay wiring is used in which the ground conductor 15E and the ground conductor 15E are formed on the same plane of the insulating substrate 16, flip-chip connection with the circuit board 4 and the light receiving element 1' becomes easy. ○EIC that integrates electronic circuit element 1”’ is also acceptable 8
本発明によれば、フロントエンドＩＣの回路基板へのフ
リップチップ実装により、寄生インダクタンスをほぼ無
くし系全体を広帯域化するとともに、回路基板を搭載す
る台と光部品ホルダーを一体化することにより軸ずれを
小さくすることができる。According to the present invention, by flip-chip mounting the front-end IC on the circuit board, parasitic inductance is almost eliminated and the entire system becomes broadband, and by integrating the stand on which the circuit board is mounted and the optical component holder, axis misalignment can be avoided. can be made smaller.
第１図は本発明による光フロントエンド装置の一実施例
の断面−１第２図は従来の光フロントエンド装置の断面
図、第３図は本発明の光フロントエンド装置に使用され
るフロントエンド構成素子の一実施例の側面図である。FIG. 1 is a cross-sectional view of an embodiment of an optical front-end device according to the present invention. FIG. 2 is a cross-sectional view of a conventional optical front-end device. FIG. 3 is a front end used in the optical front-end device of the present invention. FIG. 3 is a side view of an embodiment of a component;
Claims (1)
力光を通す孔を持つ光部品保持台と、受光部で光電変換
された信号を処理する電子回路を有するフロントエンド
素子と、光ビームを通す孔と配線パタンを有する回路基
板とを有し、上記フロントエンド素子の受光部が上記回
路基板の孔に対向せしめるように上記フロントエンド素
子が上記回路基板にフリップチップ接続され、上記出力
光が上記受光部に照射されるように上記回路基板が上記
光部品保持台に固定されて構成された光フロントエンド
装置。 ２、受光部で光電変換された信号を処理する電子回路を
有するフロントエンド素子と、光ビームを通す孔と配線
パタンを有する回路基板とを有し、上記受光部が上記回
路基板の孔に対向するように上記フロントエンド素子が
上記回路基板にフリップチップ接続された光フロントエ
ンド構成素子。 ３、請求項第２記載において、上記フロントエンド素子
が集積化回路で構成された光フロントエンド構成素子。 ４、請求項第２記載において、上記フロントエンド素子
が配線と受動素子とからなるサブマウントに受光素子を
フリップチップ接続して構成された光フロントエンド構
成素子。[Claims] 1. A front including an optical component holder having a hole for holding the end of an optical fiber and passing the output light from the optical fiber, and an electronic circuit for processing the signal photoelectrically converted in the light receiving section. It has an end element, a circuit board having a hole through which a light beam passes, and a wiring pattern, and the front end element is flip-chip mounted on the circuit board so that the light receiving part of the front end element faces the hole of the circuit board. An optical front-end device configured such that the circuit board is connected to the optical component holder and fixed to the optical component holder so that the output light is irradiated to the light receiving section. 2. A front-end element having an electronic circuit for processing a signal photoelectrically converted in a light receiving part, and a circuit board having a hole through which the light beam passes and a wiring pattern, and the light receiving part faces the hole of the circuit board. an optical front-end component, wherein the front-end component is flip-chip connected to the circuit board; 3. The optical front-end component according to claim 2, wherein the front-end element is constituted by an integrated circuit. 4. The optical front-end component according to claim 2, wherein the front-end element is constructed by flip-chip connecting a light receiving element to a submount consisting of wiring and a passive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1117462A JP2941303B2 (en) | 1989-05-12 | 1989-05-12 | Optical front-end device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1117462A JP2941303B2 (en) | 1989-05-12 | 1989-05-12 | Optical front-end device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02297511A true JPH02297511A (en) | 1990-12-10 |
| JP2941303B2 JP2941303B2 (en) | 1999-08-25 |
Family
ID=14712279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1117462A Expired - Lifetime JP2941303B2 (en) | 1989-05-12 | 1989-05-12 | Optical front-end device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2941303B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129637A (en) * | 1991-10-31 | 1993-05-25 | Matsushita Electric Ind Co Ltd | Photodetector |
| US6071016A (en) * | 1997-03-04 | 2000-06-06 | Hamamatsu Photonics K.K. | Light receiving module for optical communication and light receiving unit thereof |
| JP2001015792A (en) * | 1999-04-28 | 2001-01-19 | Denso Corp | Photosensor |
| KR100347051B1 (en) * | 2000-09-15 | 2002-08-03 | 에어로컴 (주) | A Laser Beam Receiver having Ball Lens in the Laser Transceiver |
| JP2004258262A (en) * | 2003-02-25 | 2004-09-16 | Matsushita Electric Works Ltd | Optical element block for optical receptacle |
| US6915049B2 (en) * | 2001-02-26 | 2005-07-05 | Seiko Epson Corporation | Optical module and method of manufacturing the same, and optical transmission device |
| JP2009151053A (en) * | 2007-12-20 | 2009-07-09 | Sumitomo Electric Ind Ltd | Light receiving module |
| WO2009125455A1 (en) * | 2008-04-09 | 2009-10-15 | Yazaki Corporation | Optical communication module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6180207A (en) * | 1984-09-28 | 1986-04-23 | Hitachi Ltd | Substrate for electrical and optical circuit element |
-
1989
- 1989-05-12 JP JP1117462A patent/JP2941303B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6180207A (en) * | 1984-09-28 | 1986-04-23 | Hitachi Ltd | Substrate for electrical and optical circuit element |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129637A (en) * | 1991-10-31 | 1993-05-25 | Matsushita Electric Ind Co Ltd | Photodetector |
| US6071016A (en) * | 1997-03-04 | 2000-06-06 | Hamamatsu Photonics K.K. | Light receiving module for optical communication and light receiving unit thereof |
| JP2001015792A (en) * | 1999-04-28 | 2001-01-19 | Denso Corp | Photosensor |
| JP4604301B2 (en) * | 1999-04-28 | 2011-01-05 | 株式会社デンソー | Optical sensor |
| KR100347051B1 (en) * | 2000-09-15 | 2002-08-03 | 에어로컴 (주) | A Laser Beam Receiver having Ball Lens in the Laser Transceiver |
| US6915049B2 (en) * | 2001-02-26 | 2005-07-05 | Seiko Epson Corporation | Optical module and method of manufacturing the same, and optical transmission device |
| JP2004258262A (en) * | 2003-02-25 | 2004-09-16 | Matsushita Electric Works Ltd | Optical element block for optical receptacle |
| JP2009151053A (en) * | 2007-12-20 | 2009-07-09 | Sumitomo Electric Ind Ltd | Light receiving module |
| WO2009125455A1 (en) * | 2008-04-09 | 2009-10-15 | Yazaki Corporation | Optical communication module |
| US8608390B2 (en) | 2008-04-09 | 2013-12-17 | Yazaki Corporation | Optical communication module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2941303B2 (en) | 1999-08-25 |
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