JPH0229554U - - Google Patents

Info

Publication number
JPH0229554U
JPH0229554U JP10749488U JP10749488U JPH0229554U JP H0229554 U JPH0229554 U JP H0229554U JP 10749488 U JP10749488 U JP 10749488U JP 10749488 U JP10749488 U JP 10749488U JP H0229554 U JPH0229554 U JP H0229554U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
hybrid
cutting grooves
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10749488U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10749488U priority Critical patent/JPH0229554U/ja
Publication of JPH0229554U publication Critical patent/JPH0229554U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るハイブリツドＩＣ用プリ
ント基板を示す平面図、第２図は要部を拡大して
示す平面図、第３図は他の実施例を示す平面図で
ある。 １…母材、２…プリント基板、４…ブレイク溝
、５，６…面取り用透孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. 切断用凹溝に沿つて基板母材から複数枚分断形
    成される強化繊維入りハイブリツドＩＣ用プリン
    ト基板において、前記切断用凹溝の交差部分に面
    取り用透孔を穿設したことを特徴とする強化繊維
    入りハイブリツドＩＣ用プリント基板。
JP10749488U 1988-08-15 1988-08-15 Pending JPH0229554U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10749488U JPH0229554U (ja) 1988-08-15 1988-08-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10749488U JPH0229554U (ja) 1988-08-15 1988-08-15

Publications (1)

Publication Number Publication Date
JPH0229554U true JPH0229554U (ja) 1990-02-26

Family

ID=31341960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10749488U Pending JPH0229554U (ja) 1988-08-15 1988-08-15

Country Status (1)

Country Link
JP (1) JPH0229554U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014082294A (ja) * 2012-10-16 2014-05-08 Nippon Dempa Kogyo Co Ltd ハイブリッドｉｃとリードフレーム取り付け治具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014082294A (ja) * 2012-10-16 2014-05-08 Nippon Dempa Kogyo Co Ltd ハイブリッドｉｃとリードフレーム取り付け治具

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